Photocurable composition for nanoimprinting, and method for forming fine pattern using the same

Patent metadata

Field	Value
Publication number	US-2016334701-A1
Application number	US-201515111552-A
Country	US
Kind code	A1
Filing date	Jan 6, 2015
Priority date	Jan 29, 2014
Publication date	Nov 17, 2016
Grant date	—

Abstract

Provided is a photocurable composition that is used for nanoimprinting and can give, on a wafer, a uniform thin film that maintains a uniform thickness without causing uneven resin distribution even after being left stand for a certain time and still enables transfer of, and formation of, a fine pattern with good precision from a mold onto the thin film. The photocurable composition for nanoimprinting includes components (A), (B), (C), and (D) and includes the component (C) in a content of 1 to 30 weight percent based on the total amount (100 weight percent) of the photocurable composition. The component (A) is a cationically curable compound represented by Formula (1). The component (B) is a cationic photoinitiator. The component (C) is a hydroxy-containing solvent having a boiling point of 100° C. to 210° C. (at 760 mmHg). The component (D) is a solvent that is devoid of hydroxy, has a boiling point of 140° C. to 210° C. (at 760 mmHg), and has monomer solubility in terms of solubility parameter of 8.0 to 10.0 (cal/cm 3 ) 1/2 .

First claim

1 . A photocurable composition for nanoimprinting, comprising components (A), (B), (C), and (D) as follows:
(A) a cationically curable compound represented by Formula (1); (B) a cationic photoinitiator; (C) a hydroxy-containing solvent having a boiling point of 100° C. to 210° C. (at 760 mmHg); and (D) a solvent being devoid of hydroxy, having a boiling point of 140° C. to 210° C. (at 760 mmHg), and having monomer solubility in terms of solubility parameter of 8.0 to 10.0 (cal/cm 3 ) 1/2 , the photocurable composition comprising the component (C) in a content of 1 to 30 weight percent based on the total amount (100 weight percent) of the photocurable composition, Formula (1) expressed as follows:

wherein R 1 to R 18 are, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group.

2 . The photocurable composition for nanoimprinting according to claim 1 , further comprising
a compound comprising:
at least one of an aromatic ring and an aliphatic ring; and
a cationically curable functional group,
with exceptions of compounds corresponding to the component (A).

3 . The photocurable composition for nanoimprinting according to claim 1 , further comprising
a silicone surface conditioner or a hydrocarbon surface conditioner.

4 . A method for producing a finely patterned substrate, the method comprising:
subjecting the photocurable composition for nanoimprinting according to claim 1 to an imprinting process to give a mask; and etching an inorganic substrate using the mask.

5 . A finely patterned substrate obtained by the method according to claim 4 .

6 . A semiconductor device comprising
the finely patterned substrate according to claim 5 .

7 . The photocurable composition for nanoimprinting according to claim 2 , further comprising
a silicone surface conditioner or a hydrocarbon surface conditioner.

8 . A method for producing a finely patterned substrate, the method comprising:
subjecting the photocurable composition for nanoimprinting according to claim 2 to an imprinting process to give a mask; and etching an inorganic substrate using the mask.

9 . A method for producing a finely patterned substrate, the method comprising:
subjecting the photocurable composition for nanoimprinting according to claim 3 to an imprinting process to give a mask; and etching an inorganic substrate using the mask.

10 . A finely patterned substrate obtained by the method according to claim 8 .

11 . A finely patterned substrate obtained by the method according to claim 9 .

12 . A semiconductor device comprising the finely patterned substrate according to claim 10 .

13 . A semiconductor device comprising the finely patterned substrate according to claim 11 .

Assignees

• Daicel Corp

Inventors

• Fujikawa Takeshi
• Yamamoto Takuya

Classifications

• H10H20/819

  characterised by their shape, e.g. curved or truncated substrates · CPC title

• H10H20/0137

  the light-emitting regions comprising nitride materials · CPC title

• G03F7/0048

  characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• H01L33/0075

  Electricity · mapped topic