Aluminum foil, electronic component wiring board manufactured using the same, and method of manufacturing aluminum foil

Patent metadata

Field	Value
Publication number	US-2016358684-A1
Application number	US-201515109760-A
Country	US
Kind code	A1
Filing date	May 26, 2015
Priority date	May 30, 2014
Publication date	Dec 8, 2016
Grant date	—

Abstract

The present invention aims to provide aluminum foil having high adhesiveness to solder. The aluminum foil of the present invention contains at least one of Sn and Bi, in which a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil is 0.0075 mass % or more and 15 mass % or less.

First claim

1 . Aluminum foil containing at least one of Sn and Bi, a ratio of a total mass of Sn and Bi to a total mass of the aluminum foil being 0.0075 mass % or more and 15 mass % or less.

2 . The aluminum foil according to claim 1 , wherein a ratio of a total surface area of Sn and Bi to a total surface area of the aluminum foil is 0.01% or more and 65% or less, and the ratio of the total surface area is 5 times or more a ratio of a total volume of Sn and Bi to a volume of Al.

3 . The aluminum foil according to claim 1 , wherein the aluminum foil is tempered in a range from 0 to ¼H defined in JIS-H0001.

4 . The aluminum foil according to claim 1 , wherein the aluminum foil is aluminum foil for soldering.

5 . An electronic component wiring board manufactured using the aluminum foil according to claim 1 .

6 . A method of manufacturing aluminum foil, the method comprising the steps of:
preparing aluminum molten metal; adding at least one of Sn and Bi to the aluminum molten metal to produce a molten metal mixture in which a ratio of a total mass of Sn and Bi is 0.0075 mass % or more and 15 mass % or less; forming an ingot or a casting plate using the molten metal mixture; rolling the ingot or the casting plate to manufacture aluminum foil in which the ratio of the total mass of Sn and Bi is 0.0075 mass % or more and 15 mass % or less, the aluminum foil being tempered in a range from ¾H to H defined in JIS-H0001; and subjecting the tempered aluminum foil to a heat treatment at a temperature of 230° C. or more so as to be tempered.

Assignees

• Toyo Aluminium Kk

Inventors

• Akiyama Sotaro
• Nishio Yoshitaka

Classifications

• B21B2003/001

  Aluminium or its alloys · CPC title

• C22F1/04

  of aluminium or alloys based thereon · CPC title

• H01B1/023 Primary

  Alloys based on aluminium · CPC title

• B21B1/40 Primary

  for rolling foils which present special problems, e.g. because of thinness · CPC title

• C22C21/003 Primary

  containing at least 2.6% of one or more of the elements: tin, lead, antimony, bismuth, cadmium, and titanium · CPC title