Electronic equipment and heat receiving device

Patent metadata

Field	Value
Publication number	US-2016353607-A1
Application number	US-201615235298-A
Country	US
Kind code	A1
Filing date	Aug 12, 2016
Priority date	Mar 18, 2013
Publication date	Dec 1, 2016
Grant date	—

Abstract

An electronic equipment includes a heat generating component, and a heat receiving device. The heat receiving device includes a case including a contacting surface which contacts the heat generating component, a flow passage, formed within the case, configured to flow a coolant flows, and an inflow port and an outflow port of the flow passage formed in an outer surface of the case. A distance from a spot having higher heat generation density than the other portions on a surface of the heat generating component which contacts the contacting surface to the inflow port is shorter than a distance from the spot to the outflow port.

First claim

What is claimed is:

1 . An electronic equipment comprising:
a heat generating component; and a heat receiving device, wherein the heat receiving device comprises: a case including a contacting surface which contacts the heat generating component; a flow passage, formed within the case, configured to flow a coolant, and an inflow port and an outflow port of the flow passage formed in an outer surface of the case, and a distance from a spot having higher heat generation density than the other portions on a surface of the heat generating component which contacts the contacting surface to the inflow port is shorter than a distance from the spot to the outflow port.

2 . The electronic equipment according to claim 1 , wherein the downstream part has a serpentine shape along the contacting surface.

3 . The electronic equipment according to claim 2 , wherein the flow passage includes a plurality of sub-flow passages that do not converge with each other, and
each sub-downstream part of the plurality of the sub-flow passages has a serpentine shape along the contacting surface.

4 . The electronic equipment according to claim 1 , wherein the downstream part has a spiral shape around a normal line perpendicular to the contacting surface,
wherein the flow passage includes a plurality of sub-flow passages that do not converge with each other, and respective sub-downstream parts of the plurality of the sub-flow passages have a spiral shape and are adjacent to each other.

5 . The electronic equipment according to claim 1 , wherein the flow passage includes a plurality of sub-flow passages that do not converge with each other.

6 . An electronic equipment comprising:
a heat generating component; and a heat receiving device, wherein the heat receiving device comprises: a case including a contacting surface which contacts the heat generating component; and a flow passage, formed within the case, configured to flow a coolant, the flow passage includes an upstream part spaced apart from the contacting surface and a downstream part located nearer to the contacting surface than the upstream part in a downstream side, the upstream part extends in a direction other than the direction perpendicular to the contacting surface and extends towards a central spot of the contacting surface or another spot having higher heat generation density than the other portions on the surface of the heat generating component which contacts the contacting surface.

7 . The electronic equipment according to claim 6 , wherein the downstream part has a serpentine shape along the contacting surface.

8 . The electronic equipment according to claim 7 , wherein the flow passage includes a plurality of sub-flow passages that do not converge with each other, and
each sub-downstream part of the plurality of the sub-flow passages has a serpentine shape along the contacting surface.

9 . The electronic equipment according to claim 6 , wherein the downstream part has a spiral shape around a normal line perpendicular to the contacting surface,
wherein the flow passage includes a plurality of sub-flow passages that do not converge with each other, and respective sub-downstream parts of the plurality of the sub-flow passages have a spiral shape and are adjacent to each other.

10 . The electronic equipment according to claim 6 , wherein the flow passage includes a plurality of sub-flow passages that do not converge with each other.

11 . A heat receiving device comprising:
a case provided with a bottom surface; and a flow passage formed within the case, wherein the flow passage includes an upstream part spaced apart from the bottom surface and a downstream part located nearer to the bottom surface than the upstream part in a downstream side, wherein the flow passage includes a plurality of sub-flow passages that do not converge with each other, each sub-downstream part of the plurality of the flow passages has a serpentine shape, and wherein the upstream part extends in a direction other than the direction perpendicular to the bottom surface and extends towards the center of the bottom surface.

12 . A heat receiving device comprising:
a case provided with a bottom surface; a flow passage formed within the case; and an inflow port and an outflow port of the flow passage formed in an outer surface of the case, and wherein the flow passage includes a plurality of sub-flow passages that do not converge with each other, and wherein a distance from a center of the bottom surface to the inflow port of at least one of the plurality of the sub-flow passages is shorter than a distance from the center to the outflow port of the at least one of the plurality of the sub-flow passages.

13 . The heat receiving device according to claim 14 , wherein the respective downstream parts of the plurality of the sub-flow passages have a spiral shape around a normal line perpendicular to the contacting surface and the portions of the sub-flow passages forming the spiral shape are adjacent to each other.

Assignees

• Fujitsu Ltd

Inventors

• Taguchi Jun

Classifications

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20145

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20218 Primary

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title