Light-emitting device and method of producing a light-emitting device

Patent metadata

Field	Value
Publication number	US-2016343971-A1
Application number	US-201515112517-A
Country	US
Kind code	A1
Filing date	Jan 20, 2015
Priority date	Jan 23, 2014
Publication date	Nov 24, 2016
Grant date	—

Abstract

A light-emitting device includes a substrate having a substrate upper side, a layer sequence arranged on the substrate upper side and having at least one active, light-emitting, organic layer, wherein the layer sequence includes a plurality of emission regions that emit light, current-conducting rails which are a part of the layer sequence, wherein, in a plan view of the substrate upper side, the emissionr egions of the layer sequence are arranged next to the current-conducting rails, an encapsulation glass, wherein the layer sequence is arranged between the substrate and the encapsulation glass, and spacers formed as elevations on an encapsulation glass underside and facing towards the layer sequence of the encapsulation glass, wherein, in a plan view of the substrate upper side, the spacers at least partly overlap with the current-conducting rails, and the spacers prevent direct contact between the encapsulation glass and the layer sequence in the emission regions.

First claim

1 - 16 (canceled)

17 . A light-emitting device comprising:
a substrate having a substrate upper side; a layer sequence arranged on the substrate upper side and having at least one active, light-emitting, organic layer, wherein the layer sequence comprises a plurality of emission regions that emit light; current-conducting rails which are a part of the layer sequence, wherein, in a plan view of the substrate upper side, the emission regions of the layer sequence are arranged next to the current-conducting rails; an encapsulation glass, wherein the layer sequence is arranged between the substrate and the encapsulation glass; and spacers formed as elevations on an encapsulation glass underside and facing towards the layer sequence of the encapsulation glass, wherein, in a plan view of the substrate upper side, the spacers at least partly overlap with the current-conducting rails, and the spacers prevent direct contact between the encapsulation glass and the layer sequence in the emission regions.

18 . The light-emitting device according to claim 17 , wherein
the spacers are formed as buffer points, wherein the buffer points are mutually spaced-apart, dome-shaped elevations arranged in matrix in a regular pattern on the encapsulation glass underside, and the current-conducting rails intersect at intersection points and, in a plan view of the substrate upper side, the buffer points at least partly overlap with the intersection points of the current-conducting rails.

19 . The light-emitting device according to claim 17 , wherein
the current-conducting rails are embedded in the substrate, the light-emitting device comprises a first electrode and a second electrode, the second electrode is arranged downstream of the active organic layer in a direction away from the substrate upper side, and insulating material is arranged in the form of rails between the active organic layer and the second electrode so that, in a plan view of the substrate upper side, the current-conducting rails at least partly overlap with the insulating material.

20 . The light-emitting device according to claim 17 , wherein the current-conducting rails are arranged between the active organic layer and the substrate.

21 . The light-emitting device according to claim 17 , wherein
the layer sequence comprises an anode, wherein the anode is arranged between the current-conducting rails and the substrate, the anode comprises a different material than the current-conducting rails and is transparent to the light emitted by the active organic layer, the layer sequence comprises a cathode, and the cathode is arranged downstream of the active organic layer in a direction away from the substrate upper side and is formed to be reflective to the light emitted by the active organic layer.

22 . The light-emitting device according to claim 17 , wherein the spacers are at least temporarily not in direct contact with the layer sequence.

23 . The light-emitting device according to claim 17 , wherein the spacers are at least partly in direct contact with the layer sequence in the region of the current-conducting rails.

24 . The light-emitting device according to claim 17 , wherein the layer sequence has a lateral extent in parallel with the substrate upper side of 2 cm to 35 cm,
the buffer points have a lateral extent along the encapsulation glass underside of 50 μm to 300 μm and a thickness of 10 μm to 50 μm, the current-conducting rails have a width of 60 μm to 150 μm and a thickness of 3 μm to 6 ∥m, and the spacing between two adjacent intersection points of the current-conducting rails is 1 mm to 5 mm.

25 . The light-emitting device according to claim 17 , further comprising:
an edge region of the substrate upper side at least partly free from the layer sequence; and an adhesive layer applied in the edge region to the substrate upper side, wherein the adhesive layer contacts the encapsulation glass underside and mechanically connects the substrate to the encapsulation glass.

26 . The light-emitting device according to claim 25 , wherein the adhesive layer comprises a thickness of 10 μm to 80 μm and has a lateral extent along the substrate upper side of 1 mm to 2 cm.

27 . The light-emitting device according to claim 25 , wherein the adhesive layer and the spacers consist of the same material, and the material of the adhesive layer and the spacers is different from the material of the encapsulation glass.

28 . The light-emitting device according to claim 17 , wherein an absorption material is introduced between the layer sequence and the encapsulation glass and absorbs oxygen and/or water.

29 . The light-emitting device according to claim 17 , wherein the layer sequence comprises a thin-film encapsulation at least partly covering all of the sides of the layer sequence not covered by the substrate upper side, and the thin-film encapsulation comprises a layer thickness of 50 nm to 1000 nm and protects the layer sequence against reactions with the surrounding area.

30 . The light-emitting device according to claim 17 , wherein at least one side of the current-conducting rails facing away from the substrate is covered with an insulating material.

31 . A light-emitting device comprising:
a substrate having a substrate upper side; a layer sequence arranged on the substrate upper side and having at least one active, light-emitting, organic layer, wherein the layer sequence comprises a plurality of emission regions that emit light; current-conducting rails which are a part of the layer sequence, wherein, in a plan view of the substrate upper side, the emission regions of the layer sequence are arranged next to the current-conducting rails, and the current-conducting rails intersect at intersection points; an encapsulation glass, wherein the layer sequence is arranged between the substrate and the encapsulation glass; spacers formed as elevations on an encapsulation glass underside and facing towards the layer sequence of the encapsulation glass, wherein the spacers are formed as buffer points, wherein the buffer points are mutually spaced-apart, dome-shaped elevations arranged in a matrix in a regular pattern on the encapsulation glass underside, in a plan view of the substrate upper side, each spacer at least partly overlaps with an intersection point of the current-conducting rails, and the spacers prevent direct contact between the encapsulation glass and the layer sequence in the emission regions.

32 . A method of producing the light-emitting device according to claim 17 , comprising:
providing a substrate having a substrate upper side; applying a layer sequence to the substrate upper side, wherein an edge region of the substrate upper side is provided at least partly to be free from the layer sequence; providing an encapsulation glass having an encapsulation glass underside; applying an adhesive layer to the encapsulation glass underside; applying spacers to the encapsulation glass underside so that the spacers are bordered by the adhesive layer; and joining the substrate and the encapsulation glass together so that the substrate upper side and the encapsulation glass underside face towards one another and the adhesive layer is arranged in the edge region of the substrate upper side.

33 . The method according to claim 32 , wherein the spacers and the adhesive layer comprise the same material and are applied to the encapsulation glass underside in a common screen printing process.

34 . The method according to claim 32 , whe

Assignees

• Osram Oled Gmbh

Inventors

• Dechand Stefan
• Seidel Sarah
• Musa Dieter
• Popp Michael

Classifications

• H10K50/8428

  Vertical spacers, e.g. arranged between the sealing arrangement and the OLED · CPC title

• H10K50/814 Primary

  combined with auxiliary electrodes, e.g. ITO layer combined with metal lines · CPC title

• H01L51/5246

  Electricity · mapped topic

• H01L2251/5361

  Electricity · mapped topic

• H01L51/5212

  Electricity · mapped topic