Optical Design Techniques for Environmentally Resilient Optical Computing Devices
US-2015356204-A1 · Dec 10, 2015 · US
US2016356933A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016356933-A1 |
| Application number | US-201615241518-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 19, 2016 |
| Priority date | Oct 12, 2012 |
| Publication date | Dec 8, 2016 |
| Grant date | — |
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A display includes: a laminated wiring with a conductive film arranged on a foundation layer, and a transparent film and a translucent film arranged on the conductive film; a wiring terminal part arranged at an edge portion of the laminated wiring and having the same laminated structure as that of the laminated wiring; and an insulating film that covers the laminated wiring and the wiring terminal part.
Opening claim text (preview).
What is claimed is: 1 . A display, comprising: a stacked interconnect with a conductive film arranged on a foundation layer, and a transparent film arranged on said conductive film; an interconnect terminal part arranged at an edge portion of said stacked interconnect, said interconnect terminal part having a stacked structure being the same as at least that of said stacked interconnect; and an insulating film that covers said stacked interconnect and said interconnect terminal part, wherein said transparent film has an optical path length of from 0.02 to 0.20 μm, and said transparent film is higher in refractive index than said insulating film. 2 . The display according to claim 1 , wherein said conductive film contains a material selected from Mo, Cr, Ti, Ni, Ta, and W. 3 . The display according to claim 1 , wherein said conductive film is composed of stacked films including a first conductive film containing a material selected from Mo, Cr, Ti, Ni, Ta, and W, and a second conductive film having a resistivity of 10 μΩcm or less at room temperature. 4 . A display, comprising: an interconnect layer with a conductive film arranged on a foundation layer; an interconnect terminal part arranged at an edge portion of said interconnect layer, said interconnect terminal part having the same structure as that of said interconnect layer; an antireflection film that covers an upper surface and a side surface of said conductive film; and an insulating film that covers said antireflection film. 5 . The display according to claim 4 , wherein said antireflection film is a transparent insulating film that covers said foundation layer entirely, said transparent insulating film has an optical path length of from 0.02 to 0.20 μm, and said transparent insulating film is higher in refractive index than said insulating film. 6 . The display according to claim 4 , wherein said conductive film is composed of stacked films including a second conductive film having a resistivity of 10 μΩcm or less at room temperature, and a first conductive film that covers an upper surface and a side surface of said second conductive film, the first conductive film containing a material selected from Mo, Cr, Ti, Ni, Ta, and W. 7 . The display according to claim 4 , wherein said antireflection film is composed of multiple films including a transparent film and a translucent film stacked in this order on said conductive film. 8 . The display according to claim 7 , wherein said transparent film contains a material selected from: one of a group of oxides including indium oxide, zinc oxide, and tin oxide; one of a group of oxides mainly containing any of silicon, aluminum, tantalum, zirconium, yttrium, hafnium, niobium, and titanium; and one of a group of nitrides mainly containing silicon and aluminum, and said translucent film contains a material selected from Mo, Cr, Ti, Ni, Ta, and W. 9 . The display according to claim 4 , wherein said antireflection film is composed of multiple films including a first transparent film, a translucent film, and a second transparent film stacked in this order on said conductive film. 10 . The display according to claim 9 , wherein said first transparent film contains a material selected from: one of a group of oxides including indium oxide, zinc oxide, and tin oxide; one of a group of oxides mainly containing any of silicon, aluminum, tantalum, zirconium, yttrium, hafnium, niobium, and titanium; and one of a group of nitrides mainly containing silicon and aluminum, said second transparent film contains a material selected from: one of a group of oxides including indium oxide, zinc oxide, and tin oxide; one of a group of oxides mainly containing any of aluminum, tantalum, zirconium, yttrium, hafnium, niobium, and titanium; and one of a group of nitrides mainly containing silicon and aluminum, and said translucent film contains a material selected from Mo, Cr, Ti, Ni, Ta, and W. 11 . The display according to claim 1 , comprising an image display module arranged on a main surface of said foundation layer opposite a main surface thereof on which said stacked interconnect and said interconnect terminal part are arranged. 12 . The display according to claim 4 , comprising an image display module arranged on a main surface of said foundation layer opposite a main surface thereof on which said interconnect layer and said interconnect terminal part are arranged. 13 . A method of manufacturing a display, comprising the steps of: (a) forming a conductive film on a foundation layer and forming a transparent film, a translucent film, and a non low-reflection film on said conductive film such that said non low-reflection film is placed at the top; (b) forming a resist mask having a certain pattern on said non low-reflection film; (c) patterning said non low-reflection film, said translucent film, said transparent film, and said conductive film by etching by using said resist mask as an etching mask; (d) after said step (c), removing said resist mask; (e) after said step (d), removing said non low-reflection film to form a stacked interconnect and an interconnect terminal part at an edge portion of said stacked interconnect, said stacked interconnect and said interconnect terminal part each including said conductive film, said transparent film, and said translucent film; and (f) covering said stacked interconnect and said interconnect terminal part with an insulating film from above, wherein said step (a) includes a step of forming said non low-reflection film composed of a film having a reflectance of 25% or more relative to light from a light source for focusing operation during exposure in photolithography with said resist mask. 14 . A method of manufacturing a display, comprising the steps of: (a) forming a conductive film on a foundation layer and forming a transparent film and a non low-reflection film in this order on said conductive film; (b) forming a resist mask having a certain pattern on said non low-reflection film; (c) patterning said non low-reflection film, said transparent film, and said conductive film by etching by using said resist mask as an etching mask; (d) after said step (c), removing said resist mask; (e) after said step (d), forming a translucent film by reducing the thickness of said non low-reflection film, thereby forming a stacked interconnect and an interconnect terminal part at an edge portion of said stacked interconnect, said stacked interconnect and said interconnect terminal part each including said conductive film, said transparent film, and said translucent film; and (f) covering said stacked interconnect and said interconnect terminal part with an insulating film from above, wherein said step (a) includes a step of forming said non low-reflection film composed of a film having a reflectance of 25% or more relative to light from a light source for focusing operation during exposure in photolithography with said resist mask.
Anti-reflection coatings · CPC title
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title
comprising deposited thin solid films (G02B5/281 - G02B5/289 take precedence; multilayered film filters for fibre optic multiplexing G02B6/29361) · CPC title
Coatings, e.g. passivation layers or antireflective coatings · CPC title
Etching masks · CPC title
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