Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Light emitting diode display device and manufacturing method thereof
US2016351548A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016351548-A1 |
| Application number | US-201514723475-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 28, 2015 |
| Priority date | May 28, 2015 |
| Publication date | Dec 1, 2016 |
| Grant date | — |
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Abstract
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A manufacturing method of a light emitting diode (LED) display device includes forming at least one sub-pixel circuit on a substrate, forming a primary electrical pad and a first backup electrical pad electrically connected to the sub-pixel circuit, disposing a first micro light emitting device on the primary electrical pad and testing the first micro light emitting device.
First claim
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1 - 18 . (canceled) 19 . An LED display device, comprising: a substrate comprising at least one sub-pixel; at least one sub-pixel circuit disposed on the substrate; a plurality of electrical pads disposed inside the sub-pixel and electrically connected with the sub-pixel circuit; and a micro light emitting device disposed on one of the electrical pads. 20 . The LED display device of claim 19 , further comprising: a defective micro light emitting device disposed on another one of the electrical pads, wherein the sub-pixel circuit is unconnected with said another one of the electrical pads. 21 . The LED display device of claim 20 , further comprising: a passivation layer covers the micro light emitting device and the defective micro light emitting device, wherein the passivation layer has at least one opening to expose a portion of the micro light emitting device; and at least one opposite electrode electrically connected to the exposed portion of the micro light emitting device. 22 . The LED display device of claim 21 , wherein the at least one opening exposes a portion of the defective micro light emitting device, and the LED display device further comprises an insulating layer to cover the exposed portion of the defective micro light emitting device. 23 . The LED display device of claim 20 , wherein the micro light emitting device and the defective micro light emitting device are a micro LED. 24 . The LED display device of claim 19 , wherein the plurality of the electrical pads have substantially the same shape. 25 . The LED display device of claim 19 , wherein the plurality of the electrical pads have variety of shapes.
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Frequently asked questions
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- What does patent US2016351548A1 cover?
- A manufacturing method of a light emitting diode (LED) display device includes forming at least one sub-pixel circuit on a substrate, forming a primary electrical pad and a first backup electrical pad electrically connected to the sub-pixel circuit, disposing a first micro light emitting device on the primary electrical pad and testing the first micro light emitting device.
- Who is the assignee on this patent?
- Mikro Mesa Tech Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Dec 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).