Method for producing waveguide substrate

Patent metadata

Field	Value
Publication number	US-2016372373-A1
Application number	US-201615178764-A
Country	US
Kind code	A1
Filing date	Jun 10, 2016
Priority date	Jun 17, 2015
Publication date	Dec 22, 2016
Grant date	—

Abstract

To allow a metal film to have a sufficient thickness around a bottom surface of a non-through hole and prevent the metal film from being peeled from a substrate surface, a method for producing a waveguide substrate includes forming a first metal film on (i) a first main surface of a substrate, at which first main surface a non-through hole opens, and on (ii) an inner wall of the non-through hole, forming resist on a first main surface side of the substrate in such a manner that the resist blocks the opening of the non-through hole, removing a first portion of the first metal film which first portion is on the first main surface, removing the resist, and forming a second metal film on the first main surface of the substrate in a state where the first metal film is present on the inner wall of the non-through hole.

First claim

1 . A method for producing a waveguide substrate, the waveguide substrate including:
a substrate; a first earth conductor layer on a first main surface of the substrate; a second earth conductor layer on a second main surface of the substrate; a plurality of conductor columns disposed on respective inner walls of a plurality of through holes between the first earth conductor layer and the second earth conductor layer; a plane circuit for signal propagation which plane circuit is disposed on the first main surface of the substrate; and a conductor pin on an inner wall of a non-through hole opening at the first main surface of the substrate, the conductor pin being connected to the plane circuit, the method comprising: a first metal film forming step of forming a first metal film by sputtering on (i) the first main surface of the substrate, at which first main surface the non-through hole opens, and on (ii) the inner wall of the non-through hole; a resist forming step of forming resist on a first main surface side of the substrate in such a manner that the resist blocks the opening of the non-through hole; a metal film removing step of removing a first portion of the first metal film which first portion is on the first main surface; a resist removing step of removing the resist; and a second metal film forming step of forming a second metal film by sputtering on the first main surface of the substrate in a state where the first metal film is present on the inner wall of the non-through hole.

2 . The method according to claim 1 ,
wherein: in the first metal film forming step, the first metal film is also formed by sputtering on the second main surface of the substrate and on the respective inner walls of the plurality of through holes; in the resist forming step, the resist is also formed on both sides of the substrate in such a manner as to block openings of the plurality of through holes; in the metal film removing step, a second portion of the first metal film which second portion is on the second main surface is also removed; and in the second metal film forming step, the second metal film is also formed by sputtering on the second main surface of the substrate and on the respective inner walls of the plurality of through holes.

Assignees

• Fujikura Ltd

Inventors

• Asahi Kan

Classifications

• H10W70/05 Primary

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W70/635 Primary

  Through-vias · CPC title

• H01P3/121

  integrated in a substrate · CPC title

• H01P3/00

  Waveguides; Transmission lines of the waveguide type · CPC title