Micro channel type heat exchanger

Patent metadata

Field	Value
Publication number	US-2017074591-A1
Application number	US-201615260914-A
Country	US
Kind code	A1
Filing date	Sep 9, 2016
Priority date	Sep 11, 2015
Publication date	Mar 16, 2017
Grant date	—

Abstract

A micro channel type heat exchanger in which a first heat exchange module and a second heat exchange module are stacked, the micro channel type heat exchanger including a plurality of flat tubes disposed within the first heat exchange module and the second heat exchange module, and a heat blocking member configured to form a heat blocking space by separating the first heat exchange module and the second heat exchange module, wherein the heat blocking member forms a heat blocking space between the first heat exchange module and the second heat exchange module that minimizes heat conductivity and improves thermal exchange performance of the heat exchanger.

First claim

What is claimed is:

1 . A micro channel type heat exchanger comprising:
a first heat exchange module and a second heat exchange module that are stacked together; a plurality of flat tubes disposed inside the first heat exchange module and the second heat exchange module; and a heat blocking member that separates the first heat exchange module and the second heat exchange module and forms a heat blocking space.

2 . The micro channel type heat exchanger of claim 1 , wherein:
the heat blocking member is disposed between the first heat exchange module and the second heat exchange module, and the heat blocking space is formed between the first heat exchange module and the second heat exchange module.

3 . The micro channel type heat exchanger of claim 1 , wherein:
the heat blocking member is attached to outside surfaces of the first heat exchange module and the second heat exchange module, and the heat blocking space is formed between the first heat exchange module and the second heat exchange module.

4 . The micro channel type heat exchanger of claim 3 , wherein the heat blocking member further comprises an insertion part to support the first heat exchange module and the second heat exchange module, the insertion part being inserted between the first heat exchange module and the second heat exchange module.

5 . The micro channel type heat exchanger of claim 1 , further comprising:
a first pass disposed in some of the plurality of flat tubes that are disposed in the first heat exchange module and along which a refrigerant flows in one direction; a second pass disposed in remaining some of the plurality of flat tubes that are disposed in the first heat exchange module and along which the refrigerant supplied from the first pass flows in an opposite direction to a direction of the first pass; a third pass distributed and disposed in a remainder of the plurality of flat tubes that are disposed in the first heat exchange module other than the first pass and the second pass and in some of a plurality of flat tubes that are disposed in the second heat exchange module; and a fourth pass disposed in a remainder of the plurality of flat tubes that are disposed in the second heat exchange module and along which a refrigerant supplied from the third pass flows in an opposite direction to a direction of the third pass, wherein the third pass comprises a (3-1)-th pass disposed in the remainder of the plurality of flat tubes that are disposed in the first heat exchange module other than the first pass and the second pass and along which the refrigerant supplied from the second pass flows in an opposite direction to the direction of the second pass and a (3-2)-th pass disposed in some of the plurality of flat tubes that are disposed in the second heat exchange module and along which the refrigerant supplied from the second pass flows in the opposite direction to the direction of the second pass and flows in the same direction as the direction of the (3-1)-th pass.

6 . The micro channel type heat exchanger of claim 5 , wherein:
the first heat exchange module comprises:
a first pin that connects the flat tubes and conducts heat,
a first lower header connected to a first side of the plurality of flat tubes disposed therein, the first lower header being in communication with the first side of the plurality of flat tubes so that the refrigerant flows,
a first upper header connected to a second side of the plurality of flat tubes disposed therein, the first upper header being in communication with the second side of the plurality of flat tubes so that the refrigerant flows,
a first baffle disposed within the first lower header, the first baffle forming the first pass and the second pass by partitioning an inside of the first lower header, and
a second baffle disposed within the first upper header, the second baffle forming the second pass and the (3-1)-th pass by partitioning an inside of the second upper header, and
the second heat exchange module comprises:
a second pin that connects the flat tubes and conducts heat,
a second lower header connected to a first side of the plurality of flat tubes disposed therein, the second lower header being in communication with the first side of the plurality of flat tubes so that a refrigerant flows,
a second upper header connected to a second side of the plurality of flat tubes disposed therein, the second upper header being in communication with the second side of the plurality of flat tubes so that the refrigerant flows, and
a third baffle disposed within the second lower header, the third baffle forming the (3-2)-th pass and the fourth pass by partitioning the second lower header,
whereby the heat blocking member is disposed between the first upper header and the second upper header and/or between the first lower header and the second lower header.

7 . The micro channel type heat exchanger of claim 6 , wherein:
a first upper hole is provided in the first upper header, a second upper hole is provided in the second upper header, and the heat blocking member is disposed between the first upper hole and the second upper hole, whereby some of the refrigerant of the third pass flows in the second upper header through the first upper hole and the second upper hole.

8 . The micro channel type heat exchanger of claim 7 , wherein the heat blocking member comprises a first plate hole that connects the first upper hole and the second upper hole so that the refrigerant flows.

9 . The micro channel type heat exchanger of claim 6 , wherein:
a first lower hole is provided in the first lower header, a second lower hole is provided in the second lower header, and the heat blocking member is disposed between the first lower hole and the second lower hole, whereby some of the refrigerant of the third pass flows in the second lower header through the first lower hole and the second lower hole.

10 . The micro channel type heat exchanger of claim 9 , wherein the heat blocking member comprises a second plate hole that connects the first lower hole and the second lower hole so that the refrigerant flows.

11 . The micro channel type heat exchanger of claim 6 , wherein:
a first upper hole is provided in the first upper header, a second upper hole is formed in the second upper header, and some of the refrigerant of the third pass flows in the second upper header through the first upper hole and the second upper hole, a first lower hole is provided in the first lower header, a second lower hole is formed in the second lower header, and a remainder of the refrigerant of the third pass flows in the second lower header through the first lower hole and the second lower hole, and the heat blocking member comprises a first heat blocking member disposed between the first upper hole and the second upper hole and a second heat blocking member disposed between the first lower hole and the second lower hole.

12 . The micro channel type heat exchanger of claim 11 , wherein:
the first heat blocking member further comprises a first plate hole that connects the first upper hole and the second upper hole, and the second heat blocking member further comprises a second plate hole that connects the first lower hole and the second lower hole.

13 . The micro channel type heat exchanger of claim 6 , further comprising:
a first separation space disposed between the first pass and the second pass, a second separation space disposed between the second pass and the (3-1)-th pass, and a third separation space disposed between the (3-2)-th pass and the fourth pass.

14 . The micro channel ty

Assignees

• Lg Electronics Inc

Inventors

• Kim Beomchan
• Ryu Byoungjin
• Yang Taeman
• Chung Choonmyun

Classifications

• F28D2021/0071

  Evaporators · CPC title

• F28D1/0417

  with particular circuits for the same heat exchange medium, e.g. with the heat exchange medium flowing through sections having different heat exchange capacities or for heating/cooling the heat exchange medium at different temperatures · CPC title

• F28F2270/00

  Thermal insulation; Thermal decoupling · CPC title

• F28F1/124

  and being formed of pins · CPC title

• F28F9/0202

  Header boxes having their inner space divided by partitions · CPC title