Solid-filled encapsulated led bulb

Patent metadata

Field	Value
Publication number	US-2016363271-A1
Application number	US-201514844308-A
Country	US
Kind code	A1
Filing date	Sep 3, 2015
Priority date	Jun 11, 2015
Publication date	Dec 15, 2016
Grant date	—

Abstract

A solid-filled encapsulated LED bulb with a base, at least one LED light source and at least one power supply element includes a transparent solid-filled heat-dissipating light guide member attached and covered onto the LED light source and the power supply element. A side of the heat-dissipating light guide member is packaged with the base to form the LED bulb. The heat of the LED light source is conducted and dissipated to the outside through the heat-dissipating light guide member. A light of the LED light source is outputted with an intensity I A through the heat-dissipating light guide member. The intensity I A of the light and the intensity IB of the LED light source satisfy the condition of (I A /I B )>70%. The use of a conventional dissipating structure is skipped to reduce the production cost and expedite the assembling and packaging processes while maintaining excellent heat dissipation and light output effects.

First claim

What is claimed is:

1 . A solid-filled encapsulated LED bulb, comprising a base, at least one LED light source and at least one power supply element, characterized in that the solid-filled encapsulated LED bulb further comprises a heat-dissipating light guide member, being a transparent solid structure tightly attached and covered onto the LED light source and the power supply element, and a side of the heat-dissipating light guide member is sealed with the base to form the solid-filled encapsulated LED bulb; wherein the heat-dissipating light guide member is in contact with the LED light source to conduct and dissipate heat from the LED light source, and a light of the LED light source is outputted with a light intensity I A from the heat-dissipating light guide member and the light intensity I A and a light intensity I B of the LED light source satisfy the condition of (I A /I B )>70%.

2 . The solid-filled encapsulated LED bulb as claimed in claim 1 , wherein the heat-dissipating light guide member and the LED light source and the power supply element are integrally formed by an injection molding method or a casting molding method, so that the heat-dissipating light guide member is closely attached to the LED light source and the power supply element, and during an injection molding or casting molding process, the heat-dissipating light guide member and the LED light source and the power supply element covered by the heat-dissipating light guide member is packaged directly with the base to form the solid-filled encapsulated LED bulb.

3 . The solid-filled encapsulated LED bulb as claimed in claim 2 , wherein the LED light source comes with a plural quantity, and the LED light sources are arranged into a circular shape, an arc shape, or a polygonal shape.

4 . The solid-filled encapsulated LED bulb as claimed in claim 3 , wherein the power supply element and the LED light source form an integral structure.

5 . The solid-filled encapsulated LED bulb as claimed in claim 4 , wherein the power supply element comes with a singular quantity for connecting each of the LED light sources, or comes with a quantity corresponsive to the quantity of the LED light sources for connecting the LED light sources to the power supply elements respectively.

6 . The solid-filled encapsulated LED bulb as claimed in claim 5 , wherein the heat-dissipating light guide member is made of glass, plastic or resin.

7 . The solid-filled encapsulated LED bulb as claimed in claim 1 , wherein the heat-dissipating light guide member surface has at least one optical pattern for enhancing the light uniformity of the heat-dissipating light guide member.

8 . The solid-filled encapsulated LED bulb as claimed in claim 1 , wherein the heat-dissipating light guide member is doped with at least one uniform luminous material for enhancing the light uniformity.

9 . A solid-filled encapsulated LED bulb, comprising a base, at least one LED light source and at least one power supply element, and the solid-filled encapsulated LED bulb further comprising:
a heat-dissipating light guide member, being a transparent solid structure and having at least one mounting slot for installing the LED light source and the power supply element, and a side of the heat-dissipating light guide member being packaged with the base to form the solid-filled encapsulated LED bulb, and a light of the LED light source being outputted with a light intensity I A from the heat-dissipating light guide member and the light intensity I A and a light intensity I B of the LED light source satisfying the condition of (I A /I B )>70%; and at least one light permeable plastic, filled into the mounting slot for fixing the LED light source and the power supply element, wherein the heat-dissipating light guide member is in contact with the LED light source through the light permeable plastic to conduct and dissipate heat from the LED light source.

10 . The solid-filled encapsulated LED bulb as claimed in claim 9 , wherein the mounting slot comes with a plural quantity, and the mounting slots are arranged in a circular shape, an arc shape or a polygonal shape, and the quantity of the LED light sources is corresponsive to the quantity of the mounting slots.

11 . The solid-filled encapsulated LED bulb as claimed in claim 10 , wherein the power supply element and the LED light source form an integral structure.

12 . The solid-filled encapsulated LED bulb as claimed in claim 11 , wherein the heat-dissipating light guide member is made of glass, plastic or resin.

13 . The solid-filled encapsulated LED bulb as claimed in claim 9 , wherein the heat-dissipating light guide member surface has at least one optical pattern for enhancing the light uniformity of the heat-dissipating light guide member.

14 . The solid-filled encapsulated LED bulb as claimed in claim 9 , wherein the heat-dissipating light guide member is doped with at least one uniform luminous material for enhancing the light uniformity.

Assignees

• Unity Opto Technology Co Ltd

Inventors

• Wu Chih-Hsien
• Tsai Sen-Yuh
• Huang Chun-Chieh
• Chen Yu-Chang

Classifications

• F21Y2101/02

  Mechanical Engineering · mapped topic

• F21V2200/30

  of light guides doped with fluorescent agents · CPC title

• F21V3/0463

  Mechanical Engineering · mapped topic

• F21V29/70

  characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

• F21V23/023 Primary

  Power supplies in a casing (F21V23/003 takes precedence) · CPC title