Systems and Methods for Haptic Feedback for Modular Devices

Patent metadata

Field	Value
Publication number	US-2016334871-A1
Application number	US-201514710823-A
Country	US
Kind code	A1
Filing date	May 13, 2015
Priority date	May 13, 2015
Publication date	Nov 17, 2016
Grant date	—

Abstract

One illustrative haptic output device disclosed herein includes a connector configured to couple the haptic output device to a modular computing device. The modular computing device includes an outer housing configured to mechanically and electrically couple with one or more external electronic modules. The haptic output device also includes a receiver configured to receive a haptic signal from a processor. The processor is configured to receive a signal; determine a haptic effect based in part on the signal; generate the haptic signal based on the haptic effect; and transmit the haptic signal. The haptic output device is configured to output the haptic effect responsive to receiving the haptic signal.

First claim

What is claimed:

1 . A haptic output device comprising:
a connector configured to couple the haptic output device to a modular computing device, wherein the modular computing device comprises an outer housing configured to mechanically and electrically couple with one or more external electronic modules, a receiver configured to receive a haptic signal from a processor, the processor configured to:
receive a signal;
determine a haptic effect based in part on the signal;
generate the haptic signal based on the haptic effect; and
transmit the haptic signal; and
wherein the haptic output device is configured to output the haptic effect responsive to receiving the haptic signal.

2 . The haptic output device of claim 1 , wherein the processor is further configured to receive the signal from a sensor, a touch-sensitive surface, a button, a remote computing device, the one or more external electronic modules, or a memory device.

3 . The haptic output device of claim 1 , wherein the haptic output device is enclosed within the modular computing device.

4 . The haptic output device of claim 1 , wherein the haptic output device comprises a first of the one or more external electronic modules.

5 . The haptic output device of claim 1 , wherein the haptic output device is configured to output the haptic effect by tightening or loosening a coupling between the outer housing and an external electronic module responsive to receiving the haptic signal.

6 . The haptic output device of claim 1 , wherein the outer housing includes a compliant material comprising a shape memory alloy, a smart gel, an electro-rheological fluid, or a magneto-rheological fluid, and wherein the processor is further configured to modulate a characteristic of the compliant material to modify an amplitude of the haptic effect.

7 . The haptic output device of claim 1 , wherein the haptic effect is configured to assist a user in coupling an external electronic module to the modular computing device.

8 . The haptic output device of claim 1 , wherein the haptic output device is configured to generate the haptic effect, in part, by moving a mass comprising an external electronic module.

9 . The haptic output device of claim 1 , wherein the modular computing device is associated with a wearable device comprising a sleeve, jacket, glove, ring, watch, wristband, collar, shirt, article of clothing, hat, headband, jewelry, shoes, and/or glasses.

10 . A method comprising:
receiving a signal; determining a haptic effect based at least in part on the signal; and transmitting a haptic signal associated with the haptic effect to a haptic output device comprising a connecter configured to couple the haptic output device to a modular computing device, wherein the modular computing device comprises an outer housing configured to mechanically and electrically couple with one or more external electronic modules, and wherein the haptic output device is configured to receive the haptic signal via a receiver and output the haptic effect.

11 . The method of claim 10 , wherein the haptic output device comprises a first of the one or more external electronic modules.

12 . The method of claim 10 , wherein the haptic output device is configured to output the haptic effect by tightening or loosening a coupling between the outer housing and an external electronic module responsive to receiving the haptic signal.

13 . The method of claim 10 , further comprising:
modulating a characteristic of a compliant material in the outer housing to modify an amplitude of the haptic effect, the compliant material comprising a shape memory alloy, a smart gel, an electro-rheological fluid, or a magneto-rheological fluid.

14 . The method of claim 10 , wherein the haptic effect is configured to resist against an external electronic module coupling to the modular computing device.

15 . The method of claim 10 , wherein the haptic output device is configured to generate the haptic effect, in part, by moving a mass comprising an external electronic module.

16 . The method of claim 10 , wherein the modular computing device is associated with a wearable device comprising a sleeve, jacket, glove, ring, watch, wristband, collar, shirt, article of clothing, hat, headband, jewelry, shoes, and/or glasses.

17 . A non-transient computer readable medium comprising program code, which when executed by a processor is configured to cause the processor to:
receive a signal; determine a haptic effect based at least in part on the signal; and transmit a haptic signal associated with the haptic effect to a haptic output device comprising a connector configured to couple the haptic output device to a modular computing device, wherein the modular computing device comprises an outer housing configured to mechanically and electrically couple with one or more external electronic modules, and wherein the haptic output device is configured to receive the haptic signal via a receiver and output the haptic effect.

18 . The non-transient computer readable medium of claim 17 , wherein the haptic output device is configured to output the haptic effect by tightening or loosening a coupling between the outer housing and an external electronic module responsive to receiving the haptic signal.

19 . The non-transient computer readable medium of claim 17 , further comprising program code which when executed by the processor is configured to cause the processor to:
modulate a characteristic of a compliant material in the outer housing to modify an amplitude of the haptic effect, the compliant material comprising a shape memory alloy, a smart gel, an electro-rheological fluid, or a magneto-rheological fluid.

20 . The non-transient computer readable medium of claim 17 , wherein the haptic effect is configured to resist against an external electronic module coupling to the modular computing device.

Assignees

• Immersion Corp

Inventors

• Levesque Vincent

Classifications

• G06F3/016 Primary

  Input arrangements with force or tactile feedback as computer generated output to the user · CPC title

• G06F3/0416

  Control or interface arrangements specially adapted for digitisers · CPC title

• G06F1/163

  Wearable computers, e.g. on a belt · CPC title

• G06F3/01

  Input arrangements or combined input and output arrangements for interaction between user and computer (G06F3/16 takes precedence) · CPC title

• G06F2203/013

  Force feedback applied to a game · CPC title