Cooling apparatus

Patent metadata

Field	Value
Publication number	US-2017034949-A1
Application number	US-201515303392-A
Country	US
Kind code	A1
Filing date	Jun 12, 2015
Priority date	Jun 24, 2014
Publication date	Feb 2, 2017
Grant date	—

Abstract

A cooling apparatus has: an opening formed in a cooling plate for cooling an electronic component; and an electronic component accommodating section formed in the opening. A cooling pipeline is disposed in a manner to surround an outer side surface section of the electronic component accommodating section, whereby the electronic component and the cooling pipeline are arranged at substantially the same height as a top of the cooling plate to realize a low profile. In addition, the electronic component accommodating section, which is joined to the cooling plate, is configured that a side surface section thereof is in contact with a side surface section of the electronic component via a potting material. In this way, an area that contributes to heat radiation is increased.

First claim

1 . A cooling apparatus characterized by comprising: an electronic component; a cooling plate for cooling the electronic component; an electronic component accommodating section that is attached to a periphery of an opening formed in the cooling plate and accommodates the electronic component therein; and a cooling pipeline that is disposed in a manner to surround an outer side surface section of the electronic component accommodating section and is joined to the cooling plate, in that the electronic component is arranged such that a side surface section thereof is in contact with an inner side of the electronic component accommodating section via a filler.

2 . The cooling apparatus according to claim 1 wherein the electronic component accommodating section is configured to surround the side surface section and a bottom surface section of the electronic component and close the opening of the cooling plate.

3 . The cooling apparatus according to claim 1 wherein the electronic component accommodating section is constructed of a cylindrical member that surrounds the side surface section of the electronic component.

4 . The cooling apparatus according to claim 1 , wherein the cooling pipeline is joined to the outer side surface section of the electronic component accommodating section.

5 . The cooling apparatus according to claim 1 , wherein the cooling plate and the electronic component accommodating section have an integrated structure.

6 . The cooling apparatus according to claim 1 , wherein a joined section between the cooling plate and the electronic component accommodating section is formed in a shape that is along an outer side surface section of the cooling pipeline.

7 . The cooling apparatus according to claim 1 , wherein the cooling pipeline is constructed of a flat pipe.

8 . The cooling apparatus according to claim 1 , wherein the cooling pipeline is constructed of a rectangular pipe.

9 . The cooling apparatus according to claim 1 , wherein the cooling pipeline is constructed of: a metal plate that is adhered to the cooling plate and forms a flow path of a cooling medium; and couplers that are joined to ends of the flow path.

10 . The cooling apparatus according to claim 1 , wherein the electronic component in a state of being mounted on a base plate is arranged in the electronic component accommodating section, and the base plate is joined to the cooling plate.

11 . The cooling apparatus according to claim 3 wherein the cooling pipeline is constructed of: a metal plate that is adhered to the cooling plate and forms a flow path of a cooling medium; and couplers that are joined to ends of the flow path, that the electronic component in a state of being mounted on a base plate is arranged in the electronic component accommodating section, and the base plate is joined to the cooling plate, and that elements for constituting thickness of the cooling apparatus are the base plate, the electronic component, the filler, and the metal plate.

Assignees

• Mitsubishi Electric Corp
• Mitsubishi Electric Corp

Inventors

• Yokoi Masahiro
• Deguchi Yoshiyuki
• Kodama Katsuhisa
• Nakanishi Yusuke

Classifications

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title