Element-accommodating package and mounting structure

Patent metadata

Field	Value
Publication number	US-2016343628-A1
Application number	US-201515111238-A
Country	US
Kind code	A1
Filing date	Jan 23, 2015
Priority date	Jan 24, 2014
Publication date	Nov 24, 2016
Grant date	—

Abstract

An element-accommodating package which can improve frequency characteristics of an element-accommodating package having a coaxial connector, and a mounting structure are provided. An element-accommodating package includes a metallic substrate, a frame, a first coaxial connector, a second coaxial connector, and a circuit board. A groove is provided between one side of the frame and a side surface of the circuit board and between a first signal line and a second signal line.

First claim

1 . A package for accommodating an element, the package comprising:
a substrate comprising:
an upper face comprising:
first and second signal lines; and
a first conductor layer between the first signal line and a second signal line with a distance;

a lower face comprising a second layer overlapping with the first and second lines in a transparent plan view; and
a mounting region on the upper face;
a frame disposed on upper face, comprising an inner wall surrounding the mounting region with a distance and an outer wall; a first connector on the inner wall, connected to the first signal line; a second connector on the inner wall, connected to the second signal line; and a circuit board
surrounded by the frame
being in contact with the inner wall; and
a recess on a side of the circuit board, the recess facing the inner wall and disposed between the first signal line and the second signal line.

2 . (canceled)

3 . The package according to claim 1 , wherein
the groove is apart in a distance from the first conductor layer in the plan view.

4 . The package according to claim 1 , wherein the circuit board:
has a rectangular shape comprising two corners opposed to an inner face of the frame; and comprises a cutout at each of the two corners.

5 . A mounting structure, comprising:
the package according to claim 1 ; and an element disposed on the mounting region of the package.

6 . The package according to claim 1 , wherein
the frame further comprises a first through hole and a second through hole from the inner wall to the outer wall.

7 . The package according to claim 6 , wherein
the first connecter is disposed in the first through hole, and the second connector is disposed in the second through hole.

Assignees

• Kyocera Corp

Inventors

• Kawazu Yoshiki

Classifications

• H10W76/157 Primary

  having interconnections parallel to the insulating or insulated base · CPC title

• H10W70/6875

  being on a metallic substrate, e.g. insulated metal substrates [IMS] · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W76/161 Primary

  Containers comprising no base · CPC title

• H01R24/38

  having concentrically or coaxially arranged contacts · CPC title