Semiconductor device and fabricating method thereof
US-2015187783-A1 · Jul 2, 2015 · US
US2016379941A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016379941-A1 |
| Application number | US-201615258069-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 7, 2016 |
| Priority date | Feb 27, 2015 |
| Publication date | Dec 29, 2016 |
| Grant date | — |
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A memory device that includes a plurality of ROM cells each having spaced apart source and drain regions formed in a substrate with a channel region therebetween, a first gate disposed over and insulated from a first portion of the channel region, a second gate disposed over and insulated from a second portion of the channel region, and a conductive line extending over the plurality of ROM cells. The conductive line is electrically coupled to the drain regions of a first subgroup of the ROM cells, and is not electrically coupled to the drain regions of a second subgroup of the ROM cells. Alternately, a first subgroup of the ROM cells each includes a higher voltage threshold implant region in the channel region, whereas a second subgroup of the ROM cells each lack any higher voltage threshold implant region in the channel region.
Opening claim text (preview).
What is claimed is: 1 . A memory device, comprising: a semiconductor substrate; a plurality of ROM cells, wherein each of the ROM cells comprises: spaced apart source and drain regions formed in the substrate, with a channel region therebetween, a first gate disposed over and insulated from a first portion of the channel region, a second gate disposed over and insulated from a second portion of the channel region, a conductive line extending over the plurality of ROM cells, wherein the conductive line is electrically coupled to the drain regions of a first subgroup of the plurality of ROM cells, and is not electrically coupled to the drain regions of a second subgroup of the plurality of ROM cells; and a plurality of NVM cells, wherein each of the NVM cells comprises: spaced apart second source and second drain regions formed in the substrate, with a second channel region therebetween, a floating gate disposed over and insulated from a first portion of the second channel region, a select gate disposed over and insulated from a second portion of the channel region. 2 . The memory device of claim 1 , wherein each of the NVM cells further comprises: a control gate disposed over and insulated from the floating gate; and an erase gate disposed over and insulated from the second source region. 3 . The memory device of claim 1 , wherein each of the drain regions of the first subgroup of the plurality of ROM cells are electrically coupled to the conductive line by a conductive contact extending from the drain region to the conductive line. 4 . The memory device of claim 3 , wherein each of the second subgroup of the plurality of ROM cells lack any conductive contact extending from the drain region. 5 . The memory device of claim 1 , further comprising: a plurality of dummy gates disposed over and insulated from the substrate, wherein each of the dummy gates is disposed between two of the drain regions. 6 . The memory device of claim 1 , wherein each of the ROM cells further comprises: a third gate disposed over and insulated from the first gate. 7 . The memory device of claim 1 , wherein each of the ROM cells further comprises: a third gate disposed over and electrically coupled to the first gate. 8 . The memory device of claim 3 , wherein each of the second subgroup of the plurality of ROM cells further comprises: a layer of insulation material disposed on the drain region; and a conductive contact extending between the layer of insulation material and the conductive line.
protecting against tampering, e.g. unauthorised inspection or reverse engineering · CPC title
having at least one additional gate other than the floating gate and the control gate, e.g. program gate, erase gate or select gate · CPC title
having only two programming levels (Floating gate IGFETs programmable by two single electrons H10D30/688) · CPC title
Floating-gate IGFETs · CPC title
Electricity · mapped topic
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