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US-2024354038-A1 · Oct 24, 2024 · US
Micro heat pipe cooling system
US2016349809A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016349809-A1 |
| Application number | US-201514726354-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 29, 2015 |
| Priority date | May 29, 2015 |
| Publication date | Dec 1, 2016 |
| Grant date | — |
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- Title
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Abstract
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At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.
First claim
Opening claim text (preview).
1 . A system for cooling a memory device, the system comprising: one or more thermally conductive bodies in which are embedded a plurality of micro heat pipes; wherein, the one or more thermally conductive bodies are arranged on one or more memory chips of the memory device such that the embedded micro heat pipes run lengthwise along a minor axis of a PCB plane of the memory device; and the one or more thermally conductive bodies are in contact with at least one heat spreader to transfer at least some of the heat from the one or more thermally conductive bodies to air surrounding the memory device. 2 . The system of claim 1 , wherein the at least one heat spreader is connected to a ground plane of the PCB of the memory device. 3 . The system of claim 1 , wherein the at least one heat spreader is free floating on top of the PCB of the memory device. 4 . The system of claim 1 , wherein the embedded micro heat pipes contain a fluid having a low boiling point. 5 . The system of claim 1 , wherein the one or more thermally conductive bodies on each side of a double sided memory device are attached to a side plate of the double sided memory device. 6 . The system of claim 1 , wherein the at least one heat spreader is a finned heat spreader.
Assignees
Inventors
Classifications
Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title
for cooling by change of state · CPC title
Arrangements for heating · CPC title
Cooling arrangements using cooling fluid · CPC title
- G06F1/20Primary
Cooling means · CPC title
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Frequently asked questions
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- What does patent US2016349809A1 cover?
- At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.
- Who is the assignee on this patent?
- Corsair Memory Inc
- What technology area does this patent fall under?
- Primary CPC classification G06F1/20. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Dec 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).