Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
US2016380158A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016380158-A1 |
| Application number | US-201514749569-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 24, 2015 |
| Priority date | Jun 24, 2015 |
| Publication date | Dec 29, 2016 |
| Grant date | — |
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Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
Opening claim text (preview).
1 . A light emitting device comprising: a substrate having a recess; an interlayer dielectric layer being located on the substrate, and having a first hole and a second hole, the first hole opening over the recess of the substrate; a first micro light emitting device and a second micro light emitting device, the first micro light emitting device having a thickness greater than the second micro light emitting device and being placed in the first hole; and the second micro light emitting device being located in the second hole. 2 . The light emitting device of claim 1 , wherein an upper surface of the interlayer dielectric layer, an upper surface of the first micro light emitting device, and an upper surface of the second micro light emitting device are substantially level. 3 . The light emitting device of claim 1 , further comprising: a third hole in the interlayer dielectric layer having a different size from the second hole; and a third micro light emitting device having a different size from the second micro light emitting device and being located in the third hole. 4 . The light emitting device of claim 3 , wherein the second hole and the second micro light emitting device are at least 1.2 times larger than the third hole and the third micro light emitting device, respectively. 5 . The light emitting device of claim 3 , wherein the first hole, the second hole, and the third hole have different sizes, and the first micro light emitting device, the second micro light emitting device, and the third micro light emitting device have different sizes. 6 . The light emitting device of claim 5 , wherein the first, second, and third micro light emitting devices are configured to emit red, green, and blue light, respectively, and wherein the thickness of the first micro light emitting device is greater than the thicknesses of the second and third micro light emitting devices, respectively. 7 . The light emitting device of claim 6 , wherein an area of the upper surface of the first micro light emitting device is larger than an area of the upper surface of the second micro light emitting device, and which in turn is larger than an area of the upper surface of the third micro light emitting device. 8 . The light emitting device of claim 6 , further comprising: a fourth hole in the interlayer dielectric layer; and a fourth micro light emitting device being located in the fourth hole, which is configured to emit blue light. 9 . The light emitting device of claim 1 , wherein a depth of the recess in the substrate is substantially equal to a thickness of the interlayer dielectric layer. 10 . The light emitting device of claim 1 , further comprising: the substrate having a first through hole formed at a bottom of the recess and opening to communicate with the corresponding hole first hole opening over the recess of the substrate, and having a second through hole formed at a bottom of the second hole that is not positioned over the recess. 11 . The light emitting device of claim 1 , wherein a shape of the light emitting device is a disc-shape with an area of a lighting surface larger than an electrode surface, or a polygon-shape with an area of a lighting surface larger than an electrode surface. 12 . The light emitting device of claim 1 , wherein the recess of the substrate has a tapered-shape. 13 . The light emitting device of claim 1 , wherein the first and second holes are slightly larger than the corresponding first and second micro light emitting devices, respectively. 14 - 20 . (canceled)
comprising holes having chips therein · CPC title
batch processes · CPC title
Package configurations · CPC title
Soldering or alloying · CPC title
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
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