Information Handling System Ceramic Chassis

Patent metadata

Field	Value
Publication number	US-2016378144-A1
Application number	US-201615250224-A
Country	US
Kind code	A1
Filing date	Aug 29, 2016
Priority date	Nov 7, 2012
Publication date	Dec 29, 2016
Grant date	—

Abstract

An information handling system chassis is built at least in part from ceramic elements. For example, a transparent aluminum oxide ceramic portion covers a touchscreen to provide a rigid outer surface for accepting end user inputs. As another example, a ceramic chassis element has a ceramic material formed around a metal material of similar substance with bonding of the ceramic to the underlying material enhanced with oxidation of the outer surface of the metal material.

First claim

1 - 9 . (canceled)

10 . An information handling system comprising:
a chassis having a ceramic chassis element, the ceramic chassis element having first and second layers shaped to support information handling system components, the first layer more ductile than the second layer; a processor disposed in the chassis; and memory disposed in the chassis and interfaced with the processor; wherein the processor and memory cooperate to process information.

11 . The information handling system of claim 10 further comprising a display wherein the ceramic chassis element comprises a transparent ceramic portion disposed over the display.

12 . The information handling system of claim 11 wherein the transparent ceramic portion comprises an oxide with a grain size of less than 1 micrometer.

13 . The information handling system of claim 12 wherein the transparent ceramic portion comprises Al 2 O 3 with a grain size of less than one micrometer.

14 . The information handling system of claim 10 wherein the first layer comprises a metal and the second layer comprises a ceramic having the metal, the ceramic at least partially enclosing the metal.

15 . A method for forming an information handling system chassis element, the method comprising:
mixing a ceramic material with an organic material to form an injection molding feedstock; injection molding the feed stock into a tool to form a ceramic chassis element; inserting a coupling device into the ceramic chassis element; sintering the ceramic chassis element and coupling device to densify the coupling device to integrate with the ceramic chassis element; and coupling an information handling system component to the coupling device.

16 . The method of claim 15 wherein the information handling system component comprises a motherboard.

17 . The method of claim 15 wherein the information handling system component comprises a display.

18 . The method of claim 15 wherein the ceramic material comprises alumina and the coupling device comprise a material having substantially the same coefficient of thermal expansion as alumina.

19 . The method of claim 18 wherein the coupling device material comprises niobium.

20 . The method of claim 18 wherein the coupling device material comprises a niobium alloy.

21 . The method of claim 20 wherein the niobium alloy comprises niobium content of less than 50% by weight.

22 . A method for forming a chassis element, the method comprising;
disposing a metal structure between first and second ceramic materials; and sintering the first and second ceramic materials to form a plate having a first ceramic layer and a second ceramic layer enclosing the metal structure; wherein the first and second ceramic layers have first and second ductility different from each other.

23 . The method of claim 22 wherein metal structure comprises a planar metal form having a thickness less than a thickness of the first ceramic layer and a thickness of the second ceramic layer.

24 . The method of claim 22 wherein the planar metal form comprises one or metals having a stiffness modulas of greater than 20 GPa.

25 . The method of claim 15 wherein inserting a coupling device into the ceramic chassis element further comprises:
inserting the coupling device into the tool before injection molding the feed stock; and
injection molding the feed stock around at least a portion of the coupling device.

26 . The method of claim 25 wherein the coupling device comprises a metal plate.

27 . The method of claim 26 wherein the metal comprises titanium and the feed stock comprises aluminum titanate.

28 . The method of claim 26 wherein the metal plate comprises a plate formed to create a hinge portion and the feed stock is injection molded over both an upper and lower surface of the hinge portion.

29 . The method of claim 26 wherein the metal plate is disposed in a diagonal orientation relative to the injection mold.

Assignees

• Dell Products Lp

Inventors

• Abbatiello Nicholas D
• Aurongzeb Deeder M

Classifications

• G06F1/1656 Primary

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• B29C70/882

  partly or totally electrically conductive, e.g. for EMI shielding (conductive floors or floor coverings H05F3/025; EMI shielding in general H05K9/00) · CPC title

• B29C2071/022

  Annealing · CPC title

• Y10T29/49158

  with molding of insulated base · CPC title

• B29L2031/3481

  Housings or casings incorporating or embedding electric or electronic elements · CPC title