Apparatus and method for treating substrate

Patent metadata

Field	Value
Publication number	US-2016351385-A1
Application number	US-201615165020-A
Country	US
Kind code	A1
Filing date	May 26, 2016
Priority date	May 29, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.

First claim

What is claimed is:

1 . An apparatus for treating a substrate, the apparatus comprising:
a housing configured to provide an internal space for a substrate treating process; a supporting unit on that the substrate is mounted in the housing; an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemicals, to the substrate that is mounted on the supporting unit; and a controller configured to supply the first chemical before supplying the second chemical and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.

2 . The apparatus of claim 1 , wherein the controller is configured to control the first chemical to be supplied as a chemical, which contains isopropyl alcohol, if the thin film is a hydrophobic film.

3 . The apparatus of claim 1 , wherein the controller is configured to control the first chemical to be supplied as a chemical, which contains deionized water, if the thin film is a hydrophilic film.

4 . A method for treating a substrate, the method comprising:
pre-treating the substrate by supplying a pre-wetting chemical to the substrate; and treating the substrate by supplying a treatment chemical to the substrate after the pre-treating, wherein the pre-treating comprises supplying the pre-wetting chemical that is variable according to a type of thin film on the substrate.

5 . The method of claim 4 , wherein if the thin film is a hydrophobic film, the pre-wetting chemical contains isopropyl alcohol.

6 . The method of claim 4 , wherein if the thin film is a hydrophilic film, the pre-wetting chemical contains deionized water.

Assignees

• Semes Co Ltd

Inventors

• Kim Dae Min
• Lee Sul
• Lee Bok Kyu
• Lee Jae Myoung

Classifications

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P70/15 Primary

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P72/0404 Primary

  for general liquid treatment, e.g. etching followed by cleaning · CPC title