Laminate for touch panel and adhesive sheet

Patent metadata

Field	Value
Publication number	US-2016355705-A1
Application number	US-201615241215-A
Country	US
Kind code	A1
Filing date	Aug 19, 2016
Priority date	Feb 28, 2014
Publication date	Dec 8, 2016
Grant date	—

Abstract

A laminate for a touch panel includes a resin substrate which has a thermal expansion factor of 2 ppm/° C. to 200 ppm/° C.; a conductive portion which is arranged on the resin substrate, and has a mesh pattern formed of a plurality of metal thin wires; and an adhesive layer which is arranged to cover a surface of the resin substrate on the conductive portion side and the conductive portion, in which thermal stress obtained by a predetermined expression is less than or equal to 1,800 Pa, and peeling strength of the adhesive layer with respect to the resin substrate under an environment of a temperature of 85° C. and humidity of 85% is greater than or equal to 0.40 N/25 mm.

First claim

What is claimed is:

1 . A laminate for a touch panel, comprising:
a resin substrate which has a thermal expansion factor of 2 ppm/° C. to 200 ppm/° C.; a conductive portion which is arranged on the resin substrate, and has a mesh pattern formed of a metal thin wire; and an adhesive layer which is arranged to cover a surface of the resin substrate on the conductive portion side and the conductive portion, wherein thermal stress obtained by Expression (1) described below is less than or equal to 1,800 Pa, and peeling strength of the adhesive layer with respect to the resin substrate under an environment of a temperature of 85° C. and humidity of 85% is greater than or equal to 0.40 N/25 mm:
σ A ={|α B −α A |×ΔT×h B ×E A ×E B }/( E A ×h A +E B ×h B )  Expression (1)

in Expression (1), σ A represents thermal stress, α A represents a thermal expansion factor of the adhesive layer, α B represents the thermal expansion factor of the resin substrate, ΔT represents 85° C.—room temperature, E A represents a modulus of elasticity of the adhesive layer at 85° C., E B represents a modulus of elasticity of the resin substrate at 85° C., h A represents a thickness of the adhesive layer, h B represents a thickness of the resin substrate, a unit of the thermal expansion factor of the adhesive layer and the thermal expansion factor of the resin substrate is ppm/° C., a unit of the modulus of elasticity of the adhesive layer at 85° C. and the modulus of elasticity of the resin substrate at 85° C. is Pa, and a unit of the thickness of the adhesive layer and the thickness of the resin substrate is mm.

2 . The laminate for a touch panel according to claim 1 ,
wherein the adhesive layer is an adhesive layer obtained by photocuring a photocurable adhesive composition containing components (A) to (F) described below; (A) a rubber, (B) a crosslinking agent, (C) a monofunctional (meth)acrylic monomer having at least one group selected from the group consisting of a straight chain or branch alkyl group having greater than or equal to 8 carbon atoms and an alicyclic hydrocarbon group, (D) a photopolymerization initiator, (E) an adhesiveness providing agent, and (F) a compound which has at least one reactive group selected from the group consisting of an epoxy group, an oxetanyl group, an isocyanate group, a carbodiimide group, and an amino group, and at least one polymerizable group selected from the group consisting of a radically polymerizable group and an epoxy group, and is different from the components (A) to (E).

3 . The laminate for a touch panel according to claim 2 ,
wherein a content of the component (C) in the photocurable adhesive composition is 10 mass % to 45 mass % with respect to the total mass of the components (A) to (F), and a content of the component (E) in the photocurable adhesive composition is 25 mass % to 50 mass % with respect to the total mass of the components (A) to (F).

4 . The laminate for a touch panel according to claim 2 ,
wherein the component (B) contains one selected from the group consisting of polybutadiene, polyisoprene, hydrogenated polybutadiene, and hydrogenated polyisoprene, which have a (meth)acryloyl group.

5 . The laminate for a touch panel according to claim 3 ,
wherein the component (B) contains one selected from the group consisting of polybutadiene, polyisoprene, hydrogenated polybutadiene, and hydrogenated polyisoprene, which have a (meth)acryloyl group.

