Coupling Assembly

US2016356902A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016356902-A1
Application numberUS-201114352636-A
CountryUS
Kind codeA1
Filing dateNov 22, 2011
Priority dateNov 22, 2011
Publication dateDec 8, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Example embodiments disclosed herein relate to a coupling assembly. The coupling assembly may include a projecting member or peg and a mounting member coupled to the projecting member or peg and configured to support a device (e.g., a seismic sensor) thereon. The coupling assembly may also include a bushing or sleeve adapted to connect to a mounting base and configured to include a cavity for receiving the projecting member or peg and an attachment assembly configured to releaseably secure the projecting member or peg within the cavity.

First claim

Opening claim text (preview).

What is claimed is: 1 . A coupling assembly, comprising: a peg; a mounting member coupled to the peg and configured to support a device thereon; a bushing adapted to connect to a mounting base and configured to include a cavity for receiving the peg; and an attachment assembly configured to releaseably secure the peg within the cavity. 2 . The coupling assembly of claim 1 , wherein the attachment assembly includes a plurality of flexible members th…

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What does patent US2016356902A1 cover?
Example embodiments disclosed herein relate to a coupling assembly. The coupling assembly may include a projecting member or peg and a mounting member coupled to the projecting member or peg and configured to support a device (e.g., a seismic sensor) thereon. The coupling assembly may also include a bushing or sleeve adapted to connect to a mounting base and configured to include a cavity for r…
Who is the assignee on this patent?
Swier Kevin E, Hewlett Packard Development Co Lp
What technology area does this patent fall under?
Primary CPC classification G01V1/166. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Dec 08 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).