Double-sided adhesive tape and electronic device

Patent metadata

Field	Value
Publication number	US-2016339672-A1
Application number	US-201415108130-A
Country	US
Kind code	A1
Filing date	Dec 9, 2014
Priority date	Dec 25, 2013
Publication date	Nov 24, 2016
Grant date	—

Abstract

There is provided a double-sided pressure-sensitive adhesive tape including resin films laminated on both surfaces of a foaming body substrate, and pressure-sensitive adhesive layers laminated on the surface of the resin film, in which the foaming body substrate has a density of 0.45 g/cm 3 or less, and an interlaminar strength of 10 N/cm or more, and pressure-sensitive adhesive layer exhibits a 180° peeling adhesive force of 10 N/20 mm or more when a pressure-sensitive adhesive tape obtained by providing the pressure-sensitive adhesive layer on a polyethylene terephthalate substrate having a thickness of 25 μm such that the thickness of the pressure-sensitive adhesive layer is 25 μm is allowed to adhere onto an aluminum plate with pressure under the predetermined environment, and is peeled at a peeling rate of 300 mm/min.

First claim

1 . A double-sided pressure-sensitive adhesive tape comprising:
resin films laminated on both surfaces of a foaming body substrate; and pressure-sensitive adhesive layers laminated on the surface of the respective resin films, wherein the foaming body substrate is a foaming body substrate having a density of 0.45 g/cm 3 or less and an interlaminar strength of 10 N/cm or more, and the pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer which exhibits a 180° peeling adhesive force 10 N/20 mm or more, when a pressure-sensitive adhesive tape obtained by providing the pressure-sensitive adhesive layer on a polyethylene terephthalate substrate having a thickness of 25 μm such that the thickness of the pressure-sensitive adhesive layer is 25 μm is rolled reciprocatively once on an aluminum plate with a 2 kg roller under the environment of a temperature of 23° C. and a relative humidity of 65% RH such that the pressure-sensitive adhesive tape adheres to the aluminum plate with pressure, is left to stand for one hour under the environment of a temperature of 23° C. and a relative humidity of 50% RH, and is then peeled at a peeling rate of 300 mm/min.

2 . The double-sided pressure-sensitive adhesive tape according to claim 1 ,
which has a total thickness of 300 μm or less.

3 . The double-sided pressure-sensitive adhesive tape according to claim 1 ,
wherein a tensile strength of the foaming body substrate is in a range of 500 N/cm 2 to 1,300 N/cm 2 .

4 . The double-sided pressure-sensitive adhesive tape according to claim 1 ,
wherein the resin film is a film obtained by using a polyester resin.

5 . The double-sided pressure-sensitive adhesive tape according to claim 1 ,
wherein the foaming body substrate and the resin film are laminated with each other via an adhesive layer.

6 . The double-sided pressure-sensitive adhesive tape according to claim 5 ,
wherein the adhesive layer is a layer containing a urethane resin.

7 . The double-sided pressure-sensitive adhesive tape according to claim 1 , which is used to perform fixing between components of an electronic device.

8 . An electronic device having a configuration in which two or more components adhere to each other through the double-sided pressure-sensitive adhesive tape according to claim 7 .

Assignees

• Dainippon Ink & Chemicals

Inventors

• KAGIYAMA Yumi
• Takei Hideaki
• Yamakami Akira
• Iwasaki Takeshi

Classifications

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J175/04

  Polyurethanes · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B5/245 Primary

  another layer next to it being a foam layer · CPC title

• B32B2457/00

  Electrical equipment · CPC title