6 . The laminate for a touch panel according to claim 2 ,
wherein the component (F) is a compound denoted by General Formula (X), and

in General Formula (X), R 1 represents hydrogen, a methyl group, a trifluoromethyl group, or a hydroxy methyl group, L 1 represents alkylene or alkylene oxide, and X represents a group having at least one reactive group selected from an epoxy group, an oxetanyl group, an isocyanate group, a carbodiimide group, and an amino group.

10 . The laminate for a touch panel according to claim 2 ,
wherein a content of the component (F) in the photocurable adhesive composition is 2 mass % to 20 mass % with respect to the total mass of the component (C).

11 . The laminate for a touch panel according to claim 3 ,
wherein a content of the component (F) in the photocurable adhesive composition is 2 mass % to 20 mass % with respect to the total mass of the component (C).

12 . The laminate for a touch panel according to claim 4 ,
wherein a content of the component (F) in the photocurable adhesive composition is 2 mass % to 20 mass % with respect to the total mass of the component (C).

13 . The laminate for a touch panel according to claim 5 ,
wherein a content of the component (F) in the photocurable adhesive composition is 2 mass % to 20 mass % with respect to the total mass of the component (C).

14 . The laminate for a touch panel according to claim 6 ,
wherein a content of the component (F) in the photocurable adhesive composition is 2 mass % to 20 mass % with respect to the total mass of the component (C).

15 . The laminate for a touch panel according to claim 7 ,
wherein a content of the component (F) in the photocurable adhesive composition is 2 mass % to 20 mass % with respect to the total mass of the component (C).

16 . An adhesive sheet obtained by photocuring a photocurable adhesive composition containing components (A) to (F) described below;
(A) a rubber, (B) a crosslinking agent, (C) a monofunctional (meth)acrylic monomer having at least one group selected from the group consisting of a straight chain or branch alkyl group having greater than or equal to 8 carbon atoms and an alicyclic hydrocarbon group, (D) a photopolymerization initiator, (E) an adhesiveness providing agent, and (F) a compound which has at least one reactive group selected from the group consisting of an epoxy group, an oxetanyl group, an isocyanate group, a carbodiimide group, and an amino group, and at least one polymerizable group selected from the group consisting of a radically polymerizable group and an epoxy group, and is different from the components (A) to (E).

17 . The adhesive sheet according to claim 16 ,
wherein a content of the component (C) in the photocurable adhesive composition is 10 mass % to 45 mass % with respect to the total mass of the components (A) to (F), and a content of the component (E) in the photocurable adhesive composition is 25 mass % to 50 mass % with respect to the total mass of the components (A) to (F).

18 . The adhesive sheet according to claim 16 ,
wherein the component (B) contains one selected from the group consisting of polybutadiene, polyisoprene, hydrogenated polybutadiene, and hydrogenated polyisoprene, which have a (meth)acryloyl group.

19 . The adhesive sheet according to claim 16 ,
wherein the component (F) is a compound denoted by General Formula (X), and

in General Formula (X), R 1 represents hydrogen, a methyl group, a trifluoromethyl group, or a hydroxy methyl group, L 1 represents alkylene or alkylene oxide, and X represents a group having at least one reactive group selected from an epoxy group, an oxetanyl group, an isocyanate group, a carbodiimide group, and an amino group.

20 . The adhesive sheet according to claim 16 ,
wherein a content of the component (F) in the photocurable adhesive composition is

Assignees

• Fujifilm Corp

Inventors

• Kawano Takatsugu
• Ishiji Yohei
• Yamamoto Yuya

Classifications

• G06F3/044

  by capacitive means · CPC title

• C09J7/0264 Primary

  Chemistry & Metallurgy · mapped topic

• B32B2307/202

  Conductive · CPC title

• B32B3/10

  characterised by a discontinuous layer, i.e. formed of separate pieces of material · CPC title

• B32B15/02

  Layer formed of wires, e.g. mesh · CPC title