Method of forming semiconductor devices
US-2024387980-A1 · Nov 21, 2024 · US
US2016372827A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016372827-A1 |
| Application number | US-201615157763-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 18, 2016 |
| Priority date | Jun 18, 2015 |
| Publication date | Dec 22, 2016 |
| Grant date | — |
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An antenna module includes a radiation unit, a ground unit and an electrostatic protection unit. The radiation unit includes a metal element and a substrate. The metal element is disposed on a surface of the substrate. The ground unit is disposed on another surface of the substrate. The electrostatic protection unit is disposed in the substrate and connected between the metal element and the ground unit.
Opening claim text (preview).
What is claimed is: 1 . An antenna module, comprising: a radiation unit including a metal element and a substrate, wherein the metal element is disposed on a surface of the substrate; a ground unit disposed on another surface of the substrate; and an electrostatic protection unit disposed in the substrate and connected between the metal element and the ground unit. 2 . The antenna module recited in claim 1 , further comprising: an electrical conduction element disposed in the substrate, wherein the electrical conduction element and the electrostatic protection unit form a series connection between the metal element and the ground unit. 3 . The antenna module recited in claim 2 , wherein the electrical conduction element is connected with the ground unit and the electrostatic protection unit is connected with the metal element. 4 . The antenna module recited in claim 2 , wherein the electrical conduction element is connected with the metal element and the electrostatic protection unit is connected with the ground unit. 5 . The antenna module recited in claim 2 , wherein the electrostatic protection unit and the electrical conduction element are disposed in an area formed by a projection of the metal element on the substrate. 6 . The antenna module recited in claim 2 , wherein the electrostatic protection unit and the electrical conduction element are embedded in the substrate. 7 . The antenna module recited in claim 2 , wherein the material of the electrical conduction element includes copper, silver, aluminum, zinc, gold or any alloy thereof. 8 . The antenna module recited in claim 1 , wherein the electrostatic projection unit is a voltage dependent resistor. 9 . The antenna module recited in claim 1 , wherein the material of the electrostatic protection unit includes zinc oxide, silicon carbide, titanium oxide, strontium titanate or any combination thereof. 10 . The antenna module recited in claim 1 , wherein the electrostatic protection unit is a surge absorber.
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