Conductive substrate, conductive substrate laminate, method for producing conductive substrate, and method for producing conductive substrate laminate

Patent metadata

Field	Value
Publication number	US-2016342242-A1
Application number	US-201515114591-A
Country	US
Kind code	A1
Filing date	Jan 29, 2015
Priority date	Jan 31, 2014
Publication date	Nov 24, 2016
Grant date	—

Abstract

A conductive substrate includes a transparent base material; a metal layer formed on at least one of surfaces of the transparent base material; and a blackened layer formed on the metal layer by a wet method.

First claim

1 . A conductive substrate, comprising:
a transparent base material; a metal layer formed on at least one of surfaces of the transparent base material; and a blackened layer formed on the metal layer by a wet method; and an adhesion layer formed between the transparent base material and the metal layer by dry plating, and being an Ni—Cu alloy layer including oxygen.

2 . The conductive substrate as claimed in claim 1 , wherein the metal layer and the blackened layer have patterns formed.

3 . A conductive substrate laminate, comprising:
a plurality of the conductive substrates as claimed in claim 1 that are stacked.

4 . A method for producing a conductive substrate, the method comprising:
a metal layer forming process for forming a metal layer on at least one of surfaces of a transparent base material; a blackened layer forming process for forming a blackened layer on the metal layer by a wet method; and an adhesion layer forming process for forming an adhesion layer on at least one of the surfaces of the transparent base material, by dry plating, the adhesion layer being an Ni—Cu alloy layer including oxygen and formed between the transparent base material and the metal layer.

5 . The method for producing the conductive substrate as claimed in claim 4 , the method further comprising:
a patterning process for forming patterns on the metal layer and the blackened layer.

6 . A method for producing a conductive substrate laminate, the method comprising:
a stacking process for stacking a plurality of the conductive substrates that have been obtained by the method for producing the conductive substrate as claimed in claim 4 .

7 . A conductive substrate laminate, comprising:
a plurality of the conductive substrates as claimed in claim 2 that are stacked.

8 . A method for producing a conductive substrate laminate, the method comprising:
a stacking process for stacking a plurality of the conductive substrates that have been obtained by the method for producing the conductive substrate as claimed in claim 5 .

Assignees

• Sumitomo Metal Mining Co

Inventors

• Hata Hiroki
• Shiga Daiki
• Suda Takahiro
• Nishiyama Yoshihide

Classifications

• H05K1/0274 Primary

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• C22C19/058

  without Mo and W · CPC title

• C25D3/38

  of copper · CPC title

• C23C28/40

  Coatings including alternating layers following a pattern, a periodic or defined repetition · CPC title

• H01B13/0026

  Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal · CPC title