Highly Conductive Graphitic Films

Patent metadata

Field	Value
Publication number	US-2016358686-A1
Application number	US-201615170387-A
Country	US
Kind code	A1
Filing date	Jun 1, 2016
Priority date	Mar 20, 2014
Publication date	Dec 8, 2016
Grant date	—

Abstract

A flexible graphene platelet-filled composite film comprising a carbon or graphitic matrix and 1% to 99% weight fraction of graphene platelets dispersed in the matrix, wherein the graphene platelets are aligned along planar directions of said film and are selected from pristine graphene, oxidized graphene, reduced graphene oxide, fluorinated graphene, hydrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof, and wherein the carbon or graphitic matrix is obtained by carbonizing a carbon precursor polymer at a carbonization temperature of at least 300° C. or by carbonizing and graphitizing the carbon precursor polymer at a final graphitization temperature higher than 1,500° C., and the graphitic matrix comprises graphene layers that are substantially oriented parallel to one another with an inclination angle between two graphene layers less than 5 degrees. The film is thermally and electrically conductive, and can be used to dissipate heat in an electronic device or device housing.

First claim

We claim:

1 . A graphene platelet-filled composite film comprising a carbon or graphitic matrix and 1% to 99% weight fraction of graphene platelets dispersed in said matrix, wherein said graphene platelets are aligned along planar directions of said film and are selected from pristine graphene, oxidized graphene, reduced graphene oxide, fluorinated graphene, hydrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof, and wherein said carbon or graphitic matrix is obtained by carbonizing a carbon precursor polymer at a carbonization temperature of at least 300° C. or by carbonizing and graphitizing said carbon precursor polymer at a final graphitization temperature higher than 1,500° C., wherein said carbon precursor polymer is selected from the group consisting of polyimide, polyamide, polyoxadiazole, polybenzoxazole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, poly(p-phenylene vinylene), polybenzimidazole, polybenzobisimidazole, and combinations thereof; and said graphitic matrix comprises graphene layers, derived from said carbon precursor polymer, that are substantially oriented parallel to one another with an inclination angle between two graphene layers less than 5 degrees.

2 . The graphene platelet-filled composite film of claim 1 , wherein the graphene platelets comprise a single-layer graphene sheet or a multi-layer graphene platelet with a thickness less than 10 nm.

3 . The graphene platelet-filled composite film of claim 1 , wherein the graphene platelets comprise a multi-layer graphene platelet with a thickness less than 4 nm.

4 . The graphene platelet-filled composite film of claim 1 , wherein the graphene platelets comprise a single-layer pristine graphene sheet or a multi-layer pristine graphene platelet with a thickness less than 10 nm and said pristine graphene sheet or pristine graphene platelet contains no oxygen and is produced from a process that does not involve oxidation.

5 . The graphene platelet-filled composite film of claim 1 , wherein said final graphitization temperature is less than 2,000° C. and said graphitic film has an inter-graphene spacing less than 0.338 nm, a thermal conductivity of at least 1,000 W/mK, and/or an electrical conductivity no less than 5,000 S/cm

6 . The graphene platelet-filled composite film of claim 1 , wherein said final graphitization temperature is less than 2,200° C. and said graphitic film has an inter-graphene spacing less than 0.337 nm, a thermal conductivity of at least 1,200 W/mK, an electrical conductivity no less than 7,000 S/cm, a physical density greater than 1.9 g/cm3, and/or a tensile strength greater than 30 MPa.

7 . The graphene platelet-filled composite film of claim 1 , wherein said final graphitization temperature is less than 2,500° C. and said graphitic film has an inter-graphene spacing less than 0.336 nm, a thermal conductivity of at least 1,500 W/mK, an electrical conductivity no less than 10,000 S/cm, a physical density greater than 2.0 g/cm3, and/or a tensile strength greater than 35 MPa

8 . The graphene platelet-filled composite film of claim 1 , wherein the graphitic film exhibits an inter-graphene spacing less than 0.337 nm and a mosaic spread value less than 1.0.

9 . The graphene platelet-filled composite film of claim 1 , wherein the graphitic film exhibits a degree of graphitization no less than 60% and/or a mosaic spread value less than 0.7.

10 . The graphene platelet-filled composite film of claim 1 , wherein the graphitic film exhibits a degree of graphitization no less than 90% and/or a mosaic spread value less than 0.4.

11 . The graphene platelet-filled composite film of claim 1 , further comprising a filler selected from natural graphite, expanded graphite, artificial graphite, meso-phase carbon, meso-phase pitch, meso-carbon micro-bead, soft carbon, hard carbon, coke, carbon fiber, carbon nano-fiber, carbon nano-tube, or a combination thereof.

12 . An electronic device containing the graphitic film of claim 1 as a heat-dissipating element therein.

Assignees

• Zhamu Aruna
• Jang Bor Z

Inventors

• Zhamu Aruna
• Jang Bor Z

Classifications

• H05K9/0073

  Shielding materials (H05K9/0003 takes precedence) · CPC title

• C01B31/0438

  Chemistry & Metallurgy · mapped topic

• H01B1/04 Primary

  mainly consisting of carbon-silicon compounds, carbon or silicon · CPC title

• C09K5/14

  Solid materials, e.g. powdery or granular · CPC title

• C01B32/182

  Graphene · CPC title