Dual mode chamber for processing wafer-shaped articles

US2016376702A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016376702-A1
Application numberUS-201514752710-A
CountryUS
Kind codeA1
Filing dateJun 26, 2015
Priority dateJun 26, 2015
Publication dateDec 29, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for processing a wafer shaped article comprises a rotary chuck for holding a wafer shaped article and rotating the wafer shaped article about an axis of rotation. A chamber surrounds and encloses the rotary chuck, the chamber comprising an upper opening. A lid is mounted externally of the chamber so as to be movable between a closed position in which the lid seals the upper opening, and an open position in which the lid uncovers the upper opening and is displaced laterally therefrom. The chamber is openable separately from the lid so as to permit a wafer shaped article to be introduced into the chamber in a direction perpendicular to the axis of rotation.

First claim

Opening claim text (preview).

What is claimed is: 1 . An apparatus for processing a wafer shaped article, comprising a rotary chuck for holding a wafer shaped article and rotating the wafer shaped article about an axis of rotation; a chamber surrounding and enclosing the rotary chuck, said chamber comprising an upper opening; and a lid mounted externally of said chamber so as to be movable between a closed position in which said lid seals said upper opening, and an open position in which said lid uncovers said upper opening and is displaced laterally therefrom; said chamber being openable separately from said lid so as to permit a wafer shaped article to be introduced into said chamber in a direction perpendicular to said axis of rotation. 2 . The apparatus according to claim 1 , wherein said rotary chuck comprises a rotor having a circular series of gripping pins positioned so as to releasably secure a wafer shaped article to said rotor. 3 . The apparatus according to claim 2 , wherein said gripping pins depend downwardly from said rotary chuck. 4 . The apparatus according to claim 1 , wherein the rotary chuck is an annular rotor. 5 . The apparatus according to claim 4 , wherein the annular rotor is a magnetic rotor. 6 . The apparatus according to claim 1 , wherein said chamber further comprises a side opening and a door that is mounted so as to be movable between a process position in which said door seals said side opening, and a loading and unloading position in which said door uncovers said side opening and is laterally displaced therefrom, so as to allow loading and unloading of a wafer shaped article into and from said chamber. 7 . The apparatus according to claim 1 , further comprising a liquid dispenser mounted externally of said chamber so as to be movable between a standby position in which a dispensing nozzle of said liquid dispenser is displaced laterally from said upper opening of said chamber, and a service position in which said dispensing nozzle is positioned overlying said upper opening. 8 . The apparatus according to claim 7 , wherein said liquid dispenser is movable to said service position only when said lid is in said open position. 9 . The apparatus according to claim 1 , further comprising a motorized mechanism for moving said lid between said open and closed positions. 10 . The apparatus according to claim 6 , wherein said side door comprises a motorized mechanism for moving said side door between said closed and loading and unloading positions. 11 . The apparatus according to claim 1 , wherein said lid has a lower portion configured as a gas showerhead so as to supply a gas into said chamber when said lid is in said sealed position. 12 . The apparatus according to claim 1 , wherein said lid has at least one liquid nozzle so as to dispense liquid onto an upwardly facing surface of a wafer shaped article when positioned on said rotary chuck. 13 . The apparatus according to claim 1 , further comprising at least one liquid dispenser mounted internally of said chamber, and positioned so as to dispense liquid onto a downwardly facing surface of a wafer shaped article when positioned on said rotary chuck. 14 . The apparatus according to claim 4 , wherein said annular rotor has an inner diameter that is less than a diameter of a wafer shaped article that said rotary chuck is configured to hold. 15 . The apparatus according to claim 1 , wherein said chamber comprises a vertically-movable lower cover that is movable between a closed position in which said cover and an upper portion of said chamber define a sealed chamber enclosing said rotary chuck, and an open position that permits loading and unloading of a wafer-shaped article. 16 . The apparatus according to claim 15 , wherein said vertically-movable lower cover comprises a splash-guard surrounding the wafer shaped article when positioned on the spin chuck. 17 . The apparatus according to claim 4 , wherein the lid has a downwardly projecting element that projects into the central opening of the annular rotor. 18 . The apparatus according to claim 17 , wherein the downwardly projecting element has an outer diameter that is smaller than the inner diameter of the annular rotor by at least 0.1 mm and not more than 50 mm. 19 . The apparatus according to claim 1 , further comprising a cleaning station for cleaning the lid while it is in an open position in which the lid uncovers the upper opening and is displaced laterally from the upper opening.

Assignees

Inventors

Classifications

  • Vertical transfer of a single workpiece · CPC title

  • characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

  • Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

  • C23C16/458Primary

    characterised by the method used for supporting substrates in the reaction chamber · CPC title

  • involving removal of lid, door or cover · CPC title

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Frequently asked questions

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What does patent US2016376702A1 cover?
An apparatus for processing a wafer shaped article comprises a rotary chuck for holding a wafer shaped article and rotating the wafer shaped article about an axis of rotation. A chamber surrounds and encloses the rotary chuck, the chamber comprising an upper opening. A lid is mounted externally of the chamber so as to be movable between a closed position in which the lid seals the upper opening…
Who is the assignee on this patent?
Lam Res Ag
What technology area does this patent fall under?
Primary CPC classification H10P72/0462. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Dec 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).