Image sensor having conversion device isolation layer disposed in photoelectric conversion device

Patent metadata

Field	Value
Publication number	US-2017012066-A1
Application number	US-201615090989-A
Country	US
Kind code	A1
Filing date	Apr 5, 2016
Priority date	Jul 8, 2015
Publication date	Jan 12, 2017
Grant date	—

Abstract

An image sensor includes a first conductivity type first impurity region surrounded by a pixel isolation layer surrounds; a first conversion device isolation layer intersecting the first impurity region in a first direction; a second conductivity type second impurity region disposed on a first side surface of the first conversion device isolation layer; a second conductivity type third impurity region disposed on a second side surface of the first conversion device isolation layer opposite the first side surface; and a second conversion device isolation layer intersecting the first impurity region in a second direction perpendicular to the first direction. The second impurity region and the third impurity region are disposed inside the first impurity region.

First claim

What is claimed is:

1 . An image sensor comprising:
a first conductivity type first impurity region surrounded by a pixel isolation layer; a first conversion device isolation layer intersecting the first impurity region in a first direction, the first conversion device isolation layer including a first side surface and a second side surface opposite the first side surface; a second conductivity type second impurity region disposed inside the first impurity region and disposed on the first side surface of the first conversion device isolation layer; a second conductivity type third impurity region disposed inside the first impurity region and disposed on the second side surface of the first conversion device isolation layer; and a second conversion device isolation layer intersecting the first impurity region in a second direction perpendicular to the first direction.

2 . The image sensor of claim 1 , wherein the first conversion device isolation layer bisects the first impurity region in the second direction and the second conversion device isolation layer bisects the first impurity region in the first direction.

3 . The image sensor of claim 1 , wherein the first conversion device isolation layer and the second conversion device isolation layer include an insulating material.

4 . The image sensor of claim 3 , wherein the second conversion device isolation layer includes a same material as the first conversion device isolation layer.

5 . The image sensor of claim 1 , wherein a horizontal width of the second conversion device isolation layer is equal to a horizontal width of the first conversion device isolation layer.

6 . The image sensor of claim 5 , wherein a horizontal width of the first conversion device isolation layer is equal to a horizontal width of the pixel isolation layer.

7 . An image sensor comprising:
a substrate including a pixel region; a first conductivity type first impurity region disposed on the substrate, the first impurity region vertically overlapping the pixel region; a second conductivity type second impurity region extending in a first direction inside the first impurity region; a second conductivity type third impurity region extending in the first direction inside the first impurity region, the third impurity region separated from the second impurity region in a second direction perpendicular to the first direction; a first conversion device isolation layer intersecting the first impurity region in the first direction between the second impurity region and the third impurity region; and a second conversion device isolation layer intersecting the first impurity region in the second direction.

8 . The image sensor of claim 7 , wherein a level of an upper surface of the first conversion device isolation layer and a level of an upper surface of the second conversion device isolation layer is equal to a level of an upper surface of the first impurity region.

9 . The image sensor of claim 7 , wherein a lowermost end of the second conversion device isolation layer is higher than an uppermost end of the second impurity region and an uppermost end of the third impurity region.

10 . The image sensor of claim 9 , wherein a level of the uppermost end of the third impurity region is equal to a level of the uppermost end of the second impurity region.

11 . The image sensor of claim 9 , wherein a lowermost end of the first conversion device isolation layer is lower than the lowermost end of the second conversion device isolation layer.

12 . The image sensor of claim 11 , wherein a vertical length of the first conversion device isolation layer is equal to a vertical length of the first impurity region.

13 . The image sensor of claim 7 , further comprising:
a pixel isolation layer disposed on the substrate and vertically overlapping a boundary of the pixel region, wherein a horizontal width of the second conversion device isolation layer is less than a horizontal width of the pixel isolation layer.

14 . The image sensor of claim 13 , wherein a horizontal width of the first conversion device isolation layer is equal to a horizontal width of the pixel isolation layer.

15 . The image sensor of claim 7 , further comprising:
a microlens disposed on the first impurity region and vertically overlapping the pixel region.

16 . An image sensor comprising:
a substrate including pixel regions; photoelectric conversion devices disposed on the pixel regions of the substrate; and a conversion device isolation layer intersecting the photoelectric conversion devices in a cross-type, wherein the conversion device isolation layer includes an insulating material.

17 . The image sensor of claim 16 , further comprising:
a pixel isolation layer vertically overlapping boundaries between the pixel regions and surrounding the photoelectric conversion devices, wherein a vertical length of the conversion device isolation layer is less than a vertical length of the pixel isolation layer.

18 . The image sensor of claim 17 , wherein the conversion device isolation layer includes a first conversion device isolation layer extending in a first direction and a second conversion device isolation layer extending in a second direction perpendicular to the first direction,
wherein a vertical length of the second conversion device isolation layer is different from a vertical length of the first conversion device isolation layer.

19 . The image sensor of claim 16 , further comprising:
a pixel isolation layer vertically overlapping boundaries between the pixel regions and surrounding the photoelectric conversion devices, wherein a horizontal width of the conversion device isolation layer is less than a horizontal width of the pixel isolation layer.

20 . The image sensor of claim 19 , wherein the conversion device isolation layer includes a first conversion device isolation layer extending in a first direction and a second conversion device isolation layer extending in a second direction perpendicular to the first direction,
wherein a horizontal width of the second conversion device isolation layer is equal to a horizontal width of the first conversion device isolation layer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Choi Hyuksoon
• Ahn Jungchak
• An Hyuk
• Lee Kyungho

Classifications

• H01L27/14636

  Electricity · mapped topic

• H01L27/14645

  Electricity · mapped topic

• H01L27/1463 Primary

  Electricity · mapped topic

• H10F39/8063

  Microlenses · CPC title

• H10F39/8053

  Colour filters · CPC title