Mechanically embedded heating element

Patent metadata

Field	Value
Publication number	US-2016378140-A1
Application number	US-201514752695-A
Country	US
Kind code	A1
Filing date	Jun 26, 2015
Priority date	Jun 26, 2015
Publication date	Dec 29, 2016
Grant date	—

Abstract

Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.

First claim

1 . An apparatus comprising:
a heating element thermally coupled to an adhesive, wherein the adhesive is to bond a first portion of a computing device and a second portion of the computing device, wherein the heating element is capable to be heated in response to application of power, wherein the heated heating element is to cause release of a bond by the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device.

2 . The apparatus of claim 1 , wherein the application of power is to be provided through one or more of: application of electrical voltage, application of electric current, or application of electromagnetic energy.

3 . The apparatus of claim 1 , wherein the heating element is to be accessible through a latch or an opening.

4 . The apparatus of claim 3 , wherein the opening is an existing port of the computing device.

5 . The apparatus of claim 4 , wherein the existing port is selected from a group comprising: a USB (Universal Serial Bus) port, an audio port, a SIM (Subscriber Identity Module) port, or an HDMI (High Definition Multimedia Interface) port.

6 . The apparatus of claim 1 , wherein the heating element is to be constructed of material selected from a group comprising one or more of: Nickel Chromium alloy, Copper Nickel alloy, Iron-Chromium-Aluminum alloy, and/or combinations thereof.

7 . The apparatus of claim 1 , wherein the heating element is to comprise a single strand cable or a multi-strand cable.

8 . The apparatus of claim 7 , wherein the multi-strand cable is to be constructed with a plurality of cable material.

9 . The apparatus of claim 1 , wherein the heating element is capable of sustaining a sufficient amount of heat or temperature for a sufficient duration to release the bond by the adhesive.

10 . The apparatus of claim 1 , wherein the first portion of the computing device is to comprise a display device or a display device cover glass.

11 . The apparatus of claim 10 , wherein the display device is to comprise a flat panel display.

12 . The apparatus of claim 1 , wherein the second portion of the computing device is to comprise a device chassis of the computing device or an outer cover of the computing device.

13 . The apparatus of claim 1 , wherein the computing device is to comprise a mobile computing device.

14 . The apparatus of claim 13 , wherein the mobile computing device is to comprise one or more of: a System On Chip (SOC) device; a processor, having one or more processor cores; a flat panel display device, and memory.

15 . The apparatus of claim 14 , wherein the mobile computing device is to comprise one of: a smartphone, tablet, UMPC (Ultra-Mobile Personal Computer), laptop computer, Ultrabook™ computing device, and a wearable device.

16 . The apparatus of claim 15 , wherein the wearable device is to comprise one of a smart watch, smart glasses, or a smart bracelet.

17 . A computing system comprising:
a processor having one or more processor cores; a flat panel display device coupled to the processor; a heating element thermally coupled to an adhesive, wherein the adhesive is to bond a cover glass of the flat panel display device to an outer cover, wherein the heating element is capable to be heated in response to application of power, wherein the heated heating element is to cause release of a bond by the adhesive to allow for physical separation of the cover glass and outer cover.

18 . The system of claim 17 , wherein the application of power is to be provided through one or more of: application of electrical voltage, application of electric current, or application of electromagnetic energy.

19 . The system of claim 17 , wherein the heating element is to be accessible through a latch or an opening.

20 . The system of claim 19 , wherein the opening is an existing port.

21 . The system of claim 20 , wherein the existing port is selected from a group comprising: a USB (Universal Serial Bus) port, an audio port, a SIM (Subscriber Identity Module) port, or an HDMI (High Definition Multimedia Interface) port.

22 . The system of claim 17 , wherein the heating element is to be constructed of material selected from a group comprising one or more of: Nickel Chromium alloy, Copper Nickel alloy, Iron-Chromium-Aluminum alloy, and/or combinations thereof.

23 . The system of claim 17 , wherein the heating element is to comprise a single strand cable or a multi-strand cable.

24 . The system of claim 17 , wherein the heating element is capable of sustaining a sufficient amount of heat or temperature for a sufficient duration to release the bond by the adhesive.

25 . The system of claim 17 , further comprising memory to be accessible by the processor, wherein the flat panel display device is to display one or more images corresponding to at least some data stored in the memory.

Assignees

• Intel Corp

Inventors

• Bergmann Remi
• Nokkonen Erkki
• Paavola Juha
• Luoma Hannu
• Vallius Kari

Classifications

• H05B3/86

  the heating conductors being embedded in the transparent or reflecting material {(H05B3/845 takes precedence)} · CPC title

• G06F1/1637 Primary

  Details related to the display arrangement, including those related to the mounting of the display in the housing · CPC title

• H05B3/0014 Primary

  Devices wherein the heating current flows through particular resistances · CPC title

• B32B7/12 Primary

  using interposed adhesives or interposed materials with bonding properties · CPC title

• G06F15/7807

  System on chip, i.e. computer system on a single chip; System in package, i.e. computer system on one or more chips in a single package · CPC title