Photosensitive resin composition, lithographic printing plate precursor, and method for producing lithographic printing plate

Patent metadata

Field	Value
Publication number	US-2017017154-A1
Application number	US-201615278715-A
Country	US
Kind code	A1
Filing date	Sep 28, 2016
Priority date	Mar 31, 2014
Publication date	Jan 19, 2017
Grant date	—

Abstract

There is provided a photosensitive resin composition which enables production of a lithographic printing plate precursor having a non-image portion which has good solubility in an alkali aqueous solution and which enables production of a lithographic printing plate having excellent printing durability, excellent chemical resistance, and, in particular, excellent printing durability at the time of using a low quality print material, a lithographic printing plate precursor obtained by using the photosensitive resin composition, and a method for producing a lithographic printing plate.
The photosensitive resin composition contains a polymer compound having a linking group represented by Formula A-1 in the main chain; and an infrared absorbing material. In Formula A-1, R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, and X 1 is a specific linking group.

First claim

What is claimed is:

1 . A photosensitive resin composition, comprising:
a polymer compound having a linking group represented by Formula A-1 in a main chain; and an infrared absorbing material,

wherein in Formula A-1, R 1 and R 2 each independently represent a hydrogen atom or a monovalent organic group, and X 1 represents a linking group represented by any one of the following Formulas A-2 to A-6, and

in Formulas A-2 to A-6, R 3 represents a halogen atom or a monovalent organic group, a2i represents an integer of 1 to 4, a2j represents an integer of 0 to 3, a2i+a2j is 1 to 4, R 4 and R 5 each independently represent a halogen atom or a monovalent organic group, a3i and a3j each independently represent an integer of 0 to 2, a3k and a3l each independently represent an integer of 0 to 4, a3i+a3k is 1 to 6, a3j+a3l is 0 to 6−(a3i+a3k), R 6 and R 7 each independently represent a halogen atom or a monovalent organic group, a4i and a4k each independently represent an integer of 0 to 2, a4i+a4k is 1 to 4, a4j and a4l each independently represent an integer of 0 to 2, a4j+a4l is 0 to 4−(a4i+a4k), Y A1 represents an aromatic hydrocarbon ring or an aliphatic hydrocarbon ring, R 8 and R 9 each independently represent a halogen atom or a monovalent organic group, a5i and a5k each independently represent an integer of 0 to 3, a5i+a5k is 1 to 6, a5j and a5l each independently represent an integer of 0 to 3, a5j+a5l is 0 to 6−(a5i+a5k), R 10 and R 11 each independently represent a halogen atom or a monovalent organic group, a6k represents an integer of 0 to 2, a6i represents an integer of 0 to 3, a6i+a6k is 1 to 5, a6l represents an integer of 0 to 2, a6j represents an integer of 0 to 3, a6l+a6j is 0 to 5−(a6i+a6k), and Y A2 represents an aromatic hydrocarbon ring or an aliphatic hydrocarbon ring.

2 . The photosensitive resin composition according to claim 1 ,
wherein the polymer compound includes a linking group represented by the following Formula A-7 in the main chain, and

in Formula A-7, R 12 represents a single bond or a divalent linking group, R 13 and R 14 each independently represent a hydrogen atom or a monovalent organic group, and X 2 and X 3 each independently represent a linking group represented by any one of Formulas A-2 to A-6.

3 . The photosensitive resin composition according to claim 2 ,
wherein the linking group represented by Formula A-7 is a linking group represented by the following Formula A-8, and

in Formula A-8, R 15 represents a single bond or a divalent linking group, R 16 and R 17 each independently represent a halogen atom or a monovalent organic group, R 18 and R 19 each independently represent a hydrogen atom or a monovalent organic group, a, b, c and d each independently represent an integer of 0 to 4, a+b is 1 to 8, and c+d is 0 to 8−(a+b).

