Copper alloy sheet strip with surface coating layer excellent in heat resistance
US-2017044651-A1 · Feb 16, 2017 · US
US2017076834A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017076834-A1 |
| Application number | US-201615363518-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 29, 2016 |
| Priority date | May 30, 2014 |
| Publication date | Mar 16, 2017 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An electrical contact material ( 10 ) having: a conductive substrate ( 1 ) formed from copper or a copper alloy; a first intermediate layer ( 2 ) provided on the conductive substrate ( 1 ); a second intermediate layer ( 3 ) provided on the first intermediate layer ( 2 ); and an outermost layer ( 4 ) formed from tin or a tin alloy and provided on the second intermediate layer ( 3 ), wherein the first intermediate layer ( 2 ) is constructed as one layer of grains extending from the conductive substrate ( 1 ) side to the second intermediate layer ( 3 ) side, and wherein, in the first intermediate layer ( 2 ), the density of grain boundaries ( 5 b ) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 μm/μm 2 or less; a method of producing the same; and a terminal.
Opening claim text (preview).
1 . An electrical contact material having: a conductive substrate formed from copper or a copper alloy; a first intermediate layer provided on the conductive substrate; a second intermediate layer provided on the first intermediate layer; and an outermost layer formed from tin or a tin alloy and provided on the second intermediate layer, wherein the first intermediate layer is constructed as one layer of grains extending from the conductive substrate side to the second intermediate layer side, and wherein, in the first intermediate layer, the density of grain boundaries extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 μm/μm 2 or less. 2 . The electrical contact material as claimed in claim 1 , wherein the first intermediate layer is formed from any of nickel, a nickel alloy, cobalt, or a cobalt alloy. 3 . The electrical contact material as claimed in claim 1 , wherein the second intermediate layer is formed from copper or a copper alloy. 4 . A method of producing the electrical contact material as claimed in claim 1 , comprising: plating the first intermediate layer on the conductive substrate at a current density of 10 A/dm 2 or higher; plating the second intermediate layer on the first intermediate layer; and plating the outermost layer on the second intermediate layer; followed by subjecting the resultant electrical contact material to a heat treatment at 100° C. to 700° C. for 30 minutes to 7 seconds. 5 . A method of producing the electrical contact material as claimed in claim 1 , comprising: plating the first intermediate layer on the conductive substrate at a current density of 5 A/dm 2 or higher; plating the second intermediate layer on the first intermediate layer; and plating the outermost layer on the second intermediate layer, followed by performing area reduction working from above the outermost layer, and subjecting the resultant electrical contact material to a heat treatment at 100° C. to 700° C. for 30 minutes to 7 seconds. 6 . The method of producing the electrical contact material as claimed in claim 5 , wherein the working ratio for the area reduction working is 30% to 70%. 7 . A method of producing the electrical contact material as claimed in claim 1 , comprising: plating the first intermediate layer on the conductive substrate at a current density of 5 A/dm 2 or higher, followed by performing area reduction working from above the first intermediate layer; plating the second intermediate layer on the first intermediate layer; and plating the outermost layer on the second intermediate layer, followed by subjecting the resultant electrical contact material to a heat treatment at 100° C. to 700° C. for 30 minutes to 7 seconds. 8 . The method of producing the electrical contact material as claimed in claim 7 , wherein the working ratio for the area reduction working is 30% to 70%. 9 . A method of producing the electrical contact material as claimed in claim 1 , comprising: plating the first intermediate layer on the conductive substrate at a current density of 5 A/dm 2 or higher; plating the second intermediate layer on the first intermediate layer, followed by performing area reduction working from above the second intermediate layer; and plating the outermost layer on the second intermediate layer, followed by subjecting the resultant electrical contact material to a heat treatment at 100° C. to 700° C. for 30 minutes to 7 seconds. 10 . The method of producing the electrical contact material as claimed in claim 9 , wherein the working ratio for the area reduction working is 30% to 70%. 11 . A terminal formed from the electrical contact material as claimed in claim 1 .
Related publications grouped by family.
Answers are generated from the same data shown on this page.