Three-dimension formation composition, method of manufacturing three-dimensional structure, and three-dimensional structure

US2016333153A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016333153-A1
Application numberUS-201515112050-A
CountryUS
Kind codeA1
Filing dateJun 30, 2015
Priority dateJul 1, 2014
Publication dateNov 17, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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There are provided a method of manufacturing a three-dimensional structure, and three-dimension formation composition, by each which a three-dimensional structure can be manufactured with high dimensional accuracy, and provided a three-dimensional structure manufactured with high dimensional accuracy. There is provided a method of manufacturing a three-dimensional structure, in which the three-dimensional structure is manufactured by laminating a layer, the method including: forming the layer using a three-dimension formation composition containing particles, a binding resin, and a water-based solvent; removing the water-based solvent from the layer by heating the layer; and applying a binding solution containing a binder to the layer, in which the binding resin has an ammonium salt of a carboxyl group as a functional group.

First claim

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1 . A three-dimension formation composition, comprising: particles; a binding resin; and a water-based solvent, wherein the binding resin has an ammonium salt of a carboxyl group as a functional group. 2 . The three-dimension formation composition according to claim 1 , wherein the binding resin contains one or two or more selected from the group consisting of a reaction product of an olefin-maleic anhydride copolymer with ammonia, a polyacrylic acid ammonium salt, an ammonium salt of carboxymethyl cellulose, a polystyrene carboxylic acid ammonium salt, an ammonium salt of an acrylamide-acrylic acid copolymer, and an alginic acid ammonium salt. 3 . The three-dimension formation composition according to claim 1 , wherein the weight average molecular weight of the binding resin is 50000 to 200000. 4 . The three-dimension formation composition according to claim 1 , wherein the binding resin has a structure of acid anhydride which is formed by heating. 5 . The three-dimension formation composition according to claim 1 , wherein the binding resin has a cyclic chemical structure which is formed by heating. 6 . The three-dimension formation composition according to claim 5 , wherein the binding resin has a five-membered or six-membered cyclic structure which is formed by heating. 7 . The three-dimension formation composition according to claim 1 , wherein the binding resin has an amide group (—CONH 2 ) together with the ammonium salt of a carboxyl group in a molecule. 8 . The three-dimension formation composition according to claim 1 , further comprising: a compound having an amide group (—CONH 2 ) in addition to the binding resin. 9 . The three-dimension formation composition according to claim 8 , wherein the compound having an amide group is polyacrylamide. 10 . A method of manufacturing a three-dimensional structure, in which the three-dimensional structure is manufactured by laminating a layer, the method comprising: forming the layer using a three-dimension formation composition containing particles, a binding resin, and a water-based solvent; removing the water-based solvent from the layer by heating the layer; and applying a binding solution containing a binder to the layer, wherein the binding resin has an ammonium salt of a carboxyl group as a functional group. 11 . The method of manufacturing a three-dimensional structure according to claim 10 , wherein, in the removing of the water-based solvent, the layer is heated to a temperature equal to or higher than the glass transition temperature of the binding resin. 12 . The method of manufacturing a three-dimensional structure according to claim 10 , wherein, in the removing of the water-based solvent, the heating temperature is 30 degrees Celsius to 140 degrees Celsius. 13 . The method of manufacturing a three-dimensional structure according to claim 10 , further comprising: removing the particles, which are not bound by the binder, after repeating the forming of the layer, the removing of the water-based solvent, and the applying of the binding solution, wherein the pH of a removing solution used in the removing of the unbound particles is 9 or more. 14 . The method of manufacturing a three-dimensional structure according to claim 10 , further comprising: removing the particles, which are not bound by the binder, after repeating the forming of the layer, the removing of the water-based solvent, and the applying of the binding solution, wherein, in the removing of the unbound particles, ammonia is used. 15 . A three-dimensional structure, which is manufactured by the method of manufacturing a three-dimensional structure according to claim 10 .

Assignees

Inventors

Classifications

  • Processes for mixing polymers · CPC title

  • Solid polymers with solid and/or liquid additives · CPC title

  • Copolymers of styrene (C08J2329/08, C08J2335/06, C08J2355/02 take precedence) · CPC title

  • Characterised by the use of natural rubber · CPC title

  • Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids · CPC title

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What does patent US2016333153A1 cover?
There are provided a method of manufacturing a three-dimensional structure, and three-dimension formation composition, by each which a three-dimensional structure can be manufactured with high dimensional accuracy, and provided a three-dimensional structure manufactured with high dimensional accuracy. There is provided a method of manufacturing a three-dimensional structure, in which the …
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification C08J5/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Nov 17 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).