A flexible substrate attaching method and flexible substrate attachment structure

Patent metadata

Field	Value
Publication number	US-2016338189-A1
Application number	US-201514761986-A
Country	US
Kind code	A1
Filing date	Feb 10, 2015
Priority date	Oct 27, 2014
Publication date	Nov 17, 2016
Grant date	—

Abstract

The present disclosure relates to the technical field of flexible substrate processing, and discloses a flexible substrate attaching method. The flexible substrate attaching method comprises the steps of: pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate. In this flexible substrate attaching method, a flexible substrate can be fixed on a carrier substrate in good effect and the flexible panel can be easily detached after the manufacture is completed. The present disclosure further provides a flexible substrate attachment structure.

First claim

1 . A flexible substrate attaching method comprising the steps of:
pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate.

2 . The flexible substrate attaching method according to claim 1 , wherein the pattern of the thin film comprises: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.

3 . The flexible substrate attaching method according to claim 1 , wherein the thin film is a metal thin film.

4 . The flexible substrate attaching method according to claim 3 , wherein the metal thin film is formed using a magnetron sputtering process.

5 . The flexible substrate attaching method according to claim 3 , wherein the patterning process comprises an etching method, which is a wet-etching.

6 . The flexible substrate attaching method according to claim 2 , wherein the pattern of the thin film further comprises a gate line structure or a data line structure.

7 . The flexible substrate attaching method according to claim 1 , wherein the first fixation structure is an adhesive tape.

8 . The flexible substrate attaching method according to claim 1 , wherein the thin film has a thickness of 300-800 nm.

9 . The flexible substrate attaching method according to claim 1 , wherein the flexible substrate is a thin glass or resin material substrate.

10 . The flexible substrate attaching method according to claim 1 , wherein the carrier substrate is a glass substrate.

11 . A flexible substrate attachment structure, comprising:
a carrier substrate; a flexible substrate pre-fixed on the carrier substrate via a first fixation structure; and a pattern of a thin film on the flexible substrate, the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously.

12 . The flexible substrate attachment structure according to claim 11 , wherein the pattern of the thin film comprises: a plurality of interlaced horizontal and longitudinal strip-like structures separating the flexible substrate into a plurality of regions, each of the regions corresponding to a flexible panel.

13 . The flexible substrate attachment structure according to claim 11 , wherein the thin film is a metal thin film.

14 . The flexible substrate attachment structure according to claim 12 , wherein the pattern of the thin film further comprises a gate line structure or a data line structure.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Ning ce
• Gao Tao

Classifications

• H10W95/00 Primary

  Packaging processes not covered by the other groups of this subclass · CPC title

• H05K2203/016

  Temporary inorganic, non-metallic carrier, e.g. for processing or transferring · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H05K3/007 Primary

  Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence) · CPC title