Electronic component having function to detect manufacturing defects or damage/degradation and printed wiring board

US2016349307A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016349307-A1
Application numberUS-201615166216-A
CountryUS
Kind codeA1
Filing dateMay 26, 2016
Priority dateMay 27, 2015
Publication dateDec 1, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic component having a plurality of terminals arranged on a bottom side of a package and mounted on a printed wiring board includes at least one detection terminal as a portion of the plurality of terminals, the detection terminal being connected to a ground outside the electronic component, wherein the detection terminal is connected to an input port of an input buffer and one end of a resistor inside the electronic component, the other end of the resistor is connected to a power supply, and the input buffer detects a poor connection of a solder joint or a socket by outputting a first binary signal obtained by binarizing a voltage level input into the input buffer using a predetermined threshold.

First claim

Opening claim text (preview).

1 . An electronic component having a plurality of terminals arranged on a bottom side of a package and mounted on a printed wiring board, the electronic component comprising at least one detection terminal as a portion of the plurality of terminals, the detection terminal being connected to a ground outside the electronic component, wherein the detection terminal is connected to an input port of an input buffer and one end of a resistor inside the electronic component, the other end of the resistor is connected to a power supply, and the input buffer outputs a first binary signal obtained by binarizing a voltage level input into the input buffer using a predetermined threshold. 2 . An electronic component having a plurality of terminals arranged on a bottom side of a package and mounted on a printed wiring board, the electronic component comprising at least one detection terminal as a portion of the plurality of terminals, the detection terminal being connected to a power supply outside the electronic component, wherein the detection terminal is connected to an input port of an input buffer and one end of a resistor inside the electronic component, the other end of the resistor is connected to a ground, and the input buffer outputs a first binary signal obtained by binarizing a voltage level input into the input buffer using a predetermined threshold. 3 . The electronic component according to claim 1 , further comprising a latch circuit into which the first binary signal output by the input buffer is input, wherein the latch circuit outputs a second binary signal, outputs a first level as the second binary signal while the first binary signal input from the input buffer is at the first level, and retains output of a second level after the first binary signal output by the input buffer once becomes the second level. 4 . The electronic component according to claim 3 , further comprising a reset input terminal, wherein when a reset signal is input from the reset input terminal, the latch circuit is initialized. 5 . A printed wiring board on which the electronic component according to claim 1 is mounted is characterized in that at least one pad to which the detection terminal of the electronic component is soldered is different in its area or shape from the pads to which other terminals of the electronic component are soldered.

Assignees

Inventors

Classifications

  • between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

  • comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

  • Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title

  • Interconnections for measuring or testing, e.g. probe pads · CPC title

  • H03K19/20Primary

    characterised by logic function, e.g. AND, OR, NOR, NOT circuits (H03K19/003 - H03K19/01 take precedence) · CPC title

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What does patent US2016349307A1 cover?
An electronic component having a plurality of terminals arranged on a bottom side of a package and mounted on a printed wiring board includes at least one detection terminal as a portion of the plurality of terminals, the detection terminal being connected to a ground outside the electronic component, wherein the detection terminal is connected to an input port of an input buffer and one end of…
Who is the assignee on this patent?
Fanuc Corp
What technology area does this patent fall under?
Primary CPC classification H03K19/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Dec 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).