Parallel Wire Light String And Method Of Manufacturer

Patent metadata

Field	Value
Publication number	US-2016341408-A1
Application number	US-201615158091-A
Country	US
Kind code	A1
Filing date	May 18, 2016
Priority date	May 19, 2015
Publication date	Nov 24, 2016
Grant date	—

Abstract

A light set and method of manufacturer with first and second spaced apart conducting wire conducting wires with one of the wires having an insulated coating and the other bare uninsulated. An LED chip is surfaced mounted at intervals along the wires. The insulated wire has its insulation removed at the intervals which may weaken the wire. The bare wire does not require removal of insulation and thus remains stronger and resists kinking. Alternative structures and method of creating an insulated coating are disclosed.

First claim

What is claimed is:

1 . A light set, comprising: a first conducting wire having a first conductor and a first insulating layer enclosing the first conductor,
said first insulating layer having a plurality of displaced first openings through said first insulating layer, said first openings defining a respective plurality of first contact-pad areas exposing said first conductor within said plurality of said first contact pad areas; a second conducting wire being disposed adjacent to the first conducting wire, and having a second uninsulated conductor, said second conductor being capable of electrical contact at any point thereon; at least one surface mounted light emitting component being straddled on and between respective first and second conductors on said first contact-pad areas on the first conducting wire; the surface mounted light emitting component having a first lead and a second lead, which are electrically connected to the first conductor of the first conducting wire and the second conductor of the second conducting wire, respectively; and a plurality of translucent packages encapsulating pairs of first contact-pad areas on the first conducting wire and the surface mounted light emitting component bonded thereto; wherein the first conducting wire is insulated wires; and the at least one surface mounted light emitting component is a surface mounted light emitting diode.

2 . The light set as claimed in claim 1 , wherein the first contact areas are formed by flattening the first conductor to produce a flat region.

3 . The light set as claimed in claim 1 , wherein the second conduct further includes second contact areas formed adjacent said first contact areas.

4 . The light set as claimed in claim 1 , wherein the first contact areas are formed by ablating insulation on the first conductor.

5 . The light set as claimed in claim 1 , wherein the first contact areas are formed by etching away insulation on the first conductor.

6 . The light set as claimed in claim 1 , wherein the first contact areas are formed by dissolving away insulation on the first conductor.

7 . A light set, comprising: a first conducting wire having a first conductor at least a partial first insulating layer enclosing part of the first conductor,
said first insulating layer including a plurality of slideable insulating segments having longitudinal apertures for receiving said conductor, said segments being placed on said conductor such that a plurality of first gaps between said segments is created, said first gaps defining a respective plurality of first contact-pad areas exposing said first conductor within said plurality of said first contact pad areas; a second conducting wire being disposed adjacent to the first conducting wire, and having a second uninsulated conductor, said second conductor being capable of electrical contact at any point thereon; and a plurality of translucent packages encapsulating every pair of first contact-pad areas on the first conducting wire and the surface mounted light emitting component bonded thereto; wherein the first conducting wire is insulated wires; and the at least one surface mounted light emitting component is a surface mounted light emitting diode.

8 . A method of making a light set having first and second parallel wires and LED chips comprising the steps of:
a. providing temporary coverage of portions of the first wire at intervals along its length; b. coating the first wire with an insulator while providing said temporary coverage; c. removing said temporary coverage, thereby exposing uninsulated portions of the first wire at known intervals; d. placing said second wire in parallel with said first wire; e. applying an LED chip in electrical contact with said first and second wires at said uninsulated portions, thereby having the wires electrically bridged by said LED chip.

9 . The method of claim 8 further including flattening the first wire at said uninsulated portions.

10 . The method of claim 9 , wherein said second wire is flattened at points corresponding to adjacent uninsulated portions on said first wire.

11 . The method of claim 8 further including:
a. providing temporary coverage of portions of the second wire at intervals along its length;
b. coating the second wire with an insulator while providing said temporary coverage;
c. removing said temporary coverage, thereby exposing uninsulated portions of the second wire at known intervals corresponding to the known intervals of said first wire.

12 . The method of claim 9 wherein the flattening includes creating a depression in the wire with a flat portion and curved edges.

13 . The method of claim 7 further including coating at least one conductor with an electrically conductive colored coating.

Assignees

• Seasonal Specialties Llc

Inventors

• Altamura Steven J

Classifications

• F21V19/0015

  Fastening arrangements intended to retain light sources · CPC title

• F21V21/002

  making direct electrical contact, e.g. by piercing (F21V21/35 takes precedence) · CPC title

• F21S4/10

  with light sources attached to loose electric cables, e.g. Christmas tree lights · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21V19/001

  the light sources being semiconductors devices, e.g. LEDs · CPC title