Method for forming a via structure using a double-side laser process

Patent metadata

Field	Value
Publication number	US-2016353585-A1
Application number	US-201615236794-A
Country	US
Kind code	A1
Filing date	Aug 15, 2016
Priority date	Mar 10, 2014
Publication date	Dec 1, 2016
Grant date	—

Abstract

Embodiments include a multi-layer apparatus comprising a first dielectric layer, a second dielectric layer, a third dielectric layer and a fourth dielectric layer, wherein one or more of the dielectric layers include metal layers. The multi-layer apparatus further comprises a first via coupling a first metal layer and a second metal layer, a second via coupling the second metal layer and a fourth metal layer, a third via coupling the first metal layer and the second metal layer, and a fourth via coupling the third metal layer and the fourth metal layer. The first via is contiguous with the second via and the third via is contiguous with the fourth via. At least some of the vias have different depths relative to one another.

First claim

What is claimed is:

1 . A method of making a multilayer substrate, the method comprising:
providing a first dielectric layer, wherein a first side of the first dielectric layer comprises a first metal layer, and wherein a second side of the first dielectric layer comprises a second metal layer; providing a second dielectric layer, wherein a first side of the second dielectric layer is coupled to the second side of the first dielectric layer, and wherein a second side of the second dielectric layer comprises a third metal layer; providing a third dielectric layer, wherein a first side of the third dielectric layer is coupled to the second side of the second dielectric layer, and wherein a second side of the third dielectric layer comprises a fourth metal layer; forming, using a first laser beam generator that is positioned at a first side of the multi-layer substrate, a first via that couples the first metal layer and the second metal layer; forming, using a second laser beam generator that is positioned at a second side of the multi-layer substrate, a second via that couples the second metal layer and the fourth metal layer, wherein the second side of the multi-layer substrate is opposite the first side of the multi-layer substrate; forming, using the first laser beam generator that is positioned at the first side of the multi-layer substrate, a third via that couples the first metal layer and the third metal layer; and forming, using the second laser beam generator that is positioned at the second side of the multi-layer substrate, a fourth via coupling the third metal layer and the fourth metal layer, wherein the first via is contiguous with the second via.

2 . The method of claim 1 , wherein forming the third via and forming the fourth via comprises:
forming the third via and the fourth via such that (i) the third via and the fourth via are offset with respect to each other and (ii) a portion of the third via that contacts the third metal layer does not even partially overlap with a portion of the fourth via that contacts the third metal layer.

3 . The method of claim 1 , wherein forming the third via and forming the fourth via comprises:
forming the third via and the fourth via such that (i) the third via and the fourth via are offset with respect to each other, (ii) a first portion of the third via contacts the third metal layer, (iii) a second portion of the fourth via contacts the third metal layer, (iv) the first portion of the third via that contacts the third metal layer does not even partially overlap with the second portion of the fourth via that contacts the third metal layer, and (v) the first portion of the third via is electrically coupled to the second portion of the fourth via through the third metal layer.

4 . The method of claim 1 , further comprising:
forming, using the first laser beam generator, a fifth via between the first metal layer and a section of the second dielectric layer; and forming, using the second laser beam generator, a sixth via between the section of the second dielectric layer and the fourth metal layer, wherein the fifth via is contiguous with the sixth via.

5 . The method of claim 4 , wherein:
no metal layer is present between the fifth via and the sixth via.

6 . The method of claim 4 , wherein:
the fifth via penetrates the first dielectric layer and at least a first part of the second dielectric layer; and the sixth via penetrates the third dielectric layer and at least a second part of the second dielectric layer.

7 . The method of claim 1 , wherein the first via, the second via, the third via and the fourth via are formed such that at least some of the vias have different depths relative to one another.

8 . The method of claim 1 , further comprising:
patterning the first side of the first dielectric layer to provide the first metal layer; and patterning the second side of the first dielectric layer to provide the second metal layer.

9 . The method of claim 1 , wherein the first dielectric layer is pre-patterned to provide the first metal layer on the first side and the second metal layer on the second side.

10 . The method of claim 1 , further comprising:
laminating the first side of the second dielectric layer to the second side of the first dielectric layer.

11 . The method of claim 1 , further comprising:
laminating the first side of the third dielectric layer to the second side of the second dielectric layer.

12 . The method of claim 1 , further comprising:
providing a fourth dielectric layer, wherein a first side of the fourth dielectric layer is coupled to the second side of the third dielectric layer, and wherein a second side of the fourth dielectric layer comprises a fifth metal layer; and forming a fifth via that couples the fifth metal layer and the first metal layer.

13 . The method of claim 1 , wherein the multilayer substrate comprises a printed circuit board (PCB).

14 . The method of claim 1 , further comprising:
filing each of the first via, second via, third via and the fourth via with conductive material.

15 . The method of claim 1 , wherein forming the first via comprises:
forming the first via such that the first via has a tapered shape.

Assignees

• Marvell World Trade Ltd

Inventors

• Kao Huahung
• Liou Shiann-Ming

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/095 Primary

  of vias therein · CPC title

• H05K2201/09527

  Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms · CPC title