Method of forming electromagnetic interference shielding layer of ball grid array semiconductor package and base tape for the method

Patent metadata

Field	Value
Publication number	US-2016343671-A1
Application number	US-201615155086-A
Country	US
Kind code	A1
Filing date	May 16, 2016
Priority date	May 19, 2015
Publication date	Nov 24, 2016
Grant date	—

Abstract

Provided are a method of forming an electromagnetic interference (EMI) shielding layer of a ball grid array (BGA) semiconductor package, and a base tape used in the method, and more particularly, a method of forming a shielding layer for blocking EMI, on an upper surface and lateral surfaces of a BGA semiconductor package having a lower surface, on which a plurality of solder balls are formed, and a base tape used in the method.
According to the method of forming an EMI shielding layer of a BGA semiconductor package, the EMI shielding layer may be formed on the BGA semiconductor package quickly, easily, and effectively by using the base tape, thereby not only improving process productivity but also remarkably reducing the manufacturing costs.

First claim

What is claimed is:

1 . A method of forming an electromagnetic interference (EMI) shielding layer of a ball grid array (BGA) semiconductor package on external surfaces of the BGA semiconductor package to shield EMI, the method comprising:
(a) providing a BGA semiconductor package having a lower surface, on which a plurality of solder balls are formed; (b) providing a base tape having an attaching portion that is thicker than a height of the solder balls and is formed of an elastic adhesive material; (c) forming a package-tape assembly by pressing the BGA semiconductor package against the base tape such that the plurality of solder balls of the BGA semiconductor package are sunk into the attaching portion of the base tape and the BGA semiconductor package is adhered to the base tape; (d) forming the EMI shielding layer on the BGA semiconductor package by sputtering a conductive layer on the package-tape assembly; and (e) removing the base tape from the package-tape assembly.

2 . The method of claim 1 , wherein in (c), the BGA semiconductor package is pressed against the base tape so that all external surfaces of the solder balls are surrounded by the attaching portion of the base tape and the lower surface of the BGA semiconductor package contacts the attaching portion of the base tape.

3 . The method of claim 1 , wherein the attaching portion of the base tape is elastically and plastically deformed during (c) so as to cover all of the solder balls of the BGA semiconductor package and to be adhered to the lower surface of the BGA semiconductor package.

4 . The method of claim 1 , wherein in (e), the package-tape assembly is heated to separate the base tape from the BGA semiconductor package.

5 . The method of claim 3 , wherein in (b), ball holes that are concave are formed in the attaching portion of the base tape at positions respectively corresponding to the solder balls of the BGA semiconductor package,
wherein in (c), the package-tape assembly is formed by pressing the BGA semiconductor package against the attaching portion while the solder balls of the BGA semiconductor package are disposed to respectively face the ball holes of the attaching portion.

6 . A base tape used in the method of claim 1 .

Assignees

• Protec Co Ltd

Inventors

• Choi Sung Hwan
• Han Tae Sup

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P14/412

  Deposition of metallic or metal-silicide materials · CPC title

• H10P14/44

  Physical vapour deposition [PVD] · CPC title