Focal plane arrays with backside contacts

Patent metadata

Field	Value
Publication number	US-2016336370-A1
Application number	US-201514708900-A
Country	US
Kind code	A1
Filing date	May 11, 2015
Priority date	May 11, 2015
Publication date	Nov 17, 2016
Grant date	—

Abstract

A package assembly includes a package body and a focal plane array (FPA) within the package body. The FPA includes a read out integrated circuit (ROIC) having a circuit side. A photodiode array (PDA) defines an optical axis and has a backside electrically connected to the circuit side of the ROIC. A plurality of conductive through-vias extend from the circuit side of the ROIC through to input/output (I/O) bondpads on the backside of the ROIC. A window is operatively connected between the FPA and the package body.

First claim

What is claimed is:

1 . A focal plane array (FPA) comprising:
a read out integrated circuit (ROIC) having a circuit side; a photodiode array (PDA) defining an optical axis having a backside electrically connected to the circuit side of the ROIC; and a plurality of conductive through-vias extending from the circuit side of the ROIC through to I/O bondpads on the backside of the ROIC.

2 . A focal plane array as recited in claim 1 , wherein the backside of the PDA includes pixel circuitry.

3 . A focal plane array as recited in claim 1 , wherein a topside of the PDA is free from wire bond connections.

4 . A focal plane array as recited in claim 1 , further comprising a window directly abutting a topside of the PDA.

5 . A focal plane array as recited in claim 1 , wherein a perimeter of the ROIC in a plane perpendicular to the optical axis is equal to a perimeter of the PDA in another plane perpendicular to the optical axis.

6 . A focal plane array as recited in claim 1 , wherein the circuit side of the ROIC is covered entirely by the PDA.

7 . A focal plane array as recited in claim 1 , wherein the conductive through-vias extend in a direction parallel to the optical axis.

8 . A package assembly comprising:
a package body; a focal plane array (FPA) within the package body including:
a read out integrated circuit (ROIC) having a circuit side;
a photodiode array (PDA) defining an optical axis having a backside electrically connected to the circuit side of the ROIC; and
a plurality of conductive through-vias extending from the circuit side of the ROIC through to a backside of the ROIC; and
a window operatively connected between the FPA and the package body.

9 . A package assembly as recited in claim 8 , wherein the backside of the PDA includes pixel circuitry.

10 . A package assembly as recited in claim 8 , wherein a topside of the PDA and/or the circuit side of the ROIC is free from wire bond connections.

11 . A package assembly as recited in claim 8 , wherein the window directly abuts a topside of the PDA.

12 . A package assembly as recited in claim 8 , wherein the window is defined in an opening of the package body.

13 . A package assembly as recited in claim 8 , wherein the package body is electrically connected to the conductive through-vias on the backside of the ROIC.

14 . A package assembly as recited in claim 8 , wherein a perimeter of the ROIC in a plane perpendicular to the optical axis is equal to perimeters of the PDA and the window in other respective planes perpendicular to the optical axis.

15 . A package assembly as recited in claim 8 , wherein the conductive through-vias extend in a direction parallel to the optical axis.

Assignees

• Sensors Unlimited Inc

Inventors

• Dixon Peter

Classifications

• H01L27/14649

  Electricity · mapped topic

• H01L27/14636 Primary

  Electricity · mapped topic

• H04N5/378

  Electricity · mapped topic

• H10F39/809

  of hybrid image sensors · CPC title

• H10F39/804

  Containers or encapsulations · CPC title