Printed wiring board and semiconductor package

Patent metadata

Field	Value
Publication number	US-2016336261-A1
Application number	US-201614992197-A
Country	US
Kind code	A1
Filing date	Jan 11, 2016
Priority date	Nov 11, 2014
Publication date	Nov 17, 2016
Grant date	—

Abstract

A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the conductor layer has a first surface exposed on a first surface side of the insulating layer, and a conductor post formed on a second surface of the conductor layer on the opposite side with respect to the first surface such that the conductor post has a side surface covered by the insulating layer. The conductor post has an end surface on the opposite with respect to the conductor layer such that the end surface of the conductor post is exposed on a second surface side of the insulating layer, and the conductor post has an end portion on a wiring conductor layer side such that the side surface in the end portion is a curved side surface which is bending outward increasingly toward from the conductor layer.

First claim

What is claimed is:

1 . A printed wiring board, comprising:
a resin insulating layer; a wiring conductor layer embedded in the resin insulating layer such that the wiring conductor layer has a first surface exposed on a first surface side of the resin insulating layer; and a conductor post formed on a second surface of the wiring conductor layer on an opposite side with respect to the first surface such that the conductor post has a side surface covered by the resin insulating layer, wherein the conductor post has an end surface on an opposite with respect to the wiring conductor layer such that the end surface of the conductor post is exposed on a second surface side of the resin insulating layer, and the conductor post has an end portion on a wiring conductor layer side such that the side surface in the end portion is a curved side surface which is bending outward increasingly toward from the wiring conductor layer.

2 . A printed wiring board according to claim 1 , wherein the conductor post has an end surface on the first surface side of the resin insulating layer such that the end surface on the first surface side has a surface area which is greater than a surface area of the end surface on the second surface side.

3 . A printed wiring board according to claim 1 , wherein the curved side surface of the conductor post has a tangent line at a portion connecting to the wiring conductor layer such that the tangent line forms an obtuse angle in a range of 90 degrees to 180 degrees with respect to the second surface of the wiring conductor layer.

4 . A printed wiring board according to claim 1 , wherein the curved side surface of the conductor post is extending in a distance of 1 μm to 10 μm.

5 . A printed wiring board according to claim 1 , wherein the conductor post satisfies a ratio A 1 /A 2 in a range of greater than 1 and smaller than 1.2, where A 1 represents an area of a connecting surface between the conductor post and the wiring conductor layer, and A 2 represents an area of a cross section of the conductor post at a straight portion of the side surface parallel to the second surface of the wiring conductor layer.

6 . A printed wiring board according to claim 1 , wherein the wiring conductor layer is embedded in the resin insulating layer such that the wiring conductor layer has the first surface recessed with respect to a first surface of the resin insulating layer on the first surface side, the conductor post is formed such that the end surface on the opposite side with respect to the wiring conductor layer is recessed with respect to a second surface of the resin insulating layer on the second surface side, and distances between the first surfaces of wiring conductor layer and the resin insulating layer and between the end surface of the conductor post and the second surface of the resin insulating layer are set different.

7 . A printed wiring board according to claim 1 , wherein the wiring conductor layer is embedded in the resin insulating layer such that the wiring conductor layer has the first surface recessed with respect to a first surface of the resin insulating layer on the first surface side, the conductor post is formed such that the end surface on the opposite side with respect to the wiring conductor layer is recessed with respect to a second surface of the resin insulating layer on the second surface side, and a distance between the end surface of the conductor post and the second surface of the resin insulating layer is set greater than a distances between the first surfaces of wiring conductor layer and the resin insulating layer.

8 . A printed wiring board according to claim 1 , wherein the resin insulating layer comprises a molding resin material having a thermal expansion coefficient in a range of 6 ppm/° C. to 25 ppm/° C. and an elastic modulus in a range of 5 GPa to 30 GPa.

9 . A printed wiring board according to claim 1 , wherein the resin insulating layer comprises an epoxy resin material including an inorganic filler in an amount ranging 30% by weight to 80% by weight.

10 . A printed wiring board according to claim 1 , wherein the side surface of the conductor post has a roughened surface formed by roughening treatment.

11 . A printed wiring board according to claim 1 , wherein the wiring conductor layer has the second surface having a roughened surface formed by roughening treatment and a side surface having a roughened surface formed by roughening treatment.

12 . A printed wiring board according to claim 3 , wherein the curved side surface of the conductor post has a tangent line at a portion connecting to the wiring conductor layer such that the tangent line forms an obtuse angle in a range of 90 degrees to 180 degrees with respect to the second surface of the wiring conductor layer.

13 . A printed wiring board according to claim 3 , wherein the curved side surface of the conductor post is extending in a distance of 1 μm to 10 μm.

14 . A printed wiring board according to claim 3 , wherein the conductor post satisfies a ratio A 1 /A 2 in a range of greater than 1 and smaller than 1.2, where A 1 represents an area of a connecting surface between the conductor post and the wiring conductor layer, and A 2 represents an area of a cross section of the conductor post at a straight portion of the side surface parallel to the second surface of the wiring conductor layer.

15 . A printed wiring board according to claim 3 , wherein the wiring conductor layer is embedded in the resin insulating layer such that the wiring conductor layer has the first surface recessed with respect to a first surface of the resin insulating layer on the first surface side, the conductor post is formed such that the end surface on the opposite side with respect to the wiring conductor layer is recessed with respect to a second surface of the resin insulating layer on the second surface side, and distances between the first surfaces of wiring conductor layer and the resin insulating layer and between the end surface of the conductor post and the second surface of the resin insulating layer are set different.

16 . A semiconductor package, comprising:
a printed wiring board; a first semiconductor element mounted on a surface of the printed wiring board; and a substrate having a bump structure such that the bump structure is mounted the substrate on the surface of the printed wiring board, wherein the printed wiring board comprises a resin insulating layer, a wiring conductor layer embedded in the resin insulating layer such that the wiring conductor layer has a first surface exposed on a first surface side of the resin insulating layer, and a conductor post formed on a second surface of the wiring conductor layer on an opposite side with respect to the first surface such that the conductor post has a side surface covered by the resin insulating layer, the conductor post has an end surface on an opposite with respect to the wiring conductor layer such that the end surface of the conductor post is exposed on a second surface side of the resin insulating layer, the conductor post has an end portion on a wiring conductor layer side such that the side surface in the end portion is a curved side surface which is bending outward increasingly toward from the wiring conductor layer, and the bump structure of the substrate is connected to the wiring conductor layer of the printed wiring board.

17 . A semiconductor package according to claim 16 , further comprising:
a mold resin structure formed in a space formed between the printed wiring board and the subst

Assignees

• Ibiden Co Ltd

Inventors

• Furutani Toshiki
• Sakai Shunsuke
• Inagaki Yasushi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/721

  of bump connectors · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title