Heat-treatment device and heat-treatment method

Patent metadata

Field	Value
Publication number	US-2016369366-A1
Application number	US-201515122313-A
Country	US
Kind code	A1
Filing date	Mar 11, 2015
Priority date	Mar 11, 2014
Publication date	Dec 22, 2016
Grant date	—

Abstract

A heat-treatment device 10 includes a table 11 on which a ring-shaped workpiece W can be placed, and a pair of heat processing units 20 for heat-processing the peripheral surface of the workpiece W. The heat-treatment device 10 is used for obtaining the workpiece W having desired properties by the heat-processing the workpiece W while the pair of heat processing units 20 move in opposite directions along the peripheral surface of the workpiece W. The heat-treatment device 10 is configured in such a way that a pair of revolving arms 30 movable relative to the table 11 oscillate the pair of heat processing units 20 relative to the workpiece W, thereby heat-processing the peripheral surface of the workpiece W. By adopting such a configuration, it is possible to obtain a heat-treatment device heat-processing the entire circumference of a ring-shaped workpiece.

First claim

1 . A heat-treatment device comprising:
a table on which a ring-shaped workpiece can be placed; and a pair of heat processing units configured to heat-process a peripheral surface of the workpiece, the pair of heat processing units heat-processing the workpiece while moving in opposite directions along the peripheral surface of the workpiece in order to obtain the workpiece having desired properties, the heat-treatment device further comprising: a pair of revolving arms configured to be movable relative to the table and to heat-process the peripheral surface of the workpiece by oscillating the path of heat processing units relative to the workpiece.

2 . The heat-treatment device according to claim 1 , wherein
the pair of heat processing units includes a pair of heating coils configured to be capable of being arranged to face the peripheral surface of the workpiece, and a pair of coolant discharge units configured to be disposed on the heating coils and to discharge a coolant, and the pair of heating coils sandwich the pair of coolant discharge units when the pair of heat processing units oscillate.

3 . The heat-treatment device according to claim 1 , wherein a plurality of pairs of the heat processing units is arranged and a plurality of pairs of the revolving arms is arranged.

4 . A heat-treatment method comprising:
heat-processing an entire circumference of a peripheral surface of a workpiece by using a heat-treatment device including a table on which a ring-shaped workpiece can be placed; and a pair of heat processing unite configured to heat-process the peripheral surface of the workpiece; and by causing the pair of heat processing units to heat-process fee workpiece while moving in opposite directions along the peripheral surface of the workpiece after a pair of revolving and capable of revolving relative to the table oscillate the pair of heat processing units relative to the workpiece to heat-process the workpiece.

5 . The heat-treatment device according to claim 1 , wherein
the heat processing unit includes a heating coil configured to be capable of being arranged to face the peripheral surface of the workpiece; a first coolant discharge unit configured to be disposed on the heating coil and to discharge a coolant, and a second coolant discharge unit configured to be arranged at a position overlapping with the heating coil and to discharge a coolant, when the pair of heat processing units move in opposite directions along the peripheral surface of the workpiece, the peripheral surface of the workpiece heated by the heating coil is sequentially cooled by a coolant discharged through the first coolant discharge unit, and when the pair of heat processing units move to positions where they are adjacent to each other, the peripheral surface of the workpiece heated by the heating coil is also cooled by a coolant discharged through the second coolant discharge unit, and an entire circumference of the peripheral surface of the workpiece is heat-processed.

6 . The heat-treatment device according to claim 5 , wherein
the pair of heat processing units are arranged on a pair of revolving arms capable of revolving relative to the table, respectively.

7 . The heat-treatment device according to claim 5 , wherein
a plurality of pairs of the heat processing units are arranged.

8 . A heat-treatment method comprising:
obtaining a workpiece having desired properties by using a heat-treatment device including a table on which a ring-shaped workpiece can be placed; a pair of heat processing units configured to heat-process a peripheral surface of the workpiece, a heating coil configured to be capable of being arranged to face the peripheral surface of the workpiece, a first coolant discharge unit configured to be disposed on the heating coil and to discharge a coolant and a second coolant discharge unit configured to be arranged at a position overlapping with the heating coil and to discharge a coolant; and by causing the pair of heat processing units to heat-process the workpiece while moving in opposite directions along the peripheral surface of the workpiece, the method further comprising: sequentially cooling the peripheral surface of the workpiece heated by the heating coil by a coolant discharged through the first coolant discharge unit when the pair of heat processing units move in opposite directions along the peripheral surface of the workpiece; and cooling the peripheral surface of the workpiece heated by the heating coil also by a coolant discharged through the second coolant discharge unit when the pan of heat processing units move to positions where they are adjacent to each other, and heat-processing the entire circumference of the peripheral surface of the workpiece.

9 . The heat-treatment device according to claim 2 , wherein a plurality of pairs of the heat processing units is arranged and a plurality of pairs of the revolving arms is arranged.

10 . The heat-treatment device according to claim 6 , wherein
a plurality of pairs of the heat processing units are arranged.

Assignees

• Thk Co Ltd
• Denki Kogyo Company Ltd

Inventors

• Shimbe Junzo
• Nakabayashi Hiroshi
• Sakanoue Takayuki
• Yoshiya Kazuki
• Kai Hiroyuki
• Masubuchi Shuji
• Nagata Makoto

Classifications

• H05B6/42 Primary

  Cooling of coils · CPC title

• H05B6/44

  having more than one coil or coil segment · CPC title

• H05B6/109

  using magnets rotating with respect to a susceptor · CPC title

• C21D9/0062

  Heat-treating apparatus with a cooling or quenching zone · CPC title

• C21D9/40 Primary

  for rings; for bearing races · CPC title