Ultrasonic consolidation with integrated printed electronics

Patent metadata

Field	Value
Publication number	US-2017071083-A1
Application number	US-201514847620-A
Country	US
Kind code	A1
Filing date	Sep 8, 2015
Priority date	Sep 8, 2015
Publication date	Mar 9, 2017
Grant date	—

Abstract

A machine is provided and includes a machine body formed to define a single enclosed space, an ultrasonic consolidation (UC) processing element operably disposed in the single enclosed space for executing UC processing of a part within the single enclosed space and an electronics printing element operably disposed in the single enclosed space for executing electronics printing of the part within the single enclosed space.

First claim

What is claimed is:

1 . A machine, comprising:
a machine body formed to define a single enclosed space; an ultrasonic consolidation (UC) processing element operably disposed in the single enclosed space for executing UC processing of a part within the single enclosed space; and an electronics printing element operably disposed in the single enclosed space for executing electronics printing of the part within the single enclosed space.

2 . The machine according to claim 1 , wherein the machine body comprises:
a base wall within the enclosed space; and a jig on which the part is disposable, which is disposable on the base wall.

3 . The machine according to claim 1 , further comprising a controller configured to control operations of the UC processing element and the electronics printing element.

4 . The machine according to claim 1 , wherein the UC processing element and the electronics printing element are integrated into a single processing element comprising:
an arm capable of movement with multiple degrees of freedom; a UC head coupled to a distal end of the arm to execute UC processing; and an electronics printing head coupled to the distal end of the arm to execute electronics printing.

5 . The machine according to claim 4 , wherein the single processing element comprises additional head components for executing additional part processing.

6 . The machine according to claim 5 , wherein the additional head components comprise at least one or more of a pick and place component, a machining component and a printing component.

7 . The machine according to claim 1 , wherein the UC processing element comprises:
a UC arm capable of movement with multiple degrees of freedom; and a UC head coupled to a distal end of the UC arm to execute UC processing.

8 . The machine according to claim 7 , wherein the UC processing element comprises additional head components for executing additional part processing.

9 . The machine according to claim 8 , wherein the additional head components comprise at least one or more of a pick and place component, a machining component and a printing component.

10 . The machine according to claim 1 , wherein the electronics printing element comprises:
an electronics printing arm capable of movement with multiple degrees of freedom; and an electronics printing head coupled to a distal end of the electronics printing arm to execute electronics printing.

11 . The machine according to claim 10 , wherein the electronics printing element comprises additional head components for executing additional part processing.

12 . The machine according to claim 11 , wherein the additional head components comprise at least one or more of a pick and place component, a machining component and a printing component.

13 . A method of forming a part in a machine formed to define a single enclosed space, the method comprising:
executing ultrasonic consolidation (UC) processing of a part within the single enclosed space; executing electronics printing of the part within the single enclosed space; and continuously maintaining a position of the part within the enclosed space during transitions between executions of the UC processing and the electronics printing.

14 . The method according to claim 13 , wherein the executing of the UC processing and the electronics printing comprises controlling movements and operations of a single processing element.

15 . The method according to claim 14 , further comprising executing additional part processing by controlling additional movements and additional operations of the single processing element.

16 . The method according to claim 13 , wherein the executing of the UC processing comprises controlling movements and operations of a UC processing element and the executing of the electronics printing comprises controlling movements and operations of an electronics printing element.

17 . The method according to claim 15 , further comprising executing additional part processing by controlling additional movements and additional operations of at least one of the UC processing element and the electronics printing element.

18 . A method of forming a part in a machine formed to define a single enclosed space, the method comprising:
executing ultrasonic consolidation (UC) processing to assemble base and uppermost layers of the part within the single enclosed space; machining thermal channels in a first portion of the base and uppermost layers within the single enclosed space; printing dielectric and conductive electronic components on a second portion of the base and uppermost layers within the single enclosed space; and continuously maintaining a position of the part within the enclosed space during transitions between executions of the UC processing, the machining and the printing.

19 . The method according to claim 18 , wherein the printing comprises aerosol jet printing and depositional printing.

20 . The method according to claim 18 , further comprising:
picking and placing electronic components on the printed dielectric and conductive electronic components within the single enclosed space; and placing dissipating electronics directly onto integral thermal sinks within the single enclosed space.

Assignees

• Raytheon Co

Inventors

• Mayberry Travis
• Shubrooks Jeffrey A

Classifications

• H05K13/0404 Primary

  Pick-and-place heads or apparatus, e.g. with jaws · CPC title

• H05K1/0272

  Adaptations for fluid transport, e.g. channels, holes · CPC title

• H05K2201/064

  Fluid cooling, e.g. by integral pipes · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• H05K2203/0285

  Using ultrasound, e.g. for cleaning, soldering or wet treatment · CPC title