Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal

Patent metadata

Field	Value
Publication number	US-2016369374-A1
Application number	US-201414898950-A
Country	US
Kind code	A1
Filing date	Feb 20, 2014
Priority date	Jul 10, 2013
Publication date	Dec 22, 2016
Grant date	—

Abstract

One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TS TD /TS LD of tensile strength TS TD in a direction perpendicular to a rolling direction to tensile strength TS LD in a direction parallel to the rolling direction exceeds 1.09.

First claim

1 . A copper alloy for electronic and electrical equipment, comprising:
more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; 0.005 mass % to 0.100 mass % of P; and a balance containing Cu and inevitable impurities, wherein an atomic ratio Ni/P of an amount of Ni to an amount of P satisfies a relationship of 3.00<Ni/P<100.00, an atomic ratio Sn/Ni of an amount of Sn to an amount of Ni satisfies a relationship of 0.10<Sn/Ni<2.90, and a strength ratio TS TD /TS LD which is calculated from strength TS TD obtained when tensile test is performed in a direction perpendicular to a rolling direction and strength TS LD obtained when tensile test is performed in a direction parallel to the rolling direction exceeds 1.09.

2 . A copper alloy for electronic and electrical equipment, comprising:
more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; 0.005 mass % to 0.100 mass % of P; either one or both of 0.001 mass % to less than 0.100 mass % of Fe and 0.001 mass % to less than 0.100 mass % of Co; and a balance containing Cu and inevitable impurities, wherein an atomic ratio (Ni+Fe+Co)/P of a total amount (Ni+Fe+Co) of Ni, Fe, and Co to an amount of P satisfies a relationship of 3.00<(Ni+Fe+Co)/P<100.00, an atomic ratio Sn/(Ni+Fe+Co) of an amount of Sn to a total amount (Ni+Fe+Co) of Ni, Fe, and Co satisfies a relationship of 0.10<Sn/(Ni+Fe+Co)<2.90, an atomic ratio (Fe+Co)/Ni of a total amount of Fe and Co to an amount of Ni satisfies a relationship of 0.002≦(Fe+Co)/Ni<1.500, and a strength ratio TS TD /TS LD which is calculated from strength TS TD obtained when tensile test is performed in a direction perpendicular to a rolling direction and strength TS LD obtained when tensile test is performed in a direction parallel to the rolling direction exceeds 1.09.

3 . The copper alloy for electronic and electrical equipment according to claim 1 ,
wherein, the strength TS TD obtained when tensile test is performed in a direction perpendicular to the rolling direction is 500 MPa or more, and when a direction perpendicular to the rolling direction is set as an axis of bending, bending formability represented as a ratio R/t when a radius of a W bending tool is set as R and a thickness of the copper alloy is set as t is 1 or less.

4 . The copper alloy for electronic and electrical equipment according to claim 2 ,
wherein an average grain size of crystal grains of an α phase containing Cu, Zn, and Sn is in a range of 0.1 μm to 15 μm, and a precipitate containing at least one element selected from a group consisting of Fe, Co, and Ni, and P is contained.

5 . The copper alloy for electronic and electrical equipment according to claim 1 ,
wherein a special grain boundary length ratio (Lσ/L) measured by the following method is 10% or more, and measurement regarding an α phase containing Cu, Zn, and Sn is performed on a measurement surface area of 1000 μm 2 or more at every measurement intervals of 0.1 μm by an EBSD method, measured results are analyzed by data analysis software OIM to obtain a CI value in each measurement point, a measurement point in which a CI value is 0.1 or less is removed, a boundary having more than 15° of an angle difference between neighboring measuring points is assigned as a grain boundary, and a ratio of a sum Lσ of respective grain boundary lengths of Σ3, Σ9, Σ27a, and Σ27b to a total L of all the grain boundary lengths is obtained as the special grain boundary length ratio (Lσ/L).

6 . A copper alloy thin sheet for electronic and electrical equipment, comprising a rolled material of the copper alloy for electronic and electrical equipment according to claim 1 ,
wherein a thickness is in a range of 0.05 mm to 1.0 mm.

7 . The copper alloy thin sheet for electronic and electrical equipment according to claim 6 ,
wherein Sn plating is performed on surfaces.

8 . A conductive part for electronic and electrical equipment, comprising the copper alloy for electronic and electrical equipment according to claim 1 .

9 . A terminal comprising the copper alloy for electronic and electrical equipment according to claim 1 .

10 . A conductive part for electronic and electrical equipment, comprising the copper alloy thin sheet for electronic and electrical equipment according to claim 6 .

11 . A terminal comprising the copper alloy thin sheet for electronic and electrical equipment according to claim 6 .

Assignees

• Mitsubishi Shindo Kk
• Mitsubishi Materials Corp

Inventors

• Maki Kazunari
• Mori Hiroyuki
• Yamashita Daiki

Classifications

• C22F1/00

  Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title

• Y10T428/265

  1 mil or less · CPC title

• Y10T428/264

  Up to 3 mils · CPC title

• Y10T428/263

  Coating layer not in excess of 5 mils thick or equivalent · CPC title

• Y10T428/1291

  Next to Co-, Cu-, or Ni-base component · CPC title