Three dimensional woven lattices as multi-functional heat exchanger

Patent metadata

Field	Value
Publication number	US-2016363389-A1
Application number	US-201615161945-A
Country	US
Kind code	A1
Filing date	May 23, 2016
Priority date	May 22, 2015
Publication date	Dec 15, 2016
Grant date	—

Abstract

The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.

First claim

1 . A device for providing heat management comprising:
wires configured to create a heat management material; wherein parameters of the wires are altered to enhance heat management qualities of the material.

2 . The device of claim 1 wherein the heat management qualities of the material are chosen from a group consisting of pressure drop, pumping power, heat transfer and temperature uniformity.

3 . The device of claim 1 wherein the wires are formed from one selected from a group consisting of a metal, a ceramic, and a polymer.

4 . The device of claim 1 wherein the wires are formed from Cu.

5 . The device of claim 1 wherein the wires are formed from a non-metal.

6 . The device of claim 1 wherein the diameters of wires are the same or different.

7 . The device of claim 1 wherein the wires are woven with a warp and a fill.

8 . The device of claim 1 wherein the wires are woven with a warp, fill, and a Z wire.

9 . The device of claim 1 where the wires are bonded.

10 . The device of claim 1 further comprising a wire composed of a bonding materials such as a braze or a solder.

11 . The device of claim 1 wherein an optimization is performed so as to design a weave with properties that are optimized in one or more directions.

12 . The device of claim 1 wherein one selected from a group consisting of pore size, flow pattern, and volume density is used to optimize heat transfer and fluid flow through the device and pumping power required for fluid flow.

13 . The device of claim 1 further comprising the parameters of the wires being chosen using one selected from a group consisting of topology optimization, intuition motivated architectures, and mechanical-based design.

14 . The device of claim 1 wherein parameters of the wires comprise one selected from a group consisting of wire position, wire material chemistry, wire size, wire coating, roughness, wire shape, wire bonding, varying composition of wires in the structure, and wire architecture.

15 . The device of claim 1 further comprising the wire taking the form of a yarn.

16 . The device of claim 1 further comprising the parameters of the wires being altered to enhance one selected from a group consisting of mechanical stiffness, fluid permeability, and pumping power required for fluid flow.

17 . The device of claim 1 further comprising wires that are solid or hollow.

18 . A method for forming a heat management material comprising:
positioning wires in x-, y-, and z-directions to form the heat management material; and selecting parameters of the wires to provide heat management.

19 . The method of claim 18 further comprising selecting parameters of the wires to provide heat management using one selected from a group consisting of topology optimization, intuition motivated architectures, and mechanical-based design.

20 . The method of claim 18 further comprising altering parameters of the wires from one selected from a group consisting of wire position, wire material chemistry, wire size, wire coating, roughness, wire shape, wire bonding, and wire architecture.

21 . The method of claim 17 further comprising generating the heat transferring material using three dimensional printing.

Assignees

• Univ Johns Hopkins
• Saertex Usa Llc

Inventors

• Hemker Kevin J
• Weihs Timothy P
• Ryan Stephen
• Zhao Longyu
• Ha Seunghyun
• Zhang Yong
• Lin Sen
• Guest James K
• Sharp Keith

Classifications

• F28F13/003

  by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title

• F28F21/08

  of metal · CPC title

• F28F3/022 Primary

  the means being wires or pins · CPC title

• F28F21/085

  from copper or copper alloys · CPC title