4 . The photosensitive resin composition according to claim 1 ,
wherein the polymer compound further has a linking group represented by the following Formula A-9 in the main chain, and

in Formula A-9, R A9 represents a hydrogen atom or a monovalent organic group.

5 . The photosensitive resin composition according to claim 2 ,
wherein the polymer compound further has a linking group represented by the following Formula A-9 in the main chain, and

in Formula A-9, R A9 represents a hydrogen atom or a monovalent organic group.

6 . The photosensitive resin composition according to claim 3 ,
wherein the polymer compound further has a linking group represented by the following Formula A-9 in the main chain, and

in Formula A-9, R A9 represents a hydrogen atom or a monovalent organic group.

7 . The photosensitive resin composition according to claim 1 ,
wherein the polymer compound has a linking group represented by the following Formula B-1 or B-2 in the main chain, and

in Formula B-1 and B-2, L 1 represents a single bond or a divalent linking group, and R B21 represents a hydrogen atom or a monovalent organic group.

8 . The photosensitive resin composition according to claim 4 ,
wherein the polymer compound has a linking group represented by the following Formula B-1 or B-2 in the main chain, and

in Formula B-1 and B-2, L 1 represents a single bond or a divalent linking group, and R B21 represents a hydrogen atom or a monovalent organic group.

9 . The photosensitive resin composition according to claim 5 ,
wherein the polymer compound has a linking group represented by the following Formula B-1 or B-2 in the main chain, and

in Formula B-1 and B-2, L 1 represents a single bond or a divalent linking group, and R B21 represents a hydrogen atom or a monovalent organic group.

10 . The photosensitive resin composition according to claim 6 ,
wherein the polymer compound has a linking group represented by the following Formula B-1 or B-2 in the main chain, and

in Formula B-1 and B-2, L 1 represents a single bond or a divalent linking group, and R B21 represents a hydrogen atom or a monovalent organic group.

11 . The photosensitive resin composition according to claim 1 ,
wherein the polymer compound further has at least one selected from the group consisting of linking groups represented by each of the following Formulas B-3 to B-7 in the main chain, and

in Formulas B-3 to B-7, R B31 , R B51 , R 61 , and R B71 each independently represent a single bond or a divalent linking group, R B72 represents a hydrogen atom or a monovalent organic group, and Y 1 to Y 5 each independently represent an aromatic hydrocarbon ring or an aliphatic hydrocarbon ring.

12 . The photosensitive resin composition according to claim 4 ,
wherein the polymer compound further has at least one selected from the group consisting of linking groups represented by each of the following Formulas B-3 to B-7 in the main chain, and

in Formulas B-3 to B-7, R B31 , R B51 , R B61 , and R B71 each independently represent a single bond or a divalent linking group, R B72 represents a hydrogen atom or a monovalent organic group, and Y 1 to Y 5 each independently represent an aromatic hydrocarbon ring or an aliphatic hydrocarbon ring.

13 . The photosensitive resin composition according to claim 5 ,
wherein the polymer compound furthe

Assignees

• Fujifilm Corp

Inventors

• MUKAIYAMA Rena
• Nozaki Atsuyasu
• Sato Takashi
• Asano Kotaro

Classifications

• G03F7/0392 Primary

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/095

  having more than one photosensitive layer (G03F7/075 takes precedence) · CPC title

• C08G18/757

  containing at least two isocyanate or isothiocyanate groups linked to the cycloaliphatic ring by means of an aliphatic group · CPC title

• C08G18/7642

  containing at least two isocyanate or isothiocyanate groups linked to the aromatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate groups, e.g. xylylene diisocyanate or homologues substituted on the aromatic ring · CPC title

• B41C1/1008

  by removal or destruction of lithographic material on the lithographic support, e.g. by laser or spark ablation; by the use of materials rendered soluble or insoluble by heat exposure, e.g. by heat produced from a light to heat transforming system; by on-the-press exposure or on-the-press development, e.g. by the fountain of photolithographic materials · CPC title