Thermopile module

Patent metadata

Field	Value
Publication number	US-2016349114-A1
Application number	US-201514972563-A
Country	US
Kind code	A1
Filing date	Dec 17, 2015
Priority date	May 30, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

First claim

What is claimed is:

1 . An electronic device, comprising:
an outer case having an opening; a circuit substrate disposed inside the outer case; a thermopile sensor chip disposed on the circuit substrate; a filter structure disposed above the thermopile sensor chip; a waterproof structure surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case.

2 . The electronic device as claimed in claim 1 , wherein the thermopile sensor chip is electrically connected to the circuit substrate by wire-bonding or flip-chip bonding.

3 . The electronic device as claimed in claim 1 , wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

4 . The electronic device as claimed in claim 3 , wherein the opening of the outer case and the through hole of the waterproof structure are filled with an infrared passing glue.

5 . The electronic device as claimed in claim 3 , wherein the filter structure has a filter covering portion and a filter supporting portion, the filter covering portion is suspended above the thermopile sensor chip and connected to the waterproof structure, and the filter supporting portion is extended downwardly from the filter covering portion to contact the circuit substrate for supporting the filter covering portion.

6 . The electronic device as claimed in claim 3 , further comprising a support structure disposed between the circuit substrate and the waterproof structure for supporting the waterproof structure.

7 . The electronic device as claimed in claim 6 , wherein the opening of the outer case and the through hole of the waterproof structure are filled with an infrared passing glue.

8 . The electronic device as claimed in claim 1 , wherein the waterproof structure disposed on the circuit substrate for encapsulating the thermopile sensor chip and the filter structure.

9 . The electronic device as claimed in claim 1 , wherein the waterproof structure includes a first waterproofing element, a second waterproofing element, and a support structure, the first waterproofing element is surroundingly connected onto the filter structure, the second waterproofing element is surroundingly connected onto the outer case, the support structure is disposed between the first waterproofing element and the second waterproofing element, and the support structure has a first support portion connected between the first waterproofing element and the second waterproofing element and a second support portion extended downwardly from the first support portion to contact the circuit substrate for supporting the second waterproofing element.

10 . The electronic device as claimed in claim 9 , wherein the first waterproofing element has a first through hole, the second waterproofing element has a second through hole communicated with the opening of the outer case, the first support portion has a third through hole communicated between the first through hole and the second through hole, and the opening of the outer case and the first, the second, and the third through holes of the waterproof structure are filled with an infrared passing glue.

11 . The electronic device as claimed in claim 3 , wherein the filter structure has a filter covering portion and a filter supporting portion, the filter covering portion is suspend above the thermopile sensor chip and connected to the waterproof structure, and the filter supporting portion is extended downwardly from the filter covering portion to contact the circuit substrate for supporting the filter covering portion.

12 . The electronic device as claimed in claim 11 , wherein the opening of the outer case and the through hole of the waterproof structure are filled with an infrared passing glue.

13 . A electronic device, comprising:
an outer case having an opening; a circuit substrate disposed inside the outer case; a thermopile sensor chip disposed on the circuit substrate; and a waterproof structure disposed on the outer case for sealing up the opening of the outer case.

14 . The electronic device as claimed in claim 13 , wherein the thermopile sensor chip is electrically connected to the circuit substrate by wire-bonding or flip-chip bonding.

15 . The electronic device as claimed in claim 13 , wherein the waterproof structure is a filter structure disposed above the thermopile sensor chip.

16 . The electronic device as claimed in claim 15 , further comprising an isolation structure surroundingly connected onto the filter structure, and the isolation structure having an aperture for exposing the filter structure.

17 . The electronic device as claimed in claim 13 , further comprising a filter structure disposed on the thermopile sensor chip.

18 . The electronic device as claimed in claim 17 , wherein the waterproof structure is an infrared pass structure disposed above the filter structure.

19 . The electronic device as claimed in claim 17 , wherein the waterproof structure includes a first waterproofing element which is an waterproofing glue and a second waterproofing element which is an infrared pass structure, the first waterproofing element is surroundingly connected on the outer case, and the second waterproofing element is disposed on the first waterproofing element for sealing up the opening of the outer case.

20 . The electronic device as claimed in claim 19 , wherein the first waterproofing element has a through hole communicated with the opening of the outer case.

21 . The electronic device as claimed in claim 13 , wherein the outer case is covered with the waterproof structure which is an infrared pass structure.

22 . The electronic device as claimed in claim 21 , further comprising a dust preventing structure, wherein the dust preventing structure is disposed on the circuit substrate for encapsulating the thermopile sensor chip and the filter structure.

23 . The electronic device as claimed in claim 21 , wherein the waterproof structure has a through hole passing through the opening of the outer case for exposing the dust preventing structure.

Assignees

• Pixart Imaging Inc

Inventors

• Tsai Ming-Han
• Sun Chih-Ming
• Liao Jian-Cheng

Classifications

• G01J5/12

  using thermoelectric elements, e.g. thermocouples · CPC title

• G01J5/041 Primary

  Mountings in enclosures or in a particular environment · CPC title

• G01J5/048 Primary

  Protective parts · CPC title

• G01J5/05

  Means for preventing contamination of the components of the optical system; Means for preventing obstruction of the radiation path · CPC title

• G01J5/0802

  Optical filters · CPC title