Coil electronic component

Patent metadata

Field	Value
Publication number	US-2016351319-A1
Application number	US-201615082539-A
Country	US
Kind code	A1
Filing date	Mar 28, 2016
Priority date	May 29, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

A coil electronic component includes a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; a body region filling at least a core region of the coil pattern and having a magnetic material; and a lead portion forming a portion of an outermost region of the coil pattern and exposed to the outside of the body region. A distance between the lead portion and a portion of the coil pattern which is immediately adjacent to the lead portion and which is disposed between the lead portion and a center of the coil pattern is larger than a distance between adjacent patterns of the coil pattern.

First claim

What is claimed is:

1 . A coil electronic component comprising:
a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; a body region filling at least a core region of the coil pattern and having a magnetic material; and a lead portion forming a portion of an outermost region of the coil pattern and exposed to the outside of the body region, wherein a distance d between the lead portion and a portion of the coil pattern which is immediately adjacent to the lead portion and which is disposed between the lead portion and a center of the coil pattern is larger than a distance c between adjacent patterns of the coil pattern.

2 . The coil electronic component of claim 1 , wherein the coil pattern has a spiral shape, and a surface toward the coil pattern of the lead portion is curved.

3 . The coil electronic component of claim 2 , wherein a radius of curvature of the curved surface of the lead portion is different from that of the coil pattern.

4 . The coil electronic component of claim 3 , wherein the radius of curvature of the curved surface of the lead portion is smaller than that of the coil pattern.

5 . The coil electronic component of claim 1 , wherein a width a of the coil pattern and a width b of the narrowest portion of the lead portion satisfy 2a/3−b.

6 . The coil electronic component of claim 1 , wherein the distances c and d satisfy 1.5c<d.

7 . The coil electronic component of claim 1 , wherein the coil pattern is formed by plating.

8 . The coil electronic component of claim 1 , wherein the coil pattern includes first and second coil patterns disposed on the first and second main surfaces of the substrate, respectively.

9 . The coil electronic component of claim 1 , further comprising external electrodes formed on surfaces of the body region and connected to the lead portion.

10 . The coil electronic component of claim 1 , wherein the body region contains metal magnetic powder and a thermosetting resin.

11 . The coil electronic component of claim 1 , wherein an entire surface of the lead portion toward the coil pattern is curved.

12 . The coil electronic component of claim 1 , wherein the lead portion includes a distal portion having a flat surface facing the coil pattern.

13 . A coil electronic component comprising:
a substrate; a coil pattern formed on at least one of first and second main surfaces of the substrate; a body region filling at least a core region of the coil pattern and having a magnetic material; and a lead portion forming a portion of an outermost region of the coil pattern and exposed to the outside of the body region, wherein an inner side of the lead portion has a concave shape.

14 . The coil electronic component of claim 13 , wherein a radius of curvature of the concave shape is smaller than that of the coil pattern.

15 . The coil electronic component of claim 13 , wherein a distance d between the lead portion and a portion of the coil pattern which is immediately adjacent to the lead portion and which is disposed between the lead portion and a center of the coil pattern is larger than a distance c between adjacent patterns of the coil pattern.

16 . The coil electronic component of claim 15 , wherein the distances c and d satisfy 1.5c<d.

17 . The coil electronic component of claim 13 , wherein a width a of the coil pattern and a width b of the narrowest portion of the lead portion satisfy 2a/3<b.

18 . A method for forming a coil electronic component, the method comprising:
plating a coil pattern and a lead portion directly connected to the coil pattern on a substrate; forming a body region to embed the coil pattern and the lead portion, the lead portion exposed to the outside of the body region; and forming an external electrode on a surface of the body region to electrically connected to the lead portion, wherein a distance d between the lead portion and a portion of the coil pattern which is immediately adjacent to the lead portion and which is disposed between the lead portion and a center of the coil pattern is larger than a distance c between adjacent patterns of the coil pattern.

19 . The method of claim 18 , further comprising:
forming a through-hole in a central region of the substrate; and filling the through-hole with a magnetic material to form a core region.

20 . The method of claim 18 , further comprising:
removing a portion of the lead portion so that the distance between the lead portion and the portion of the coil pattern which is immediately adjacent to the lead portion and which is disposed between the lead portion and the center of the coil pattern is increased to d.

Assignees

• Samsung Electro Mech

Inventors

• Jeong Dong Jin

Classifications

• H01F17/0013 Primary

  with stacked layers · CPC title

• H01F2017/0073

  with a special conductive pattern, e.g. flat spiral · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F27/29

  Terminals; Tapping arrangements {for signal inductances} · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title