Heat dissipation device and method of manufacturing the same

US2016334171A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016334171-A1
Application numberUS-201514811979-A
CountryUS
Kind codeA1
Filing dateJul 29, 2015
Priority dateMay 15, 2015
Publication dateNov 17, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a heat dissipation device includes: providing a tube, the tube defining a head end, a tail end and a chamber, the head end being closed and the tail end being opened, the chamber being connected outside via the tail end; providing a module for receiving a part of the tube therein, the tail end being positioned out of the module; providing a molding material and injecting the liquid molding material into the module, the molding material being made of metal, a melting point of the molding material being lower than that of the tube; solidifying the molding material to form a base, the part of the tube received and fixed in the tube; removing the module; injecting a working medium into the tube via the tail end; vacuumizing the chamber of the tube; and sealing the tail end of the tube.

First claim

Opening claim text (preview).

What is claimed is: 1 . A heat dissipation device comprising: a base made of metal; and a heat pipe made of metal and comprising a pipe body and a working medium sealed in the pipe body, the heat pipe directly attaches, being assembled and fixed in the base, and a melting point of the base being lower than that of the pipe body. 2 . The heat dissipation device of claim 1 , wherein the pipe body comprises a chamber, the working medium is sealed in the chamber. 3 . The heat dissipation device of claim 2 , wherein the heat pipe has an evaporating section, a connecting section and a condensing section, the connecting section is connected between the evaporating section and the condensing section, and the chamber is arranged through the evaporating section, the connecting section and the condensing section. 4 . The heat dissipation device of claim 3 , wherein the evaporating section directly attaches the base, the evaporating section is assembled and fixed in the base. 5 . The heat dissipation device of claim 2 , wherein the chamber of the pipe body of the heat pipe comprises wick structures received therein. 6 . The heat dissipation device of claim 5 , wherein the wick structures are formed by mesh structures, fibers or particles. 7 . The heat dissipation device of claim 1 , wherein the base comprises a fixing portion and a body portion, the fixing portion and the body portion define a receiving portion, the heat pipe is received and assembled in the receiving portion. 8 . The heat dissipation device of claim 7 , wherein the heat pipe is received and penetrates through the receiving portion. 9 . A method of manufacturing a heat dissipation device, comprising: providing a tube, the tube having a head end, a tail end and a chamber, the head end being closed, the tail end being opened, and the chamber being connected outside via the tail end; providing a module for receiving a part of the tube therein, and the tail end being positioned out of the module; providing a molding material and injecting the liquid molding material into the module, the molding material being made of metal, a melting point of the molding material being lower than that of the tube, the liquid molding material attaching the tube; solidifying the molding material to form a base, the part of the tube being received and fixed in the base; removing the module; injecting a working medium into the tube via the tail end; vacuumizing the chamber of the tube; and sealing the tail end of the tube. 10 . The method of claim 9 , wherein the tube comprises wick structures received therein. 11 . The method of claim 10 , wherein the wick structures are formed by mesh structures, fibers or particles. 12 . The method of claim 9 , wherein the tube is made of copper, the molding material is made of aluminum or copper alloy. 13 . The method of claim 9 , wherein after “removing the module”, the base is treated by a burring process. 14 . The method of claim 9 further comprises “checking air tightness of the tube” after “removing the module”. 15 . The method of claim 9 , wherein “injecting a working medium into the tube via the tail end” and “vacuumizing the chamber of the tube” is exchanged with each other. 16 . A heat dissipation device comprising: a base configured to be attached to a heat generating component; and an elongated heat pipe having a first end, a second end, and a curved section between the first and second end, the heat pipe defining a sealed interior chamber containing a working fluid and a space of reduced pressure, the heat pipe being connected to the base proximate to the first end; wherein when the base absorbs heat from a heat generating component, the heat travels through the base to the heat pipe to vaporize working fluid within the heat pipe proximate to the base, and the vaporized working fluid travels to and condenses at the second end of the heat pipe.

Assignees

Inventors

Classifications

  • heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

  • Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

  • with tubes having a capillary structure · CPC title

  • Heat pipes · CPC title

  • the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

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What does patent US2016334171A1 cover?
A method of manufacturing a heat dissipation device includes: providing a tube, the tube defining a head end, a tail end and a chamber, the head end being closed and the tail end being opened, the chamber being connected outside via the tail end; providing a module for receiving a part of the tube therein, the tail end being positioned out of the module; providing a molding material and injecti…
Who is the assignee on this patent?
Furui Precise Component (Kunshan) Co Ltd, Foxconn Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification F28D15/0275. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Thu Nov 17 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).