On the fly automatic wafer centering method and apparatus

Patent metadata

Field	Value
Publication number	US-2017018446-A1
Application number	US-201615209497-A
Country	US
Kind code	A1
Filing date	Jul 13, 2016
Priority date	Jul 13, 2015
Publication date	Jan 19, 2017
Grant date	—

Abstract

Substrate processing apparatus including a wafer transport apparatus with a transport arm including an end effector, an arm pose deterministic feature integral to the substrate transport apparatus and disposed so that a static detection sensor of the substrate processing apparatus detects at least one edge of the at least one arm pose deterministic feature on the fly with radial motion of the transport arm, and a controller configured so that detection of the edge effects a determination of a proportion factor identifying at least a thermal expansion variance of the transport arm on the fly and includes a kinematic effects resolver configured to determine, from the detection of the edge on the fly, a discrete relation between the determined proportion factor and each different discrete variance respective to each different link of the transport arm determining at least the thermal expansion variance of the transport arm on the fly.

First claim

1 . A substrate processing apparatus comprising:
a substrate transport apparatus with a transport arm including an end effector having a reference feature with a predetermined center, the end effector being configured to hold a wafer and transport the wafer within the substrate processing apparatus based on the predetermined center; at least one arm pose deterministic feature integral to the substrate transport apparatus and disposed so that a static detection sensor of the substrate processing apparatus detects at least one edge of the at least one arm pose deterministic feature on the fly with a radial motion of the transport arm; and a controller communicably coupled to the substrate transport apparatus, the controller being configured so that detection of the at least one edge effects a determination of a proportion factor identifying a variance of the transport arm on the fly with the radial motion of the transport arm; wherein the controller includes a kinematic effects resolver configured to determine, from the detection of the at least one edge, by the static detection sensor, on the fly with the radial motion of the transport arm, a discrete relation between the determined proportion factor and each different discrete variance respective to each different link of the transport arm determining the variance of the transport arm on the fly with the radial motion of the transport arm.

2 . The substrate processing apparatus of claim 1 , wherein the kinematic effects resolver is configured so as to effect discrimination between each different discrete variance, respective to each different link, in the determined relation with determined proportion factor.

3 . The substrate processing apparatus of claim 1 , wherein the kinematic effects resolver is configured so as to effect discrimination between each different discrete variance based on the detection of the at least one edge.

4 . The substrate processing apparatus of claim 1 , wherein the kinematic effects resolver is configured to determine, from the detection of the at least one edge, by the static detection sensor, on the fly with the radial motion of the transport arm, a contribution of non-linear kinematic effect, of the different discrete variance respective to each different link of the transport arm, determining the variance of the arm on the fly with the radial motion of the transport arm.

5 . The substrate processing apparatus of claim 4 , wherein the kinematic effects resolver is configured so as to effect discrimination between different contributing non-linear kinematic effects, respective to each different link or different pulley of the transport arm, in the determined contribution of non-linear kinematic effect determining the variance of the arm.

6 . The substrate processing apparatus of claim 4 , wherein the kinematic effects resolver is configured so as to effect discrimination between different contributing non-linear kinematic effects, of at least one different link or different pulley of the transport arm, in the determined contribution of non-linear kinematic effect determining the variance of the arm.

7 . The substrate processing system of claim 1 , wherein the kinematic effects resolver is configured so as to effect discrimination between different contributing non-linear kinematic effects based on the detection of the at least one edge.

8 . The substrate processing system of claim 1 , wherein the at least one arm pose deterministic feature has a configuration deterministic so as to effect discrimination between each different discrete variance respective to each different link, in the determined relation with the determined proportion factor.

9 . The substrate processing system of claim 1 , wherein the at least one pose deterministic feature is configured so as to effect discrimination between each different discrete variance respective to each different link of the transport arm with but one on the fly transport arm radial motion pass of the at least one edge by the static detection sensor so that the static detection sensor detects the at least one edge on the fly.

10 . The substrate processing system of claim 1 , wherein the transport arm is a 3 link SCARA arm and the at least one pose deterministic feature is configured so as to effect discrimination between each different discrete variance, respective to each different link of the 3 link SCARA arm.

11 . The substrate processing system of claim 1 , wherein the end effector is a self-centering end effector with a wafer holding station having a predetermined center, the end effector being configured to hold the wafer at the wafer holding station and transport the wafer within the substrate processing apparatus.

12 . The substrate processing system of claim 11 , wherein the least one arm pose deterministic feature comprises at least one center deterministic feature effecting determination of the predetermined center of the wafer holding station on the end effector with but one pass of the at least one center deterministic feature by the static detection sensor.

13 . The substrate processing system of claim 12 , wherein the at least one center deterministic feature is unobstructed by the wafer held by the end effector and is disposed so that the static detection sensor detects the at least one center deterministic feature on the fly with the substrate transport apparatus in motion, the detection of the at least one center deterministic feature effecting determination of the predetermined center of the wafer holding station on the end effector with but one pass of the at least one center deterministic feature by the static detection sensor.

14 . The substrate processing system of claim 11 , wherein the controller is configured to effect determination of, based on the detection of the at least one edge, the predetermined center of the wafer holding station substantially simultaneously with the determination of the variance of the transport arm on the fly with the radial motion of the transport arm.

15 . The substrate processing system of claim 1 , wherein the transport arm includes an upper arm link, a forearm link and more than one end effector commonly dependent from the upper arm link and forearm link so that the upper arm link and the forearm link are common to each of the more than one end effector.

16 . The substrate processing system of claim 15 , wherein at least one of the more than one commonly dependent end effector, has an independent degree of freedom so that the at least one of the commonly dependent end effector is independently movable, with respect to the common upper arm link and forearm link, and has a corresponding arm pose deterministic feature, different from another arm pose deterministic feature corresponding to another of the more than one commonly dependent end effector, so that variance of the transport arm respective to the at least one independently movable end effector is determined separately, from the variance of the transport arm respective to the other of the more than one commonly dependent end effector, based on sensing of the at least one edge of the corresponding arm pose deterministic feature of the at least one independently movable end effector by the static detection sensor.

17 . The substrate processing system of claim 1 , wherein the transport arm is a SCARA arm.

18 . The substrate processing system of claim 1 , wherein the controller is configured to position the transport arm and the reference feature of the end effector compensating for the determined variance of the transport arm.

Assignees

• Brooks Automation Inc

Inventors

• Yin Bing
• Moura Jairo T
• Tsang Vincent
• Gawlik Aaron
• Spiker Nathan

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/50 Primary

  for positioning, orientation or alignment · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H01L21/68785

  Electricity · mapped topic