Radio ic device

Patent metadata

Field	Value
Publication number	US-2016358064-A1
Application number	US-201615245291-A
Country	US
Kind code	A1
Filing date	Aug 24, 2016
Priority date	Jul 18, 2007
Publication date	Dec 8, 2016
Grant date	—

Abstract

A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

First claim

1 . (canceled)

2 . A radio IC device comprising:
a radio IC arranged to process transmitted and received signals; a coil element electrically connected to or electromagnetically coupled to the radio IC; and a radiation plate defined by at least one of a case of an apparatus and a metal component disposed in the apparatus; wherein the radiation plate includes a loop portion; and the coil element is coupled to the loop portion via a magnetic field.

3 . The radio IC device according to claim 2 , wherein the metal component is a first wiring electrode disposed in the apparatus, a shielding case, a wiring electrode on a wiring board, a ground electrode on the wiring board, or a connector connected to the wiring electrode or the ground electrode.

4 . The radio IC device according to claim 2 , wherein the metal component is a ground electrode on a wiring board.

5 . The radio IC device according to claim 2 , wherein the coil element is defined by a spiral electrode.

6 . The radio IC device according to claim 2 , wherein the coil element is provided adjacent to the loop portion of the radiation plate.

7 . The radio IC device according to claim 2 , wherein the case is made of a metal material, and the case itself functions as the radiation plate.

8 . The radio IC device according to claim 2 , wherein the case is made of a non-conductive material, an electrode film which is made of a conductive material is provided on the case, and the electrode film functions as the radiation plate.

9 . The radio IC device according to claim 4 , wherein the coil element is provided in a substrate and the substrate is mounted on the wiring board.

Assignees

• Murata Manufacturing Co

Inventors

• Kato Noboru
• Ishino Satoshi
• Kataya Takeshi
• Kimura Ikuhei
• Ikemoto Nobuo
• Dokai Yuya

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W44/248

  for antennas · CPC title