Method of removing soluble material layer by dissolving, method of manufacturing member, socket for use in electronic part, and electric and electronic devices

Patent metadata

Field	Value
Publication number	US-2016338208-A1
Application number	US-201615154354-A
Country	US
Kind code	A1
Filing date	May 13, 2016
Priority date	May 15, 2015
Publication date	Nov 17, 2016
Grant date	—

Abstract

A concave part defined by a ring-shaped step is formed on the upper surface of a housing body. A first elastic member is brought into contact with a portion of an electroless nickel-plated layer, the portion being in a region inside the concave part. The first elastic member is then pressed and deformed so that the whole of an angular portion, at which the upper surface of the ring-shaped step and its side surface cross, bites into the first elastic member and that the first elastic member and the electroless nickel-plated layer on the upper surface of the ring-shaped step are separated from each other. The housing body is then immersed in a dissolving liquid that can dissolve the electroless nickel-plated layer while the first elastic member is kept deformed.

First claim

What is claimed is:

1 . A method of removing a soluble material layer formed on a surface of a base material comprising:
dissolving the soluble material layer, wherein: a surface of the base material has a concave part, which is defined by a ring-shaped step that follows an outer edge of a region on which to form the soluble material layer, the soluble material layer being formed in the concave part and an upper surface of the ring-shaped steps; bringing an elastic member into contact with a portion of the soluble material layer, the portion being in the concave part; then, pressing and deforming the elastic member so that a whole of an angular portion, at which the upper surface of the ring-shaped step and a side surface of the ring-shaped step cross, bites into the elastic member and that the elastic member and the soluble material layer on the upper surface of the ring-shaped step are separated from each other; and then, immersing the base material in a liquid that is capable of dissolving the soluble material layer while the elastic member is kept deformed.

2 . The method according to claim 1 , wherein the elastic member is deformed by being relatively pressed toward another elastic member, which has a different hardness from the elastic member, in a state in which the base material is sandwiched between the elastic member and the another elastic member.

3 . The method according to claim 2 , wherein the elastic member has a higher hardness than the other elastic member.

4 . The method according to claim 3 , wherein the soluble material layer includes a plated layer.

5 . A method of manufacturing a member that has a base material and a soluble material layer formed on part of a surface of the base material, the method comprising:
forming the soluble material layer on a surface of the base material; and
partially removing the soluble material layer, wherein:
a surface of the base material has a concave part, which is defined by a ring-shaped step that follows an outer edge of a region on which to form the soluble material layer, the soluble material layer being formed in the concave part and an upper surface of the ring-shaped steps; bringing an elastic member into contact with a portion of the soluble material layer, the portion being in the concave part; then, pressing and deforming the elastic member so that a whole of an angular portion, at which the upper surface of the ring-shaped step and a side surface of the ring-shaped step cross, bites into the elastic member and that the elastic member and the soluble material layer on the upper surface of the ring-shaped step are separated from each other; and
then, immersing the base material in a liquid that is capable of dissolving the soluble material layer while the elastic member is kept deformed.

Assignees

• Alps Electric Co Ltd

Inventors

• Kanno Hiroyuki
• Koike Masahiro

Classifications

• C23C18/1689

  After-treatment · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• C23C18/32

  Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title

• H05K3/22 Primary

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title