Silicon speaker

Patent metadata

Field	Value
Publication number	US-2017041717-A1
Application number	US-201415304058-A
Country	US
Kind code	A1
Filing date	Aug 26, 2014
Priority date	Aug 26, 2014
Publication date	Feb 9, 2017
Grant date	—

Abstract

The present invention provides a silicon speaker comprising an MEMS acoustoelectric chip and a PCB substrate, wherein the MEMS acoustoelectric chip comprises a corrugated diaphragm on a silicon substrate; and one side surface of the MEMS acoustoelectric chip is metalized, and the metalized side surface of the MEMS acoustoelectric chip is connected with the PCB substrate. The corrugated diaphragm is electrically conductive and interconnected with metal paths on MEMS acoustoelectric chip, which is led out to a first PCB metal path as one electrode. A second PCB metal path below the MEMS chip forms another electrode of the electrostatic actuator. The silicon speaker provided by the present invention lowers manufacturing costs of the speaker, and allows the diaphragm to generate high and repeatable/reliable sound pressure upon large displacements so as to improve the sounding effects of the speaker.

First claim

1 . A silicon speaker comprising an MEMS acoustoelectric chip and a PCB substrate, wherein
the MEMS acoustoelectric chip comprises a corrugated diaphragm on a silicon substrate; and one side surface of the MEMS acoustoelectric chip is metalized, and the metalized side surface is connected with the PCB substrate.

2 . The silicon speaker according to claim 1 , wherein metal paths are provided on the PCB substrate.

3 . The silicon speaker according to claim 1 , wherein a dielectric protrusion is provided at the center of the corrugated diaphragm.

4 . The silicon speaker according to claim 1 , wherein, the corrugated diaphragm has high-aspect-ratio corrugation for stress relief.

5 . The silicon speaker according to claim 1 , wherein the corrugated diaphragm has at least one layer of conductive material therein.

6 . The silicon speaker according to claim 1 , wherein the MEMS acoustoelectric chip is flip-chip mounted on the PCB substrate with flux-less process.

7 . The silicon speaker according to claim 1 , wherein the PCB substrate is provided with an IC driver and/or a flip-chip thereon.

8 . The silicon speaker according to claim 1 , further comprising a sealing cover which is attached onto the PCB substrate.

9 . The silicon speaker according to claim 8 , when the sealing cover and the PCB substrate form a front chamber of the silicon speaker, an opening for transmitting sounds of the silicon speaker is provided at the top of the silicon speaker or on a side surface of the silicon speaker on the sealing cover.

10 . The silicon speaker according to claim 8 , wherein at least one through hole is provided on the PCB substrate and the through hole is the opening for transmitting sounds of the silicon speaker.

11 . The silicon speaker according to claim 10 , when the sealing cover and the PCB substrate form a back chamber of the silicon speaker, the opening is provided at the bottom of the silicon speaker.

Assignees

• Goertek Inc

Inventors

• Zou Quanbo

Classifications

• H04R19/02

  Loudspeakers (H04R19/01 takes precedence) · CPC title

• H04R19/005 Primary

  using semiconductor materials · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title

• B81B2207/07

  Interconnects · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title