Packaged sensor assembly

Patent metadata

Field	Value
Publication number	US-2016347606-A1
Application number	US-201514962945-A
Country	US
Kind code	A1
Filing date	Dec 8, 2015
Priority date	May 29, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

A packaged sensor assembly includes: a packaging structure, having at least one opening; a humidity sensor and a pressure sensor, which are housed inside the packaging structure and communicate fluidically with the outside through the opening, and a control circuit, operatively coupled to the humidity sensor and to the pressure sensor; wherein the humidity sensor and the control circuit are integrated in a first chip, and the pressure sensor is integrated in a second chip distinct from the first chip and bonded to the first chip.

First claim

1 . A packaged sensor assembly comprising:
a packaging structure having an opening; a first semiconductor chip that integrates a humidity sensor and a control circuit operatively coupled to the humidity sensor, the humidity sensor housed inside the packaging structure and in fluid communication with an environment external to the sensor assembly through the opening; and a second semiconductor chip that integrates a MEMS pressure sensor bonded to the first semiconductor chip, the pressure sensor operatively coupled to the control circuit, the pressure sensor housed inside the packaging structure and in fluid communication with the environment external to the sensor assembly through the opening.

2 . The sensor assembly according to claim 1 , wherein the pressure sensor includes a membrane delimiting a cavity in the second semiconductor chip.

3 . The sensor assembly according to claim 2 , wherein the second semiconductor chip includes a supporting portion and a sensor portion, the sensor portion integrating the membrane, the membrane coupled to the supporting portion by elastic connection elements.

4 . The sensor assembly according to claim 3 , wherein the elastic connection elements are configured to enable relative movements of the sensor portion with respect to the supporting portion in two independent directions parallel to a face of the second semiconductor chip and rotations about axes perpendicular to the face.

5 . The sensor assembly according to claim 3 , wherein the packaging structure includes a substrate and a first cap.

6 . The sensor assembly according to claim 5 , wherein the first semiconductor chip is arranged between the second semiconductor chip and the substrate.

7 . The sensor assembly according to claim 5 , wherein:
the first cap is bonded to a face of the second semiconductor chip, wherein the opening is provided in the first cap; the humidity sensor is exposed by the opening in the first cap; and the supporting portion of the second semiconductor chip has a respective through opening aligned to the opening in the first cap.

8 . The sensor assembly according to claim 7 , comprising a second cap arranged between the first semiconductor chip and the second semiconductor chip and has a respective opening aligned to the opening in the first cap.

9 . The sensor assembly according to claim 5 , wherein the opening is a first opening and provided in the substrate, and the first semiconductor chip includes a second opening at least partially aligned with the first opening.

10 . The sensor assembly according to claim 5 , wherein the membrane faces the first cap.

11 . The sensor assembly according to claim 5 , wherein the second semiconductor chip is arranged between the first semiconductor chip and the substrate, and the first cap is defined by the first semiconductor chip.

12 . The sensor assembly according to claim 5 , wherein the opening is provided in the first semiconductor chip.

13 . The sensor assembly according to claim 12 , wherein the second semiconductor chip includes conductive through vias and the first semiconductor chip is electrically coupled to conductive structures on the substrate through the conductive through vias.

14 . The sensor assembly according to claim 2 , wherein the membrane is at a face of the second semiconductor chip opposite to the opening.

15 . The sensor assembly according to claim 1 , wherein the packaging structure is a molding material.

16 . An electronic system comprising:
a control unit; and a sensor assembly operative coupled to the control unit, the sensor assembly including:
a packaging body having a through opening that places an area internal to the packaging body in fluid communication with an environment external to the sensor assembly;
a first semiconductor chip that integrates a humidity sensor and a control circuit operatively coupled to the humidity sensor, the humidity sensor housed in the internal area to the packaging body and in fluid communication with the environment external to the sensor assembly through the opening; and
a second semiconductor chip that integrates a MEMS pressure sensor bonded to the first semiconductor chip, the pressure sensor housed inside the packaging body and in fluid communication with the environment external the sensor assembly through the opening, the pressure sensor operatively coupled to the control circuit.

17 . The electronic system according to claim 16 , wherein the package body includes a substrate and a cap.

18 . The electronic system according to claim 16 , wherein the opening is a first opening, the second semiconductor chip including a second opening at least partially aligned with the first opening, the first and second openings exposing the humidity sensor of the first semiconductor chip.

19 . The electronic system according to claim 16 , wherein the electronic system is at least one of a smartphone, tablet, and wearable device.

20 . The electronic system according to claim 16 , wherein the second semiconductor chip is arranged between the first semiconductor chip and a substrate.

21 . A sensor assembly comprising:
a packaging structure including a substrate, a cap, and molding material, the packaging structure including a through opening; a first semiconductor chip that integrates a humidity sensor and a control circuit, the control circuit being operatively coupled to the humidity sensor, the humidity sensor housed within the packaging structure such that the humidity sensor is in fluid communication with an environment external through the opening; and a second semiconductor chip coupled to the first semiconductor chip, the second semiconductor chip integrating a pressure sensor that is operatively coupled to control circuit, the pressure sensor housed inside the packaging structure and in fluid communication with the environment external to the sensor assembly through the opening.

22 . The sensor assembly according to claim 21 , wherein the first semiconductor chip is arranged between the second semiconductor chip and the substrate.

23 . The sensor assembly according to claim 21 , wherein the opening is a first opening and provided in the substrate, and the first semiconductor chip includes a second opening at least partially aligned with the first opening.

Assignees

• St Microelectronics Srl

Inventors

• Bruno Giuseppe
• Conti Sebastiano
• Chiricosta Mario
• Vaiana Michele
• Ippolito Calogero Marco
• Maiore Mario
• Casella Daniele

Classifications

• H10W90/732

  between stacked chips · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• B81B2201/0292

  Sensors not provided for in B81B2201/0207 - B81B2201/0285 · CPC title