Logic drive using standard commodity programmable logic ic chips comprising non-volatile random access memory cells
US-2024380401-A1 · Nov 14, 2024 · US
US2016359102A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016359102-A1 |
| Application number | US-201515117905-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 29, 2015 |
| Priority date | Feb 11, 2014 |
| Publication date | Dec 8, 2016 |
| Grant date | — |
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Provided is a magnetic tunneling junction (MTJ) structure having (PMA). The MJT structure includes a seed layer including a tungsten-based substance, a first ferromagnetic layer that is positioned on the seed layer, includes a boron-based ferromagnetic material and has PMA, a tunneling barrier layer positioned on the first ferromagnetic layer, and a second ferromagnetic layer that is positioned on the tunneling barrier layer and has PMA, wherein the seed layer has a thickness in a range of 1 nm to 10 nm. Accordingly, by using the tungsten-based substance as a seed layer substance, the MTJ structure may be provided in which crystallinity of the first ferromagnetic layer is maintained even at a high temperature in a range of 350° C. to 400° C., a problem of the PMA reduction is prevented, and therefore, thermal stability is improved.
Opening claim text (preview).
1 . A magnetic tunneling junction (MTJ) structure having perpendicular magnetic anisotropy (PMA), comprising: a seed layer including a tungsten-based material; a first ferromagnetic layer that is positioned on the seed layer, includes a boron-based ferromagnetic material, and has PMA; a tunneling barrier layer positioned on the first ferromagnetic layer; and a second ferromagnetic layer that is positioned on the tunneling barrier layer and has PMA, wherein the seed layer has a thickness in a range of 1 nm to 10 nm. 2 . The MTJ structure of claim 1 , wherein the tungsten-based material includes W or WB. 3 . The MTJ structure of claim 1 , wherein the boron-based ferromagnetic material includes CoFeB. 4 . The MTJ structure of claim 1 , wherein the tunneling barrier layer includes at least one selected from the group consisting of MgO, Al 2 O 3 , HfO 2 , TiO 2 , Y 2 O 3 , and Yb 2 O 3 . 5 . The MTJ structure of claim 1 , wherein the first ferromagnetic layer maintains PMA even after a heat treatment is performed at a temperature in a range of 350° C. to 400° C. 6 . The MTJ structure of claim 1 , wherein the tungsten-based substance of the seed layer has a beta phase or a mixed phase in which alpha and beta phases are mixed after a heat treatment is performed at a temperature in a range of 350° C. to 400° C. 7 . A magnetic device comprising: a plurality of digit lines; a plurality bit lines crossing upper portions of the digit lines; and the magnetic tunneling junction (MTJ) structure of any one of claims 1 to 6 that is interposed between the digit lines and the bit lines.
Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy · CPC title
Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices · CPC title
Manufacture or treatment · CPC title
Constructional details · CPC title
details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell · CPC title
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