Crosstalk, power supply noise and/or emi reduction methods and apparatuses

Patent metadata

Field	Value
Publication number	US-2016344085-A1
Application number	US-201514716101-A
Country	US
Kind code	A1
Filing date	May 19, 2015
Priority date	May 19, 2015
Publication date	Nov 24, 2016
Grant date	—

Abstract

Apparatuses and methods associated with shield lines, and/or complementary decoupling capacitors and/or electromagnetic absorbing materials are disclosed herein. In embodiments, an apparatus may include a substrate having a ground plane; and a first and a second transmission line disposed on the substrate. Further, the apparatus may include a shield line constituted with electromagnetic absorbing material disposed between the first and second transmission lines and not coupled with the ground plane. In embodiments, the substrate may further include a power plane having a plurality of edges and a plurality of spacing; a plurality of decoupling capacitors disposed on the power or ground plane; and electromagnetic absorbing materials adhered to the plurality of edges and disposed in the plurality of spacing. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1 . An apparatus, comprising:
a substrate having a ground plane; a first and a second transmission line disposed on or integrated with the substrate; and a shield line constituted with electromagnetic absorbing material disposed between the first and second transmission lines, and not coupled to the ground plane.

2 . The apparatus of claim 1 , wherein the shield line is constituted with electromagnetic absorbing material that attenuates electromagnetic noises from 5 MHz to 40 GHz.

3 . The apparatus of claim 1 , wherein the substrate further comprises a dielectric layer disposed on top of the ground plane; and the first and second transmission lines are microstrips disposed on the substrate.

4 . The apparatus of claim 3 , wherein the first and second transmission lines are respective members of a first and a second microstrip pairs.

5 . The apparatus of claim 1 , further comprising a soldermask covering the first and second transmission lines and the shield line.

6 . The apparatus of claim 5 , wherein both the soldermask and the shield line have a same height.

7 . The apparatus of claim 5 , wherein the shield line has a first height, and the soldermask has a second height greater than the first height.

8 . The apparatus of claim 1 , wherein the substrate further comprises a dielectric layer disposed on top of the ground plane; the first and second transmission lines and the shield line are integrated within the dielectric layer; the apparatus further includes another ground plane disposed on top of the dielectric layer; and the first and second transmission lines are striplines.

9 . The apparatus of claim 8 , wherein the first and second transmission lines are respective members of a first and a second stripline pairs.

10 . A method, comprising:
forming a substrate having a ground plane; forming a first and a second transmission line on or integrated with the substrate; and forming a shield line constituted with electromagnetic absorbing material between the first and second transmission lines, and not coupled with the ground plane.

11 . The method of claim 10 , wherein forming a shield line comprises forming a shield line constituted with electromagnetic absorbing material that attenuates electromagnetic noises from 5 MHz to 40 GHz.

12 . The method of claim 10 , wherein the substrate further comprises a dielectric layer disposed on top of the ground plane; wherein forming the first and second transmission lines comprises disposing first and second microstrips on the substrate.

13 . The method of claim 12 , wherein disposing first and second microstrips on the substrate comprises disposing first and second members of a first and a second microstrip pairs on the substrate.

14 . The method of claim 11 , further comprising forming a soldermask to cover the first and second transmission lines and the shield line.

15 . The method of claim 14 , wherein forming a soldermask comprises forming a soldermask have a same height as the shield line.

16 . The method of claim 15 , wherein the shield line has a first height, and forming a soldermask comprises forming a soldermask have a second height greater than the first height.

17 . The method of claim 11 , wherein the substrate further comprises a dielectric layer disposed on top of the ground plane; the first and second transmission lines and the shield line are integrated within the dielectric layer; and the method further includes forming another ground plane disposed on top of the dielectric layer; wherein forming the first and second transmission lines comprises first and second striplines.

18 . The method of claim 11 , wherein disposing the first and second transmission lines comprises disposing respective members of a first and a second stripline pairs.

19 . An apparatus comprising:
a substrate having a power or ground plane, wherein the power or ground plane includes a plurality of edges and a plurality of spacing; a plurality of decoupling capacitors disposed on the power or ground plane; and electromagnetic absorbing materials adhered to the plurality of edges and disposed in the plurality of spacing.

20 . The apparatus of claim 19 , wherein the decoupling capacitor are disposed on the power or ground plane where resonance characteristics are modulated with the electromagnetic absorbing material.

21 . The apparatus of claim 19 , wherein the electromagnetic absorbing materials are pasted, glued, taped, or painted onto the edges.

22 . The apparatus of claim 19 , wherein a thickness of the electromagnetic absorbing materials adhered to an edge is about 10 mils; and the plurality of spacing are about 10 mils.

23 . A method, comprising:
forming a power or ground plane of a substrate; disposing a plurality of decoupling capacitors on the power or ground plane; adhering electromagnetic absorbing materials to edges of the power or ground plane; and disposing electromagnetic absorbing materials a plurality of spacing of the power or ground plane.

24 . The method of claim 23 , wherein disposing the decoupling capacitor comprises disposing the decoupling capacitor on the power or ground plane where resonance characteristics are modulated with the electromagnetic absorbing material; and adhering the electromagnetic absorbing materials comprises pasting, gluing, taping, or painting the electromagnetic absorbing materials onto the edges.

25 . The method of claim 23 , wherein adhering the electromagnetic absorbing materials comprises adhering a thickness of the electromagnetic absorbing materials of about adhered 10 mils to an edge; and disposing the electromagnetic absorbing materials comprises disposing electromagnetic absorbing materials of about 10 mils in the plurality of spacing.

Assignees

• Intel Corp

Inventors

• Huang Shaowu
• Zhang Hanqiao
• Xiao Kai
• Lee Beom-Taek
• Abbott John J
• Charles Gary

Classifications

• H01P3/081 Primary

  Microstriplines · CPC title

• H04B3/32

  Reducing cross-talk, e.g. by compensating · CPC title

• H01P11/003

  Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title

• H05K9/00

  Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) · CPC title

• H05K2201/083

  Magnetic materials · CPC title